| Contributors |
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xiii | |
| Preface to the Second Edition |
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xv | |
| Part 1 The Technology |
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Optical Fiber, Cable, and Connectors |
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3 | (38) |
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3 | (13) |
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Optical Fiber Characterization |
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16 | (10) |
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26 | (3) |
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29 | (3) |
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Optical Fiber Bragg Gratings |
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32 | (9) |
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38 | (3) |
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Optical Sources: Light-Emitting Diodes and Laser Technology |
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41 | (48) |
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41 | (1) |
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42 | (8) |
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50 | (2) |
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52 | (37) |
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80 | (9) |
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Detectors for Fiber Optics |
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89 | (38) |
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Carolyn J. Sher DeCusatis |
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89 | (1) |
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Detector Terminology and Characteristics |
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90 | (5) |
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95 | (3) |
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98 | (8) |
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106 | (13) |
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119 | (5) |
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124 | (3) |
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125 | (2) |
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Logic and Drive Circuitry |
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127 | (16) |
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127 | (4) |
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131 | (1) |
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132 | (11) |
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143 | (16) |
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Function of the Optical Subassembly |
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143 | (1) |
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Basic Properties of the Transmitter OSA |
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144 | (1) |
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Basic Properties of the Receiver OSA |
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145 | (1) |
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Coupling Radiation from a Laser Diode into a Fiber |
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146 | (4) |
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Coupling Radiation from a Fiber into a Photodetector |
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150 | (2) |
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Packaging of Optical Subassemblies |
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152 | (2) |
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Optical Subassemblies for Parallel Optical Links |
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154 | (2) |
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156 | (3) |
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158 | (1) |
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159 | (58) |
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159 | (9) |
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Technical Description of Fiber Optic Transceivers |
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168 | (5) |
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173 | (9) |
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Noise Testing of Transceivers |
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182 | (7) |
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Packaging of Transceivers (TRX) |
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189 | (6) |
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Series Production of Transceivers |
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195 | (6) |
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Transceivers Today and Tomorrow |
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201 | (6) |
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207 | (10) |
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213 | (4) |
| Part 2 The Links |
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Fiber Optic Link Requirements |
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217 | (75) |
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217 | (12) |
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229 | (29) |
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Link Planning Considerations |
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258 | (34) |
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Contact Information for Optoelectronics and Fiber Optics Information |
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276 | (9) |
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Some Accredited Homologation Test Labs |
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285 | (2) |
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287 | (5) |
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Planning and Building the Optical Link |
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292 | (41) |
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292 | (1) |
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293 | (17) |
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310 | (10) |
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Handling and Installing Fiber Optics |
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320 | (13) |
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332 | (1) |
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Testing Fiber Optic Local Area Networks (LANs) |
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333 | (34) |
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Fiber Optic Testing Defined |
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333 | (2) |
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335 | (3) |
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338 | (1) |
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Standardization of Testing Procedures |
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339 | (1) |
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Fiber Optic Test Equipment Needed for Testing |
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339 | (2) |
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341 | (1) |
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342 | (2) |
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344 | (2) |
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346 | (2) |
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Troubleshooting Hints for the Cable Plant |
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348 | (1) |
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Special Test Considerations for Gigabit Multimode Networks |
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348 | (4) |
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Cable Plant Loss with Laser Sources |
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352 | (1) |
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Bit Error Ratio Measurements |
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353 | (3) |
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Characterizing Digital Communications Waveforms |
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356 | (5) |
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Testing and Troubleshooting Networks |
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361 | (2) |
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Transceiver Loopback Testing |
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363 | (1) |
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363 | (4) |
| Pact 3 The Applications |
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Introduction to Industry Standards |
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367 | (12) |
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367 | (2) |
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Why Are International Standards Needed? |
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369 | (1) |
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370 | (1) |
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370 | (4) |
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IEEE 802.3z (Gigabit Ethernet) |
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374 | (5) |
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Intramachine Communications |
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379 | (56) |
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379 | (2) |
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Current Intramachine Optics Applications |
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381 | (2) |
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383 | (6) |
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SAN Physical Layer Technology Requirements |
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389 | (4) |
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Copper vs Optical: Technology Trade-Offs |
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393 | (5) |
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Parallel Optical Interconnect Hardware |
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398 | (21) |
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Examples of Parallel Optical Interconnect Links |
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419 | (12) |
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431 | (4) |
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432 | (3) |
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Applications: Asynchronous Transfer Mode and Synchronous Optical Network |
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435 | (29) |
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435 | (6) |
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441 | (9) |
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450 | (14) |
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463 | (1) |
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464 | (42) |
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464 | (1) |
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465 | (33) |
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498 | (1) |
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How Fibre Channel Leverages Optical Data Communications |
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498 | (5) |
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503 | (3) |
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Web Resources and References |
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503 | (3) |
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Enterprise Systems Connection Fiber Optic Link |
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506 | (58) |
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506 | (2) |
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508 | (7) |
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515 | (8) |
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523 | (6) |
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Single-Mode Physical Layer |
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529 | (6) |
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Planning and Installation of an ESCON Link |
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535 | (11) |
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546 | (5) |
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551 | (5) |
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556 | (8) |
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562 | (2) |
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Local Area Networks, Fiber Distributed Data Interface, Ethernet, and Token Ring |
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564 | (39) |
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564 | (1) |
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565 | (6) |
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571 | (1) |
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572 | (15) |
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587 | (11) |
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598 | (5) |
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599 | (4) |
| Part 4 The Manufacturing Technology |
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Semiconductor Laser and Light-Emitting Diode Fabrication |
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603 | (52) |
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603 | (1) |
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603 | (2) |
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605 | (11) |
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616 | (26) |
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642 | (13) |
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644 | (11) |
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Receiver, Laser Driver, and Phase-Locked Loop Design Issues |
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655 | (20) |
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655 | (1) |
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655 | (3) |
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658 | (6) |
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664 | (9) |
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673 | (2) |
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673 | (2) |
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Packaging Assembly Techniques |
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675 | (24) |
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Packaging Assembly - Overview |
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675 | (2) |
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First-Level Interconnects |
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677 | (11) |
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688 | (4) |
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692 | (3) |
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695 | (4) |
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698 | (1) |
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Alignment Metrology and Techniques |
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699 | (36) |
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699 | (1) |
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Interface Definition and Importance |
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699 | (2) |
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701 | (2) |
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Elements of Coupled Power |
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703 | (12) |
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715 | (15) |
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730 | (5) |
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732 | (3) |
| Appendix A Measurement Conversion Tables |
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735 | (2) |
| Appendix B Physical Constants |
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737 | (1) |
| Appendix C Index of Professional Organizations |
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738 | (2) |
| Appendix D OSI Model |
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740 | (1) |
| Appendix E Network Standards and Documents |
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741 | (3) |
| Appendix F Data Network Rates |
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744 | (10) |
| Appendix G Other Datacom Developments |
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754 | (5) |
| Acronyms |
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759 | (19) |
| Glossary |
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778 | (25) |
| Index |
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803 | |