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Preface to the Second Edition | p. vii |
Preface | p. ix |
Acknowledgments | p. xi |
Author | p. xiii |
Introduction | p. 1 |
Interconnection technology | p. 5 |
Jointing | p. 6 |
Discrete wiring | p. 11 |
Cables | p. 12 |
Connectors | p. 15 |
Printed circuits | p. 18 |
Printed circuit assembly | p. 24 |
Rework and repair | p. 25 |
Case study: A temperature controller | p. 26 |
Summary | p. 29 |
Problems | p. 30 |
Integrated circuits | p. 31 |
Review of semiconductor theory | p. 33 |
Integrated-circuit fabrication | p. 35 |
Semiconductor packaging | p. 43 |
Handling of semiconductor devices | p. 45 |
Custom integrated circuits | p. 46 |
Summary | p. 50 |
Problems | p. 51 |
Power sources and power supplies | p. 53 |
Energy sources | p. 54 |
Batteries | p. 55 |
Power supplies | p. 60 |
Summary | p. 74 |
Problems | p. 74 |
Passive electronic components | p. 77 |
Passive component characteristics | p. 77 |
Resistors | p. 83 |
Capacitors | p. 87 |
Inductors | p. 91 |
Summary | p. 92 |
Problems | p. 93 |
Instruments and measurement | p. 95 |
Quantities to be measured | p. 96 |
Voltage and current measurement | p. 98 |
Frequency and time measurement | p. 101 |
Waveforms - The oscilloscope | p. 104 |
Summary | p. 109 |
Problems | p. 110 |
Heat management | p. 111 |
Heat transfer | p. 112 |
Thermal resistance | p. 113 |
Heat sinking | p. 114 |
Forced cooling | p. 119 |
Advanced heat-removal techniques | p. 120 |
Summary | p. 121 |
Problems | p. 122 |
Parasitic electrical and electromagnetic effects | p. 123 |
Parasitic circuit elements | p. 123 |
Distributed-parameter circuits | p. 128 |
Electromagnetic interference | p. 133 |
Applications studies | p. 142 |
Summary | p. 149 |
Problems | p. 150 |
Reliability and maintainability | p. 153 |
Failure | p. 154 |
The "bathtub" curve | p. 155 |
Measures of reliability and maintainability | p. 156 |
High-reliability systems | p. 162 |
Maintenance | p. 165 |
Summary | p. 168 |
Problems | p. 168 |
Environmental factors and testing | p. 171 |
Environmental factors | p. 171 |
Type testing | p. 178 |
Electronic production testing | p. 180 |
Summary | p. 184 |
Problems | p. 185 |
Safety | p. 187 |
Electric shock | p. 188 |
Other safety hazards | p. 194 |
Design for safety | p. 195 |
Summary | p. 198 |
References | p. 201 |
Answers to problems | p. 203 |
Index | p. 205 |
Table of Contents provided by Ingram. All Rights Reserved. |
The New copy of this book will include any supplemental materials advertised. Please check the title of the book to determine if it should include any access cards, study guides, lab manuals, CDs, etc.
The Used, Rental and eBook copies of this book are not guaranteed to include any supplemental materials. Typically, only the book itself is included. This is true even if the title states it includes any access cards, study guides, lab manuals, CDs, etc.