Resolve all your workaday questions with the PCB answer book.Defining the best in printed circuit board design and technology and unparalleled in thoroughness and reliability, Coombs' PRINTED CIRCUITS HANDBOOK, Fifth Edition provides definitive coverage of every facet of printed circuit assemblies, from design methods to manufacturing processes. This new edition of the most trusted guide to pcbs gives you: * Exhaustive coverage of HDI (High Density Interconnect) technologies including design, material, microvia fabrication, sequential lamination, assembly, testing, and reliability* Coverage of fabrication developments including: blind and buried vias, controlled depth drilling, direct imaging, horizontal and pulse plating* Thorough examination of base materials, including traditional and alternative laminates* Understanding of effective quality and reliability programs, including: test & inspection, acceptability criteria, reliability of boards and assemblies, process capability and control* Full treatment of multi-layer and flexible printed circuit design, fabrication and assembly advanced single- and multi-chip component packaging* Contributions from pros at Motorola, Cisco, and other major companies* Included CD-ROM, with the entire book in searchable format* Hundreds of illustrations and instant-access tables, and formulas
The bible of printed circuit board (PCB) technology. A definitive reference source on the design, selection and operation of AC and refrigeration systems. Previous edition c1996. CD-ROM included. PART 1: INTRODUCTION TO PRINTED CIRCUITS Chapter 1: Electronic Packaging and High-Density Interconnectivity Chapter 2: Semiconductor Packaging Technology Chapter 3: Advanced Packaging Chapter 4: Types of Printed Wiring Boards PART 2: MATERIALS Chapter 5: Introduction to Base Materials Chapter 6: Base Material Components Chapter 7: Base Material Manufacturing Processes Chapter 8: Properties of Base Materials Chapter 9: Densification Issues for Base Materials Chapter 10: Introducing Base Materials into the PCB Manufacturing Process Chapter 11: HDI Microvia Materials Chapter 12: Laminate Qualification and Testing PART 3: ENGINEERING AND DESIGN Chapter 13: Physical Characteristics of PCB Chapter 14: The PCB Design Process Chapter 15: Electrical and Mechanical Design Parameters Chapter 16: Controlled Impedance Chapter 17: Multilayer Design Issues Chapter 18: Planning for Design, Fabrication, and Assembly Chapter 19: Manufacturing Information Documentation and Transfer Chapter 20: Electronic Contract Manufacturing Supplier Selection and Management PART 4: HIGH-DENSITY INTERCONNECT Chapter 21: Introduction to High-Density Interconnection Technology Chapter 22: High-Density Interconnect-Build-up Technologies Chapter 23: Microvia Hole Technologies PART 5: FABRICATION PROCESSES Chapter 24. Drilling Processes Chapter 25. High-Density Interconnect Drilling Chapter 26. Imaging Chapter 27. Multilayer Materials and Processing Chapter 28. Preparing Boards for Plating Chapter 29. Electroplating Chapter 30. Direct Plating Chapter 31. PWB Manufacture Using Fully Electroless Copper Chapter 32. Surface Finishes Chapter 33. Etching Process and Technologies Chapter 34. Solder Resist Material and Processes Chapter 35. Machining and Routing Chapter 36. Process Capability and Control Chapter 37. Bare Board Test Objectives and Definitions Chapter 38. Bare Board Test Methods Chapter 39. Bare Board Test Equipment Chapter 40. HDI Bare Board Special Testing Methods PART 6: ASSEMBLY Chapter 41. Assembly Processes PART 7: SOLDERING Chapter 42. Design for Soldering and Solderability Chapter 43. Solder Materials and Processes Chapter 44. No-Clean Assembly Process Chapter 45. Lead-Free Soldering Chapter 46. Fluxes and Cleaning Chapter 47. Press-Fit Connections PART 8: QUALITY CONTROL AND RELIABILITY Chapter 48. Acceptability of Fabricated Boards Chapter 49. Acceptability of Printed Circuit Board Assemblies Chapter 50. Assembly Inspection Chapter 51. Design for Testing Chapter 52. Loaded Board Testing Chapter 53. Reliability of Printed Circuit Assemblies Chapter 54. Component-to-PWB Reliability PART 9: ENVIRONMENTAL ISSUES AND WASTE TREATMENT Chapter 55. Process Waste Minimization and Treatment PART 10: FLEXIBLE CIRCUITS Chapter 56. Flexible Circuits: Applications and Materials Chapter 57. Design of Flexible Circuits Chapter 58. Manufacturing of Flexible Circuits Chapter 59. Termination of Flexible Circuits Chapter 60. Special Constructions of Flexible Circuits Chapter 61. Quality Assurance of Flexible Circuits Appendix
Clyde F. Coombs Jr., is one of the best-selling editors in professional publishing. He developed and edited four editions of the Printed Circuits Handbook, the Electronic Instrument Handbook, the Communications and Network Test and Measurement Handbook, three of McGraw-Hill’s top-selling technical handbooks. An experienced electronics engineer and manager, he is currently semi-retired from Hewlett-Packard and living in Los Altos, California.
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