Introduction to Electromagnetic Compatibility

by Paul, Clayton R.

• ISBN13: 9780471755005
• ISBN10: 0471755001
• Edition: 2nd
• Format: Hardcover
• Copyright: 2006-01-09
• Publisher: Wiley-Interscience

Summary

A Landmark text thoroughly updated, including a new CD As digital devices continue to be produced at increasingly lower costs and with higher speeds, the need for effective electromagnetic compatibility (EMC) design practices has become more critical than ever to avoid unnecessary costs in bringing products into compliance with governmental regulations. The Second Edition of this landmark text has been thoroughly updated and revised to reflect these major developments that affect both academia and the electronics industry. Readers familiar with the First Edition will find much new material, including: * Latest U.S. and international regulatory requirements * PSpice used throughout the textbook to simulate EMC analysis solutions * Methods of designing for Signal Integrity * Fortran programs for the simulation of Crosstalk supplied on a CD * OrCAD(r) PSpice(r) Release 10.0 and Version 8 Demo Edition software supplied on a CD * The final chapter on System Design for EMC completely rewritten * The chapter on Crosstalk rewritten to simplify the mathematics Detailed, worked-out examples are now included throughout the text. In addition, review exercises are now included following the discussion of each important topic to help readers assess their grasp of the material. Several appendices are new to this edition including Phasor Analysis of Electric Circuits, The Electromagnetic Field Equations and Waves, Computer Codes for Calculating the Per-Unit-Length Parameters and Crosstalk of Multiconductor Transmission Lines, and a SPICE (PSPICE) tutorial. Now thoroughly updated, the Second Edition of Introduction to Electromagnetic Compatibility remains the textbook of choice for university/college EMC courses as well as a reference for EMC design engineers. An Instructor's Manual presenting detailed solutions to all the problems in the book is available from the Wiley editorial department.

Author Biography

CLAYTON R. PAUL, PHD, is Professor and Sam Nunn Chair of Aerospace Systems Engineering, Department of Electrical and Computer Engineering, Mercer University. He is also Emeritus Professor of Electrical Engineering at the University of Kentucky, where he served on the faculty for twenty-seven years. Dr. Paul is the author of twelve textbooks in electrical engineering, has contributed numerous chapters to engineering handbooks and reference texts, and has published numerous technical papers in scientific journals and symposia. He is a Fellow of the IEEE and a Honorary Life Member of the IEEE EMC Society.

