Nanoscale CMOS VLSI Circuits: Design for Manufacturability

by Kundu, Sandip; Sreedhar, Aswin

• ISBN13: 9780071635196
• ISBN10: 007163519X
• Edition: 1st
• Format: Hardcover
• Copyright: 2010-07-08
• Publisher: McGraw-Hill Education

Summary

Cutting-edge Design for Manufacturability Techniques for Nanoscale CMOS VLSI Circuits Covering defect analysis, equipment, and lithographic control evaluations, this book offers a holistic approach for VLSI circuit designers to evaluate and analyze IC circuit designs from the manufacturability point of view. This practical guide is ideal for design engineers, managers, students, and academics interested in understanding the sources of semiconductor chip failures and how these problems can be mitigated through design.

Author Biography

Dr. Sandip Kundu is a professor in the Electrical and Computer Engineering Department at the University of Massachusetts at Amherst, specializing in semiconductor and lithographic manufacturing.

Dr. Aswin Sreedhar is a research assistant at the Electrical and Computer Engineering Department at the University of Massachusetts.

Table of Contents

Preface	p. xiii
Introduction	p. 1
Technology Trends: Extending Moore's Law	p. 1
Device Improvements	p. 3
Silicon on Insulator	p. 4
Multigate Devices	p. 5
Nanodevices	p. 6
Contributions from Material Science	p. 7
Low-K and High-K Dielectrics	p. 7
Strained Silicon	p. 9
Deep Subwavelength Lithography	p. 10
Mask Manipulation Techniques	p. 12
Increasing Numerical Aperture	p. 14
Design for Manufacturability	p. 15
Value and Economics of DFM	p. 15
Variabilities	p. 18
The Need for a Model-Based DFM Approach	p. 23
Design for Reliability	p. 23
Summary	p. 24
References	p. 25
Semiconductor Manufacturing	p. 27
Introduction	p. 27
Patterning Process	p. 28
Photolithography	p. 29
Resist Coat	p. 30
Preexposure (Soft) Bake	p. 30
Mask Alignment	p. 31
Exposure	p. 32
Postexposure Bake (PEB)	p. 32
Development	p. 32
Hard Bake	p. 33
Etching Techniques	p. 33
Wet Etching Techniques	p. 33
Dry Etching Techniques	p. 35
Optical Pattern Formation	p. 36
Illumination	p. 37
Diffraction	p. 40
Imaging Lens	p. 45
Exposure System	p. 47
Aerial Image and Reduction Imaging	p. 48
Resist Pattern Formation	p. 51
Partial Coherence	p. 53
Lithography Modeling	p. 55
Phenomenological Modeling	p. 56
Hopkins Approach to Partially Coherent Imaging	p. 56
Resist Diffusion	p. 57
Simplified Resist Model	p. 57
Sum-of-Coherent-Systems Approach	p. 58
Fully Physical Resist Modeling	p. 59
Summary	p. 60
References	p. 61
Process and Device Variability: Analysis and Modeling	p. 63
Introduction	p. 63
Gate Length Variation	p. 70
Patterning Variations Due to Photolithography	p. 70
Proximity Effects	p. 71
Defocus	p. 74
Lens Aberration	p. 75
Modeling Nonrectangular Gates (NRGs)	p. 80
Line Edge Roughness: Theory and Characterization	p. 82
Gate Width Variation	p. 87
Atomistic Fluctuations	p. 88
Thickness Variation in Metal and Dielectric	p. 91
Stress-Induced Variation	p. 96
Summary	p. 99
References	p. 99
Manufacturing-Aware Physical Design Closure	p. 103
Introduction	p. 103
Control of the Lithographic Process Window	p. 108
Resolution Enhancement Techniques	p. 113
Optical Proximity Correction	p. 114
Subresolution Assist Features	p. 118
Phase Shift Masking	p. 120
Off-Axis Illumination	p. 124
Physical Design for DFM	p. 126
Geometric Design Rules	p. 127
Restrictive Design Rules	p. 127
Model-Based Rules Check and Printability Verification	p. 129
Manufacturability-Aware Standard Cell Design	p. 131
