What is included with this book?
Foreword
Preface
Contributors and Acknowledgements
Historic Timeline
Part I – Basic Electron Devices
1 Bipolar Transistors
1.1 Motivation
1.2 The pn Junction and Its Electronic Applications
1.3 The Bipolar Junction Transistor and Its Electronic Applications
1.4 Optimization of Bipolar Transistors
1.5 SiGe Heterojunction Bipolar Transistors
References
2 MOS Devices
2.1 Introduction
2.2 MOSFET Basics
2.3 The Evolution of MOSFET
2.4 Concluding Remarks
References
3 Memory Devices
3.1 Introduction
3.2 Volatile Memories
3.3 Non-Volatile Memories
3.4 Future Perspectives of MOS Memories
3.5 Closing Remarks
References
4 Passive Components
4.1 Discrete and integrated passive components
4.2 Application in Analog ICs and DRAM
4.3 The planar Spiral Inductor – A Case Study
4.4 Parasitics in Integrated Circuits
References
5 Emerging Research Devices
5.1 Non-Charge Based Switching
5.2 Carbon as a Replacement for Silicon and the Rise of Moletronics
5.3 Conclusions
References
Part II – Aspects of Device and IC Manufacturing
6 Electronics Materials
6.1 Introduction
6.2 Silicon Device Technology
6.3 Compound Semiconductor Devices
6.4 Electronic Displays
6.5 Conclusions
References
7 Compact Modeling
7.1 The Role of Compact Models
7.2 Bipolar Transistor Compact Modeling
7.3 MOS Transistor Compact Modeling
7.4 Compact Modeling of Passive Components
7.5 Benchmarking and Implementation
References
8 Technology Computer Aided Design
8.1 Introduction
8.2 Drift-Diffusion Model
8.3 Microscopic Transport Models
8.4 Quantum Transport Models
8.5 Process and Equipment Simulation
References
9 Device Reliability Physics
9.1 Introduction and Background
9.2 Device Reliability Issues
9.3 Interconnect Degradation Mechanisms
9.4 Circuit-Level Reliability Issues
9.5 Microscopic Approaches to Assuring Reliability of ICs
References
10 Semiconductor Manufacturing
10.1 Introduction
10.2 Substrates
10.3 Lithography and Etching
10.4 Front-End Processing
10.5 Back-End Processing
10.6 Process Control
10.7 Assembly and Test
10.8 Future Directions
References
Part III – Applications based on Electron Devices
11 VLSI Logic Technology and Circuits
11.1 Introduction
11.2 MOSFET Scaling Trends
11.3 Low-Power and High-Speed Logic Design
11.4 Scaling-Driven technology Enhancements
11.5 Ultra-Low Voltage Transistors
11.6 Interconnects
11.7 Memory Design
11.8 System Integration
References
12 VLSI Mixed-Signal Technology And Circuits
12.1 Introduction
12.2 Analog/Mixed-Signal Technologies in Scaled CMOS
12.3 Data Converter ICs
12.4 Mixed-Signal Circuits in Low-Power Display Applications
12.5 Image Sensor Technology and Circuits
References
13 Memory Technologies
13.1 Semiconductor Memory History
13.2 State of Mainstream Semiconductor Memory Today
13.3 Emerging Memory Technologies
13.4 Conclusions
References
14 RF&Microwave Semiconductor Technologies
14.1 III-V Based: GaAs and InP
14.2 Si and SiGe
14.3 Wide Bandgap Devices (Group III-Nitrides, SiC and Diamond)
References
15 Power Devices and ICs
15.1 Overview of Power Devices & ICs
15.2 Two-Carrier and High-Power Devices
15.3 Power MOSFET Devices
15.4 High-Voltage and Power ICs
15.5 Wide Bandgap Power Devices
References
16 Photovoltaic Device Applications
16.1 Introduction
16.2 Silicon Photovoltaics
16.3 Polycrystalline Thin-Film Photovoltaics
16.4 III-V Compound Photovoltaics
16.5 Future Concepts in Photovoltaics
References
17 Large Area Electronics
17.1 Thin-Film Solar Cells
17.2 Large-Area Imaging
17.3 Flat-Panel Displays
References
18 Microelectromechanical Systems (MEMS)
18.1 Introduction
18.2 The 1960’s – First Micromachined Structures Envisioned
18.3 The 1970’s – Integrated Sensors Started
18.4 The 1980’s – Surface Micromachining Emerged
18.5 The 1990’s – MEMS Impacted Various Fields
18.6 The 2000’s – Diversified Sophisticated Systems Enabled By MEMS
18.7 Future Outlook
References
19 Vacuum Device Applications
19.1 Traveling-Wave Devices
19.2 Klystrons
19.3 Inductive Output Tubes
19.4 Crossed-Field Devices
19.5 Gyro-Devices
References
20 Optoelectronic Device Applications
20.1 Introduction
20.2 Light Emission in Semiconductors
20.3 Photodetectors
20.4 Integrated Optoelectronics
20.5 Optical Interconnects
20.6 Concluding Remarks
References
21 Devices for the Post Silicon CMOS Era
21.1 Introduction
21.2 Devices for the 8-nm Node With Conventional Materials
21.3 New Channel Materials and Devices
21.4 Concluding Remarks
References
Index
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