Table of Contents

Preface	xvii
Introduction to Electromagnetic Compatibility (EMC)	1	(48)
Aspects of EMC	3	(7)
History of EMC	10	(2)
Examples	12	(2)
Electrical Dimensions and Waves	14	(9)
Decibels and Common EMC Units	23	(26)
Power Loss in Cables	32	(5)
Signal Source Specification	37	(6)
Problems	43	(5)
References	48	(1)
EMC Requirements for Electronic Systems	49	(42)
Governmental Requirements	50	(29)
Requirements for Commercial Products Marketed in the United States	50	(5)
Requirements for Commercial Products Marketed outside the United States	55	(5)
Requirements for Military Products Marketed in the United States	60	(2)
Measurement of Emissions for Verification of Compliance	62	(2)
Radiated Emissions	64	(3)
Conducted Emissions	67	(5)
Typical Product Emissions	72	(6)
A Simple Example to Illustrate the Difficulty in Meeting the Regulatory Limits	78	(1)
Additional Product Requirements	79	(3)
Radiated Susceptibility (Immunity)	81	(1)
Conducted Susceptibility (Immunity)	81	(1)
Electrostatic Discharge (ESD)	81	(1)
Requirements for Commercial Aircraft	82	(1)
Requirements for Commercial Vehicles	82	(1)
Design Constraints for Products	82	(2)
Advantages of EMC Design	84	(7)
Problems	86	(3)
References	89	(2)
Signal Spectra---the Relationship between the Time Domain and the Frequency Domain	91	(86)
Periodic Signals	91	(27)
The Fourier Series Representation of Periodic Signals	94	(10)
Response of Linear Systems to Periodic Input Signals	104	(7)
Important Computational Techniques	111	(7)
Spectra of Digital Waveforms	118	(24)
The Spectrum of Trapezoidal (Clock) Waveforms	118	(4)
Spectral Bounds for Trapezoidal Waveforms	122	(1)
Effect of Rise/Falltime on Spectral Content	123	(9)
Bandwidth of Digital Waveforms	132	(4)
Effect of Repetition Rate and Duty Cycle	136	(1)
Effect of Ringing (Undershoot/Overshoot)	137	(3)
Use of Spectral Bounds in Computing Bounds on the Output Spectrum of a Linear System	140	(2)
Spectrum Analyzers	142	(6)
Basic Principles	142	(4)
Peak versus Quasi-Peak versus Average	146	(2)
Representation of Nonperiodic Waveforms	148	(3)
The Fourier Transform	148	(3)
Response of Linear Systems to Nonperiodic Inputs	151	(1)
Representation of Random (Data) Signals	151	(4)
Use of SPICE (PSPICE) In Fourier Analysis	155	(22)
Problems	167	(8)
References	175	(2)
Transmission Lines and Signal Integrity	177	(122)
The Transmission-Line Equations	181	(3)
The Per-Unit-Length Parameters	184	(20)
Wire-Type Structures	186	(13)
Printed Circuit Board (PCB) Structures	199	(5)
The Time-Domain Solution	204	(21)
Graphical Solutions	204	(14)
The SPICE Model	218	(7)
High-Speed Digital Interconnects and Signal Integrity	225	(35)
Effect of Terminations on the Line Waveforms	230	(3)
Effect of Capacitive Terminations	233	(3)
Effect of Inductive Terminations	236	(2)
Matching Schemes for Signal Integrity	238	(6)
When Does the Line Not Matter, i.e., When is Matching Not Required?	244	(3)
Effects of Line Discontinuities	247	(13)
Sinusoidal Excitation of the Line and the Phasor Solution	260	(23)
Voltage and Current as Functions of Position	261	(8)
Power Flow	269	(1)
Inclusion of Losses	270	(3)
Effect of Losses on Signal Integrity	273	(10)
Lumped-Circuit Approximate Models	283	(16)
Problems	287	(10)
References	297	(2)
Nonideal Behavior of Components	299	(78)
Wires	300	(12)
Resistance and Internal Inductance of Wires	304	(4)
External Inductance and Capacitance of Parallel Wires	308	(1)
Lumped Equivalent Circuits of Parallel Wires	309	(3)
Printed Circuit Board (PCB) Lands	312	(3)
Effect of Component Leads	315	(2)
Resistors	317	(8)
Capacitors	325	(11)
Inductors	336	(4)
Ferromagnetic Materials---Saturation and Frequency Response	340	(3)
Ferrite Beads	343	(3)
Common-Mode Chokes	346	(6)
Electromechanical Devices	352	(5)
DC Motors	352	(3)
Stepper Motors	355	(1)
AC Motors	355	(1)
Solenoids	356	(1)
Digital Circuit Devices	357	(1)
