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Related Topics: Technology >> Electricity
Electronic Materials and Processes Handbook,9780071402149
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Electronic Materials and Processes Handbook


Edition: 3rd
Author(s): Harper, Charles A.
ISBN10:  0071402144
ISBN13:  9780071402149
Format:  Hardcover
Pub. Date:  8/7/2003
Publisher(s): McGraw-Hill Professional

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SummaryTable of ContentsAuthor Biography
Electronic materials are the actual semiconductors, plastics, metals and ceramics that make up the chips and packages from which we construct today’s cell phones, palmtops, and PDAs. The switch in applications from PCs to smaller communications devices has driven the micro-miniaturization trend in electronics, which in turn has created a new set of challenges in creating materials to meet their specifications. This new edition, the first update of the handbook since 1993, is a complete rewrite, reflecting the great importance of engineering materials for thermal management and flexibility and micro-miniature sizes. This new handbook will be an invaluable tool to anyone working electronic packaging, fabrication, or assembly design.

Handbook covers basic electronic materials and processes: such as semiconductors; plastics, elastomers, and composites; ceramics, glasses, and diamonds; and more. Updated to address modern technologies such as cell phones, PDAs, and palmtops. Previous ed: c1994. DLC: Electronics--Materials--Handbooks, manuals, etc.

Chapter 1: Development and Fabrication of IC Chips

Chapter 2: Plastics, Elastomers, and Composites

Chapter 3: Ceramics and Glasses

Chapter 4: Metals

Chapter 5: Solder Technologies for Electronic Packaging and Assembly

Chapter 6: Electroplating and Deposited Metallic Coatings

Chapter 7: Printed Circuit Board Fabrication

Chapter 8: Materials and Processes for Hybrid Microelectronics and Multichip Modules

Chapter 9: Adhestives Underfills, and Coatings in Electronics Assemblies

Chapter 10: Thermal Management Materials and Systems

Index

Charles A. Harper is President of Technology Seminars, Inc., of Lutherville, Maryland, an organization dedicated to presentation of educational seminars in the field of electronic packaging and materials. He has authored over a dozen well known books in the field and is among the founders and past presidents of the International Microelectronics and Packaging Society. He is also Series Editor for the McGraw-Hill Electronic Packaging and Interconnection Series. Mr. Harper is a graduate of The Johns Hopkins School of Engineering, where he also served as Adjunct Professor.

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