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Thermal Design of Electronic Equipment,9780849300820
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Thermal Design of Electronic Equipment


Author(s): Remsburg, Ralph
ISBN10:  0849300827
ISBN13:  9780849300820
Format:  Hardcover
Pub. Date:  9/27/2000
Publisher(s): CRC

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SummaryTable of Contents
Presents empirical formulas and techniques specifically targeted for electronic packaging and thermal engineering. Provides a reference for formulas and requires only a knowledge of algebra. DLC: Electronic apparatus and appliances--Thermal properties.
Introduction to Thermal Design of Electronic Equipment
1(18)
Introduction to the Modes of Heat Transfer in Electronic Equipment
1(5)
Convection
1(1)
Conduction
2(1)
Radiation
3(1)
Practical Thermal Resistances
4(2)
Theoretical Power Dissipation in Electronic Components
6(7)
Theoretical Power Dissipation
6(1)
Heat Generation in Active Devices
7(1)
CMOS Devices
7(1)
Junction FET
7(1)
Power MOSFET
8(1)
Heat Generated in Passive Devices
9(1)
Interconnects
9(2)
Resistors
11(1)
Capacitors
11(1)
Inductors and Transformers
12(1)
Thermal Engineering Software for Personal Computers
13(6)
Commercial CFD Codes
15(1)
Flotherm v2.2
16(1)
References
16(3)
Formulas for Conductive Heat Transfer
19(66)
Conduction in Electronic Equipment: Introduction
19(1)
Thermal Conductivity
20(1)
Thermal Resistances
20(1)
Conductivity in Solids
21(1)
Conductivity in Fluids
21(1)
Conduction---Steady State
21(36)
Conduction in Simple Geometries
21(1)
Conduction through a Plane Wall
22(5)
Conduction through Cylinders and Spheres
27(3)
Plane Wall with Heat Generation
30(1)
Cylinders and Spheres with Heat Generation
31(5)
Critical Radius of a Cylinder
36(6)
Conduction in Complex Geometries
42(5)
Multidimensional Analytic Method
47(2)
Multidimensional Graphical Method
49(1)
Multidimensional Shape Factor Method
50(3)
Finite Difference Method
53(2)
Resistance-Capacitance Networks
55(2)
Conduction-Transient
57(7)
Lumped Capacitance Method
60(3)
Application of the Lumped Capacitance Method
63(1)
Conduction in Extended Surfaces
64(9)
Fin Efficiency
65(4)
Fin Optimization
69(3)
Fin Surface Efficiency
72(1)
Thermal Contact Resistance in Electronic Equipment Interfaces
73(4)
Simplified Contact Resistance Model
73(1)
Geometry of Contacting Surfaces
74(1)
Contact Resistance in a Typical Application
75(2)
Discrete Heat Sources and Thermal Spreading
77(8)
References
82(3)
Fluid Dynamics for Electronic Equipment
85(104)
Introduction
85(1)
Hydrodynamic Properties of Fluids
85(4)
Compressibility
85(1)
Viscosity
86(2)
Surface Tension
88(1)
Fluid Statics
89(2)
Relationship of Pressure, Density, and Height
89(2)
Fluid Dynamics
91(2)
Streamlines and Flowfields
91(1)
One-, Two-, and Three-Dimensional Flowfields
92(1)
Incompressible Ideal Fluid Flow
93(6)
One-Dimensional Flow
94(1)
One-Dimensional Euler Equation
94(1)
One-Dimensional Bernoulli Equation
95(1)
Application of the One-Dimensional Equations
95(1)
Two-Dimensional Flow
96(1)
Application of the Two-Dimensional Equations
96(3)
Incompressible Real Fluid Flow
99(23)
Laminar Flow
99(5)
Turbulence and the Reynolds Number
104(11)
Boundary Layer Theory
115(5)
Turbulent Flow
120(2)
Loss Coefficients and Dynamic Drag
122(28)
Expansions
122(2)
Contractions
124(10)
Tube Bends
134(3)
Manifolds
137(5)
Screens, Grills, and Perforated Plates
