9780071350167

Coombs' Printed Circuits Handbook

by
  • ISBN13:

    9780071350167

  • ISBN10:

    0071350160

  • Edition: 5th
  • Format: Hardcover
  • Copyright: 2001-08-27
  • Publisher: McGraw-Hill Professional
  • View Upgraded Edition

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Supplemental Materials

What is included with this book?

Summary

* The "bible" of printed circuit board (PCB) technology, revised by Clyde F. Coombs, Jr., the author of the original edition * Describes the processes used to make today's micro-PCBs and shows how they differ from past techniques A definitive reference source on the design, selection and operation of A/C and refrigeration systems

Author Biography

Clyde F. Coombs Jr., is one of the best-selling editors in professional publishing. He developed and edited four editions of the Printed Circuits Handbook, the Electronic Instrument Handbook, the Communications and Network Test and Measurement Handbook, three of McGraw-Hill’s top-selling technical handbooks. An experienced electronics engineer and manager, he is currently semi-retired from Hewlett-Packard and living in Los Altos, California.

Table of Contents

PART 1: INTRODUCTION TO PRINTED CIRCUITS

Chapter 1: Electronic Packaging and High-Density Interconnectivity

Chapter 2: Semiconductor Packaging Technology

Chapter 3: Advanced Packaging

Chapter 4: Types of Printed Wiring Boards

PART 2: MATERIALS

Chapter 5: Introduction to Base Materials

Chapter 6: Base Material Components

Chapter 7: Base Material Manufacturing Processes

Chapter 8: Properties of Base Materials

Chapter 9: Densification Issues for Base Materials

Chapter 10: Introducing Base Materials into the PCB Manufacturing Process

Chapter 11: HDI Microvia Materials

Chapter 12: Laminate Qualification and Testing

PART 3: ENGINEERING AND DESIGN

Chapter 13: Physical Characteristics of PCB

Chapter 14: The PCB Design Process

Chapter 15: Electrical and Mechanical Design Parameters

Chapter 16: Controlled Impedance

Chapter 17: Multilayer Design Issues

Chapter 18: Planning for Design, Fabrication, and Assembly

Chapter 19: Manufacturing Information Documentation and Transfer

Chapter 20: Electronic Contract Manufacturing Supplier Selection and Management

PART 4: HIGH-DENSITY INTERCONNECT

Chapter 21: Introduction to High-Density Interconnection Technology

Chapter 22: High-Density Interconnect-Build-up Technologies

Chapter 23: Microvia Hole Technologies

PART 5: FABRICATION PROCESSES

Chapter 24. Drilling Processes

Chapter 25. High-Density Interconnect Drilling

Chapter 26. Imaging

Chapter 27. Multilayer Materials and Processing

Chapter 28. Preparing Boards for Plating

Chapter 29. Electroplating

Chapter 30. Direct Plating

Chapter 31. PWB Manufacture Using Fully Electroless Copper

Chapter 32. Surface Finishes

Chapter 33. Etching Process and Technologies

Chapter 34. Solder Resist Material and Processes

Chapter 35. Machining and Routing

Chapter 36. Process Capability and Control

Chapter 37. Bare Board Test Objectives and Definitions

Chapter 38. Bare Board Test Methods

Chapter 39. Bare Board Test Equipment

Chapter 40. HDI Bare Board Special Testing Methods

PART 6: ASSEMBLY

Chapter 41. Assembly Processes

PART 7: SOLDERING

Chapter 42. Design for Soldering and Solderability

Chapter 43. Solder Materials and Processes

Chapter 44. No-Clean Assembly Process

Chapter 45. Lead-Free Soldering

Chapter 46. Fluxes and Cleaning

Chapter 47. Press-Fit Connections

PART 8: QUALITY CONTROL AND RELIABILITY

Chapter 48. Acceptability of Fabricated Boards

Chapter 49. Acceptability of Printed Circuit Board Assemblies

Chapter 50. Assembly Inspection

Chapter 51. Design for Testing

Chapter 52. Loaded Board Testing

Chapter 53. Reliability of Printed Circuit Assemblies

Chapter 54. Component-to-PWB Reliability

PART 9: ENVIRONMENTAL ISSUES AND WASTE TREATMENT

Chapter 55. Process Waste Minimization and Treatment

PART 10: FLEXIBLE CIRCUITS

Chapter 56. Flexible Circuits: Applications and Materials

Chapter 57. Design of Flexible Circuits

Chapter 58. Manufacturing of Flexible Circuits

Chapter 59. Termination of Flexible Circuits

Chapter 60. Special Constructions of Flexible Circuits

Chapter 61. Quality Assurance of Flexible Circuits

Appendix

Rewards Program

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