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Guide to State-of-the-Art Electron Devices,9781118347263
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Guide to State-of-the-Art Electron Devices



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Wiley-IEEE Press
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Concise, high quality and comparative overview of state-of-the-art electron device development, manufacturing technologies and applications Electron Devices marks the 60th anniversary of the IRE electron devices committee and the 35th anniversary of the IEEE Electron Devices Society, as such it defines the state-of-the-art of electron devices, as well as future directions across the entire field. Spans full range of electron device types such as photovoltaic devices, semiconductor manufacturing and VLSI technology and circuits, covered by IEEE Electron and Devices Society Contributed by internationally respected members of the electron devices community A timely desk reference with fully-integrated colour and a unique lay-out with sidebars to highlight the key terms Discusses the historical developments and speculates on future trends to give a more rounded picture of the topics covered A valuable resource R&D managers; engineers in the semiconductor industry; applied scientists; circuit designers; Masters students in power electronics; and members of the IEEE Electron Device Society.

Table of Contents



Contributors and Acknowledgements

Historic Timeline

Part I – Basic Electron Devices

1 Bipolar Transistors

1.1 Motivation

1.2 The pn Junction and Its Electronic Applications

1.3 The Bipolar Junction Transistor and Its Electronic Applications

1.4 Optimization of Bipolar Transistors

1.5 SiGe Heterojunction Bipolar Transistors


2 MOS Devices

2.1 Introduction

2.2 MOSFET Basics

2.3 The Evolution of MOSFET

2.4 Concluding Remarks


3 Memory Devices

3.1 Introduction

3.2 Volatile Memories

3.3 Non-Volatile Memories

3.4 Future Perspectives of MOS Memories

3.5 Closing Remarks


4 Passive Components

4.1 Discrete and integrated passive components

4.2 Application in Analog ICs and DRAM

4.3 The planar Spiral Inductor – A Case Study

4.4 Parasitics in Integrated Circuits


5 Emerging Research Devices

5.1 Non-Charge Based Switching

5.2 Carbon as a Replacement for Silicon and the Rise of Moletronics

5.3 Conclusions



Part II – Aspects of Device and IC Manufacturing

6 Electronics Materials

6.1 Introduction

6.2 Silicon Device Technology

6.3 Compound Semiconductor Devices

6.4 Electronic Displays

6.5 Conclusions


7 Compact Modeling

7.1 The Role of Compact Models

7.2 Bipolar Transistor Compact Modeling

7.3 MOS Transistor Compact Modeling

7.4 Compact Modeling of Passive Components

7.5 Benchmarking and Implementation


8 Technology Computer Aided Design

8.1 Introduction

8.2 Drift-Diffusion Model

8.3 Microscopic Transport Models

8.4 Quantum Transport Models

8.5 Process and Equipment Simulation


9 Device Reliability Physics

9.1 Introduction and  Background

9.2 Device Reliability Issues

9.3 Interconnect Degradation Mechanisms

9.4 Circuit-Level Reliability Issues

9.5 Microscopic Approaches to Assuring Reliability of ICs


10 Semiconductor Manufacturing

10.1 Introduction

10.2 Substrates

10.3 Lithography and Etching

10.4 Front-End Processing

10.5 Back-End Processing

10.6 Process Control

10.7 Assembly and Test

10.8 Future Directions


Part III – Applications based on Electron Devices

11 VLSI Logic Technology and Circuits

11.1 Introduction

11.2 MOSFET Scaling Trends

11.3 Low-Power and High-Speed Logic Design

11.4 Scaling-Driven technology Enhancements

11.5 Ultra-Low Voltage Transistors

11.6 Interconnects

11.7 Memory Design

11.8 System Integration


12 VLSI Mixed-Signal Technology And Circuits

12.1 Introduction

12.2 Analog/Mixed-Signal Technologies in Scaled CMOS

12.3 Data Converter ICs

12.4 Mixed-Signal Circuits in Low-Power Display Applications

12.5 Image Sensor Technology and Circuits


13 Memory Technologies

13.1 Semiconductor Memory History

13.2 State of Mainstream Semiconductor Memory Today

13.3 Emerging Memory Technologies

13.4 Conclusions


14 RF&Microwave Semiconductor Technologies

14.1 III-V Based: GaAs and InP

14.2 Si and SiGe

14.3 Wide Bandgap Devices (Group III-Nitrides, SiC and Diamond)


15 Power Devices and ICs

15.1 Overview of Power Devices & ICs

15.2 Two-Carrier and High-Power Devices

15.3 Power MOSFET Devices

15.4 High-Voltage and Power ICs

15.5 Wide Bandgap Power Devices


16 Photovoltaic Device Applications

16.1 Introduction

16.2 Silicon Photovoltaics

16.3 Polycrystalline Thin-Film Photovoltaics

16.4 III-V Compound Photovoltaics

16.5 Future Concepts in Photovoltaics


17 Large Area Electronics

17.1 Thin-Film Solar Cells

17.2 Large-Area Imaging

17.3 Flat-Panel Displays


18 Microelectromechanical Systems (MEMS)

18.1 Introduction

18.2 The 1960’s – First Micromachined Structures Envisioned

18.3 The 1970’s – Integrated Sensors Started

18.4 The 1980’s – Surface Micromachining Emerged

18.5 The 1990’s – MEMS Impacted Various Fields

18.6 The 2000’s – Diversified Sophisticated Systems Enabled By MEMS

18.7 Future Outlook


19 Vacuum Device Applications

19.1 Traveling-Wave Devices

19.2 Klystrons

19.3 Inductive Output Tubes

19.4 Crossed-Field Devices

19.5 Gyro-Devices


20 Optoelectronic Device Applications

20.1 Introduction

20.2 Light Emission in Semiconductors

20.3 Photodetectors

20.4 Integrated Optoelectronics

20.5 Optical Interconnects

20.6 Concluding Remarks


21 Devices for the Post Silicon CMOS Era

21.1 Introduction

21.2 Devices for the 8-nm Node With Conventional Materials

21.3 New Channel Materials and Devices

21.4 Concluding Remarks



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