142(2)
Rough Surface Conduits
144(6)
Jets
150(23)
Fans and Pumps
173(7)
Fans
175(4)
Fan Operation at Nonstandard Densities
179(1)
Pumps
179(1)
Electronic Chassis Flow
180(9)
References
182(7)
Convection Heat Transfer in Electronic Equipment
189(90)
Introduction
189(1)
Fluid Properties
189(2)
Properties of Air
190(1)
Boundary Layer Theory
191(3)
Dimensionless Groups
194(8)
Forced Convection
202(43)
Forced Convection Laminar Flow
207(1)
Forced Convection Laminar Flow in Tubes
208(1)
Forced Convection Turbulent Flow
209(1)
Forced Convection Turbulent Flow in Tubes
210(2)
Forced Convection Flow through Noncircular Tube Geometries
212(1)
Forced Convection Flow through Tubes with Internal Fins
213(3)
Forced Convection External Flow
216(1)
Laminar Forced Convection along Flat Plates
217(2)
Turbulent Forced Convection along Flat Plates
219(1)
Mixed Boundary Layer Forced Convection along Flat Plates
220(1)
Forced Convection Flow over Cylinders
220(7)
Forced Convection Flow over Spheres
227(3)
Forced Convection Flow over Complex Bodies
230(1)
Forced Convection Flow along a Populated Circuit Board
230(4)
Forced Convection Flow through Pin-Fin Arrays
234(8)
Jet Impingement Forced Convection
242(3)
Natural Convection
245(34)
Natural Convection Flow along Flat Plates
247(4)
Natural Convection Cooling Using Vertical Fins
251(4)
Natural Convection along Nonvertical Surfaces
255(5)
Natural Convection in Sealed Enclosures
260(5)
Natural Convection in Complex Geometries
265(1)
Natural Convection across Horizontal Cylinders
265(2)
Natural Convection along Vertical Cylinders
267(1)
Natural Convection across Spheres
268(1)
Natural Convection across Cones
269(1)
Natural Convection across Horizontal Corrugated Plates
270(1)
Natural Convection across Arbitrary Shapes
270(1)
Natural Convection through U-Shaped Channels
271(1)
Natural Convection through Pin-Fin Arrays
272(2)
References
274(5)
Radiation Heat Transfer in Electronic Equipment
279(28)
Introduction
279(1)
The Electromagnetic Spectrum
279(1)
Radiation Equations
280(3)
Stefan-Boltzmann Law
282(1)
Surface Characteristics
283(11)
Emittance
285(3)
Emittance Factor
288(1)
Emittance from Extended Surfaces
288(4)
Absorptance
292(1)
Reflectance
293(1)
Specular Reflectance
294(1)
Transmittance
294(1)
View Factors
294(9)
Calculation of Estimated Diffuse View Factors
296(7)
Environmental Effects
303(4)
Solar Radiation
303(1)
Atmospheric Radiation
304(1)
References
305(2)
Heat Transfer with Phase Change
307(36)
Introduction
307(2)
Definitions of Phase Change Parameters
308(1)
Dimensionless Parameters in Boiling and Condensation
309(1)
Modes of Boiling Liquids
310(19)
Bubble Phenomenon
311(4)
Pool Boiling
315(1)
Pool Boiling Curve
316(2)
Pool Boiling Correlations
318(2)
Pool Boiling Critical Heat Flux Correlations
320(4)
Pool Boiling Minimum Heat Flux Correlations
324(1)
Pool Boiling Vapor Film Correlations
324(1)
Flow Boiling
325(1)
External Forced Convection Boiling
326(1)
Internal Forced Convection Boiling
327(2)
Evaporation
329(5)
Condensation
334(4)
Melting and Freezing
338(5)
References
339(4)
Combined Modes of Heat Transfer for Electronic Equipment
343(8)
Introduction
343(1)
Conduction in Series and in Parallel
343(3)
Conduction and Convection in Series
346(2)
Radiation and Convection in Parallel
348(1)
Overall Heat Transfer Coefficient
348(3)
Appendix 351(12)
Index 363

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