Effect of Component Variability	358	(1)
Mechanical Switches	359	(18)
Arcing at Switch Contacts	360	(3)
The Showering Arc	363	(1)
Arc Suppression	364	(5)
Problems	369	(6)
References	375	(2)
Conducted Emissions and Susceptibility	377	(44)
Measurement of Conducted Emissions	378	(7)
The Line Impedance Stabilization Network (LISN)	379	(2)
Common- and Differential-Mode Currents Again	381	(4)
Power Supply Filters	385	(16)
Basic Properties of Filters	385	(3)
A Generic Power Supply Filter Topology	388	(2)
Effect of Filter Elements on Common- and Differential-Mode Currents	390	(6)
Separation of Conducted Emissions into Common- and Differential-Mode Components for Diagnostic Purposes	396	(5)
Power Supplies	401	(13)
Linear Power Supplies	405	(1)
Switched-Mode Power Supplies (SMPS)	406	(3)
Effect of Power Supply Components on Conducted Emissions	409	(5)
Power Supply and Filter Placement	414	(2)
Conducted Susceptibility	416	(5)
Problems	416	(3)
References	419	(2)
Antennas	421	(82)
Elemental Dipole Antennas	421	(8)
The Electric (Hertzian) Dipole	422	(4)
The Magnetic Dipole (Loop)	426	(3)
The Half-Wave Dipole and Quarter-Wave Monopole Antennas	429	(11)
Antenna Arrays	440	(8)
Characterization of Antennas	448	(18)
Directivity and Gain	448	(6)
Effective Aperture	454	(2)
Antenna Factor	456	(4)
Effects of Balancing and Baluns	460	(3)
Impedance Matching and the Use of Pads	463	(3)
The Friis Transmission Equation	466	(4)
Effects of Reflections	470	(16)
The Method of Images	470	(1)
Normal Incidence of Uniform Plane Waves on Plane, Material Boundaries	470	(9)
Multipath Effects	479	(7)
Broadband Measurement Antennas	486	(17)
The Biconical Antenna	487	(3)
The Log-Periodic Antenna	490	(4)
Problems	494	(7)
References	501	(2)
Radiated Emissions and Susceptibility	503	(56)
Simple Emission Models for Wires and PCB Lands	504	(29)
Differential-Mode versus Common-Mode Currents	504	(5)
Differential-Mode Current Emission Model	509	(5)
Common-Mode Current Emission Model	514	(4)
Current Probes	518	(5)
Experimental Results	523	(10)
Simple Susceptibility Models for Wires and PCB Lands	533	(26)
Experimental Results	544	(2)
Shielded Cables and Surface Transfer Impedance	546	(4)
Problems	550	(6)
References	556	(3)
Crosstalk	559	(154)
Three-Conductor Transmission Lines and Crosstalk	560	(4)
The Transmission-Line Equations for Lossless Lines	564	(3)
The Per-Unit-Length Parameters	567	(28)
Homogeneous versus Inhomogeneous Media	568	(2)
Wide-Separation Approximations for Wires	570	(10)
Numerical Methods for Other Structures	580	(6)
Wires with Dielectric Insulations (Ribbon Cables)	586	(4)
Rectangular Cross-Section Conductors (PCB Lands)	590	(5)
The Inductive-Capacitive Coupling Approximate Model	595	(29)
Frequency-Domain Inductive-Capacitive Coupling Model	599	(2)
Inclusion of Losses: Common-Impedance Coupling	601	(3)
Experimental Results	604	(8)
Time-Domain Inductive-Capacitive Coupling Model	612	(4)
Inclusion of Losses: Common-Impedance Coupling	616	(1)
Experimental Results	617	(7)
Lumped-Circuit Approximate Models	624	(1)
An Exact SPICE (PSPICE) Model for Lossless, Coupled Lines	624	(23)
Computed versus Experimental Results for Wires	633	(7)
Computed versus Experimental Results for PCBs	640	(7)
Shielded Wires	647	(30)
Per-Unit-Length Parameters	648	(3)
Inductive and Capacitive Coupling	651	(7)
Effect of Shield Grounding	658	(9)
Effect of Pigtails	667	(2)
Effects of Multiple Shields	669	(6)
MTL Model Predictions	675	(2)
Twisted Wires	677	(36)
Per-Unit-Length Parameters	681	(4)
Inductive and Capacitive Coupling	685	(4)
Effects of Twist	689	(9)
Effects of Balancing	698	(3)
Problems	701	(9)
References	710	(3)
Shielding	713	(40)
Shielding Effectiveness	718	(3)
Shielding Effectiveness: Far-Field Sources	721	(14)
Exact Solution	721	(4)
Approximate Solution	725	(1)
Reflection Loss	725	(3)
Absorption Loss	728	(1)
Multiple-Reflection Loss	729	(2)