Mitigating the Antenna Effect	p. 135
Placement and Routing for DFM	p. 138
Advanced Lithographic Techniques	p. 141
Double Patterning	p. 142
Inverse Lithography	p. 148
Other Advanced Techniques	p. 153
Summary	p. 153
References	p. 153
Metrology, Manufacturing Defects, and Defect Extraction	p. 157
Introduction	p. 157
Process-Induced Defects	p. 161
Classification of Error Sources	p. 162
Defect Interaction and Electrical Effects	p. 164
Modeling Particle Defects	p. 166
Defining Critical Area and Probability of Failure	p. 167
Critical Area Estimation	p. 169
Particulate Yield Models	p. 172
Layout Methods to Improve Critical Area	p. 173
Pattern-Dependent Defects	p. 175
Pattern-Dependent Defect Types	p. 176
Pattern Density Problems	p. 178
Statistical Approach to Modeling Patterning Defects	p. 179
Case Study: Yield Modeling and Enhancement for Optical Lithography	p. 179
Case Study: Linewidth-Based Yield When Considering Lithographic Variations	p. 181
Layout Methods That Mitigate Patterning Defects	p. 184
Metrology	p. 186
Precision and Tolerance in Measurement	p. 187
CD Metrology	p. 188
Scanning Electron Microscopy	p. 188
Electrical CD Measurement	p. 190
Scatterometry	p. 193
Overlay Metrology	p. 195
Other In-Line Measurements	p. 197
In-Sity Metrology	p. 198
Failure Analysis Techniques	p. 199
Nondestructive Techniques	p. 201
Failure Verification	p. 201
Optical Microscopy	p. 201
X-Ray Radiography	p. 202
Hermeticity Testing	p. 202
Particle Impact Noise Detection	p. 202
Destructive Techniques	p. 203
Microthermography	p. 203
Decapsulation	p. 203
Surface Analysis	p. 203
Summary	p. 204
References	p. 204
Defect Impact Modeling and Yield Improvement Techniques	p. 207
Introduction	p. 207
Modeling the Impact of Defects on Circuit Behavior	p. 209
Defect-Fault Relationship	p. 210
Role of Defect-Fault Models	p. 211
Defect-Based Fault Models	p. 212
Defect-Based Bridging Fault Model	p. 214
Abstract Fault Models	p. 215
Hybrid Fault Models	p. 218
Test Flow	p. 218
Yield Improvement	p. 221
Fault Tolerance	p. 222
Traditional Structural Redundancy Techniques	p. 222
Nonstructural Redundancy Techniques	p. 227
NAND Multiplexing	p. 230
Reconfiguration	p. 231
Comparison of Redundancy-Based Fault Tolerance Techniques	p. 232
Fuses	p. 233
Fault Avoidance	p. 235
Summary	p. 239
References	p. 241
Physical Design and Reliability	p. 243
Introduction	p. 243
Electromigration	p. 247
Hot Carrier Effects	p. 250
Hot Carrier Injection Mechanisms	p. 251
Device Damage Characteristics	p. 253
Time-Dependent Dielectric Breakdown	p. 254
Mitigating HCI-Induced Degradation	p. 255
Negative Bias Temperature Instability	p. 256
Reaction-Diffusion Model	p. 257
Static and Dynamic NBTI	p. 258
Design Techniques	p. 260
Electrostatic Discharge	p. 261
Soft Errors	p. 263
Types of Soft Errors	p. 263
Soft Error Rate	p. 263
SER Mitigation and Correction for Reliability	p. 264
Reliability Screening and Testing	p. 264
Summary	p. 265
References	p. 265
Design for Manufacturability: Tools and Methodologies	p. 269
Introduction	p. 269
DFx in IC Design Flow	p. 270
Standard Cell Design	p. 271
Library Characterization	p. 272
Placement, Routing, and Dummy Fills	p. 274
Verification, Mask Synthesis, and Inspection	p. 275
Process and Device Simulation	p. 275
Electrical DFM	p. 276
Statistical Design and Return on Investment	p. 277
DFM for Optimization Tools	p. 279
DFM-Aware Reliability Analysis	p. 282
DFx for Future Technology Nodes	p. 283
Concluding Remarks	p. 284
References	p. 285
Index	p. 287
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