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Materials, Processes, Integration and Reliability in Advanced Interconnects for Micro- and Nanoelectronics: Symposium Held April 10-12, 2007, San Francisco, California, U.s.a.
ISBN13:by Lin, Qinghuang; Ryan, E. Todd; Wu, Wen-li; Yoon, Do Yeung
Cambridge Univ Pr
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This is the edition with a publication date of 6/5/2014.
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