Total Loss	731	(4)
Shielding Effectiveness: Near-Field Sources	735	(7)
Near Field versus Far Field	736	(4)
Electric Sources	740	(1)
Magnetic Sources	740	(2)
Low-Frequency, Magnetic Field Shielding	742	(3)
Effect of Apertures	745	(8)
Problems	750	(1)
References	751	(2)
System Design for EMC	753	(106)
Changing the Way We Think about Electrical Phenomena	758	(10)
Nonideal Behavior of Components and the Hidden Schematic	758	(5)
``Electrons Do Not Read Schematics''	763	(3)
What Do We Mean by the Term ``Shielding''?	766	(2)
What Do We Mean by the Term ``Ground''?	768	(37)
Safety Ground	771	(3)
Signal Ground	774	(1)
Ground Bounce and Partial Inductance	775	(6)
Partial Inductance of Wires	781	(5)
Partial Inductance of PCB Lands	786	(1)
Currents Return to Their Source on the Paths of Lowest Impedance	787	(6)
Utilizing Mutual Inductance and Image Planes to Force Currents to Return on a Desired Path	793	(3)
Single-Point Grounding, Multipoint Grounding, and Hybrid Grounding	796	(6)
Ground Loops and Subsystem Decoupling	802	(3)
Printed Circuit Board (PCB) Design	805	(22)
Component Selection	805	(1)
Component Speed and Placement	806	(2)
Cable I/O Placement and Filtering	808	(2)
The Important Ground Grid	810	(2)
Power Distribution and Decoupling Capacitors	812	(10)
Reduction of Loop Areas	822	(1)
Mixed-Signal PCB Partitioning	823	(4)
System Configuration and Design	827	(20)
System Enclosures	827	(1)
Power Line Filter Placement	828	(1)
Interconnection and Number of Printed Circuit Boards	829	(2)
Internal Cable Routing and Connector Placement	831	(1)
PCB and Subsystem Placement	832	(1)
PCB and Subsystem Decoupling	832	(1)
Motor Noise Suppression	832	(2)
Electrostatic Discharge (ESD)	834	(13)
Diagnostic Tools	847	(12)
The Concept of Dominant Effect in the Diagnosis of EMC Problems	850	(6)
Problem	856	(1)
References	857	(2)
Appendix A The Phasor Solution Method	859	(12)
Solving Differential Equations for Their Sinusoidal, Steady-State Solution	859	(4)
Solving Electric Circuits for Their Sinusoidal, Steady-State Response	863	(8)
Problems	867	(2)
References	869	(2)
Appendix B The Electromagnetic Field Equations and Waves	871	(70)
Vector Analysis	872	(9)
Maxwell's Equations	881	(21)
Faraday's Law	881	(11)
Ampere's Law	892	(6)
Gauss' Laws	898	(2)
Conservation of Charge	900	(1)
Constitutive Parameters of the Medium	900	(2)
Boundary Conditions	902	(5)
Sinusoidal Steady State	907	(2)
Power Flow	909	(1)
Uniform Plane Waves	909	(18)
Lossless Media	912	(6)
Lossy Media	918	(4)
Power Flow	922	(1)
Conductors versus Dielectrics	923	(2)
Skin Depth	925	(2)
Static (DC) Electromagnetic Field Relations---a Special Case	927	(14)
Maxwell's Equations for Static (DC) Fields	927	(1)
Range of Applicability for Low-Frequency Fields	928	(1)
Two-Dimensional Fields and Laplace's Equation	928	(2)
Problems	930	(9)
References	939	(2)
Appendix C Computer Codes for Calculating the Per-Unit-Length (PUL) Parameters and Crosstalk of Multiconductor Transmission Lines	941	(18)
WIDESEP.FOR for Computing the PUL Parameter Matrices of Widely Spaced Wires	942	(5)
RIBBON.FOR for Computing the PUL Parameter Matrices of Ribbon Cables	947	(2)
PCB.FOR for Computing the PUL Parameter Matrices of Printed Circuit Boards	949	(2)
MSTRP.FOR for Computing the PUL Parameter Matrices of Coupled Microstrip Lines	951	(1)
STRPLINE.FOR for Computing the PUL Parameter Matrices of Coupled Striplines	952	(2)
SPICEMTL.FOR for Computing a SPICE (PSPICE) Subcircuit Model of a Lossless, Multiconductor Transmission Line	954	(2)
SPICELPI.FOR For Computing a SPICE (PSPICE) Subcircuit of a Lumped-Pi Model of a Lossless, Multiconductor Transmission Line	956	(3)
Appendix D A SPICE (PSPICE) Tutorial	959	(16)
Creating the SPICE or PSPICE Program	960	(1)
Circuit Description	961	(5)
Execution Statements	966	(2)
Output Statements	968	(2)
Examples	970	(5)
References	974	(1)
Index	975