| Contributors |
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xi | |
| Preface |
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xiii | |
| Part 1 Technology Advances |
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3 | (29) |
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Earliest Civilization to the Printing Press |
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3 | (2) |
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The Next 500 Years: Printing Press to Year 2000 |
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5 | (4) |
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Fiber Optic Communication Advancement, 1950-2000 |
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9 | (8) |
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Communication Storage and Retrieval |
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17 | (5) |
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Future of Fiber Optic Communications, 2000-2050 |
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22 | (10) |
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31 | (1) |
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Market Analysis and Business Planning |
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32 | (31) |
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32 | (1) |
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The Need for Applications |
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32 | (1) |
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Supporting Technology Infrastructure |
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33 | (1) |
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Implementing a Market Survey |
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34 | (3) |
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37 | (4) |
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41 | (22) |
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Appendix: Market Analysis on a Transmitter Optical Subassembly |
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42 | (1) |
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Industry Description and Outlook |
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42 | (3) |
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World Fiber Optics Industry |
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45 | (3) |
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48 | (10) |
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58 | (2) |
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60 | (1) |
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61 | (1) |
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62 | (1) |
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Small Form Factor Fiber Optic Connectors |
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63 | (26) |
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63 | (1) |
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64 | (4) |
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68 | (3) |
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71 | (3) |
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74 | (3) |
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Other Types of SFF Connectors |
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77 | (2) |
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79 | (1) |
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80 | (9) |
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87 | (2) |
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Specialty Fiber Optic Cables |
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89 | (45) |
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89 | (1) |
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Fabrication of Conventional Fiber Cables |
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89 | (9) |
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98 | (13) |
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Polarization Controlling Fibers |
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111 | (3) |
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Dispersion Controlling Fibers |
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114 | (5) |
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119 | (1) |
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120 | (3) |
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123 | (2) |
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125 | (9) |
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131 | (3) |
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Optical Wavelength Division Multiplexing for Data Communication Networks |
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134 | (82) |
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Introduction and Background |
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134 | (6) |
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140 | (30) |
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170 | (22) |
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Intelligent Optical Internetworking |
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192 | (15) |
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Future Directions and Conclusions |
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207 | (9) |
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211 | (5) |
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Optical Backplanes, Board and Chip Interconnects |
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216 | (54) |
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216 | (3) |
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Frame-to-Frame Interconnections |
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219 | (11) |
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230 | (11) |
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Optical Board Interconnects |
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241 | (5) |
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Optical Chip Interconnections |
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246 | (9) |
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255 | (15) |
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256 | (14) |
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Parallel Computer Architectures Using Fiber Optics |
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270 | (33) |
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270 | (4) |
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Historical and Current Processors |
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274 | (9) |
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Detailed Architecture Descriptions |
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283 | (13) |
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Optically Interconnected Parallel Supercomputers |
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296 | (2) |
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298 | (5) |
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299 | (4) |
| Part 2 The Future |
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Packaging Assembly Techniques |
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303 | (18) |
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Packaging Assembly --- Overview |
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303 | (12) |
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Optoelectronic Packaging Overview |
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315 | (1) |
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Component Level Optoelectronic Packaging |
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316 | (1) |
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Module Level Optoelectronic Packaging |
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317 | (1) |
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System Level Optoelectronic Packaging |
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318 | (3) |
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320 | (1) |
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InfiniBand---The Interconnect from Backplane to Fiber |
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321 | (31) |
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321 | (1) |
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322 | (4) |
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Optical Signal and Jitter Methodology |
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326 | (8) |
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334 | (11) |
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Optical Receptacle and Connector |
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345 | (4) |
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Fiber Optic Cable Plant Specifications |
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349 | (3) |
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351 | (1) |
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New Devices for Optoelectronics: Smart Pixels |
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352 | (70) |
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353 | (1) |
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Multiple Quantum Well Devices |
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354 | (5) |
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359 | (16) |
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375 | (6) |
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381 | (28) |
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Future Trends and Directions |
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409 | (13) |
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410 | (12) |
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Emerging Technology for Fiber Optic Data Communication |
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422 | (25) |
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422 | (2) |
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Architecture of All-Optical Network |
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424 | (2) |
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426 | (3) |
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429 | (4) |
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433 | (3) |
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Wavelength Multiplexer/Demultiplexer |
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436 | (1) |
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437 | (3) |
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440 | (3) |
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443 | (4) |
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443 | (4) |
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447 | (39) |
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Customer Requirements --- Trends |
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447 | (3) |
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Manufacturing Requirements --- Trends |
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450 | (29) |
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Manufacturing Alternatives |
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479 | (7) |
| Appendix A Measurement Conversion Tables |
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486 | (2) |
| Appendix B Physical Constants |
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488 | (1) |
| Appendix C Index of Professional Organizations |
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489 | (2) |
| Appendix D OSI Model |
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491 | (1) |
| Appendix E Network Standards and Documents |
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492 | (3) |
| Appendix F Data Network Rates |
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495 | (10) |
| Appendix G Other Datacom Developments |
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505 | (6) |
| Acronyms |
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511 | (18) |
| Glossary |
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529 | (26) |
| Index |
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555 | |