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9780819451675

Microelectronics: Designs, Technology, And Packaging : Proceedings of Spie, 10-12 December 2003, Perth, Australia

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  • ISBN13:

    9780819451675

  • ISBN10:

    0819451673

  • Format: Paperback
  • Copyright: 2004-07-30
  • Publisher: Society of Photo Optical
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Summary

Proceedings of SPIE present the original research papers presented at SPIE conferences and other high-quality conferences in the broad-ranging fields of optics and photonics. These books provide prompt access to the latest innovations in research and technology in their respective fields. Proceedings of SPIE are among the most cited references in patent literature.

Table of Contents

Conference Committee xi
Introduction xv
Plenary Paper: Toward the smallest possible photonic crystal lasers [5277-204] xvii
Y. H. Lee
H. Y. Ryu
H. G. Park
S. H. Kim
M. Notomi
Plenary Paper: Carbon nanotube transistors: an evaluation [5276-205] xxv
L.C. Castro
D. L. John
D. L. Pulfrey
PLENARY PRESENTATIONS
WLANs: a tornado market (or, That was a blast! What's next?) (Plenary Paper) [5274-201]
1(6)
N. Weste
Emerging memory technologies (Plenary Paper) [5274-203]
7(7)
SESSION 1 WIRELESS I
A new communication system design of M-ary PPM UWB suitable to FCC signal spectrum (Invited Paper) [5274-01]
14(15)
M. M.-O. Lee
B. L. Cho
D.-I. Kim
Rapid prototyping of 802.11 wireless modems [5274-02]
29(6)
L. de Souza
P. J. Ryan
J. Crawford
K. Wong
G. Zyner
T. McDermott
A 1-GHz differential second-order low-pass sigma-delta modulator in CMOS for wireless receivers [5274-03]
35(12)
Y. Zhu
S. F. Al-Sarawi
M. Liebelt
Integrated CMOS RF building blocks for 433-MHz sensor systems [5274-05]
47(9)
A.J. McCarthy
D. V. Thiel
P. Lisner
SESSION 2 ADVANCED IC TECHNOLOGY AND PACKAGING
Gate-leakage-tolerant circuits in deep sub-100-nm CMOS technologies (Invited Paper) [5274-06]
56(11)
S.-M. Kang
G. Yang
Z. Wang
AC-coupled interconnect for high-density high-bandwidth packaging (Invited Paper) [5274-07]
67(3)
P. D. Franzon
S. Mick
J. M. Wilson
L. Luo
K. Chandrasakhar
A new domino failure mechanism in deep sub-100-nm technologies and its solution [5274-08]
70(7)
G. Yang
S.-M. Kang
SESSION 3 WIRELESS II
Quasi-3D modeling, design, and analysis of symmetric on-chip inductors in silicon-on-sapphire technology [5274-10]
77(8)
W.-C. Kang
S. F. Al-Sarawi
C.-L. Lim
L. Wong
The design of a broadband microstrip patch sensor for high-frequency remote sensing operations [5274-11]
85(8)
H. J. Hansen
L. T. Hall
T. C. Shum
W. S. Seow
2D scanning Rotman lens structure for smart collision avoidance sensors [5274-12]
93(7)
L. T. Hall
H. J. Hansen
D. Abbott
Dynamic analysis of a UMTS baseband reconfigurable digital filter [5274-13]
100(12)
R. Veljanovski
J. Singh
M. Faulkner
Improved techniques for monitoring the HF spectrum [5274-14]
112(11)
J. E. Giesbrecht
R. Clarke
D. Abbott
Finite element simulations of stacked crystal filters [5274-15]
123(7)
J.-H. Lee
K.-Y. Tzeng
C.-W. Cheng
Y.-C. Shih
C.-M. Yao
A tri-mode 802.11 baseband PHY mixed signal integrated circuit in 0.13-μm CMOS [5274-16]
130(7)
P. J. Ryan
B. Hart
M. Webb
K. Wong
SESSION 4 MEMORY
QsRAM: the new memory technology (Invited Paper) [5274-17]
137(7)
S. Dimitrijev
H. B. Harrison
Ultralow-power ferroelectric memory for SoC [5274-18]
144(8)
S. Natarajan
A. Alvandpour
SESSION 5 SENSORS AND DISPLAY DEVICES I
Magnetoresistance characteristics of gamma-irradiated Al0.35Ga0.65N/GaN HFETs [5274-69]
152(11)
G. A. Umana-Membreno
J. M. Dell
G. Parish
B. D. Nener
L. Faraone
R. Ventury
U. K. Mishra
A 64 x 64 CMOS digital pixel array based on pulse-width analog-to-digital conversion with on-chip linearizing circuit [5274-20]
163(9)
A. J. Kitchen
A. Bermak
A. Bouzerdoum
Y2O3-based oxide phosphor thin film electroluminescent devices [5274-21]
172(11)
T. Miyata
Y. Suzuki
T. Minami
SESSION 6 SENSORS AND DISPLAY DEVICES II
Characterization of crosstalk in HgCdTe n-on-p photovoltaic infrared arrays [5274-22]
183(11)
L. Karp
C. A. Musca
J. M. Dell
L. Faraone
High-speed high-sensitivity low-noise scientific CMOS image sensors [5274-23]
194(12)
S. Kleinfelder
On-chip skin color detection using a triple-well CMOS process [5274-24]
206(9)
F. Boussaid
D. Chai
A. Bouzerdoum
Accurate determination of composition profiles in abrupt MBE-grown HgCdTe heterostructures [5274-25]
215(12)
R. H. Sewell
J. M. Dell
C. A. Musca
L. Faraone
The active microbolometer: a new concept in infrared detection [5274-26]
227(12)
K. C. Liddiard
Practical hot-wire anemometer excitation modes [5274-27]
239(9)
R. J. Adamec
D. V. Thiel
P. Tanner
SESSION 7 MICROPHOTONIC DEVICES
Microphotonics systems: life beyond microelectronics (Invited Paper) [5274-28]
248(4)
K. Eshraghian
K. Alameh
Differential optoelectronic subtractor using self electro-optic effect devices for use in sigma-delta modulation [5274-30]
252(12)
T. Sarros
K. A. Corbett
S. F. Al-Sarawi
B. A. Clare
K. J. Grant
W. Marwood
SESSION 8 ANALOG
A hysteretic comparator's influence on a current-mode ADC [5274-31]
264(5)
G. Kothapalli
Performance analysis of high-accuracy CMOS sample-and-hold circuits [5274-32]
269(8)
H. P. Le
A. Zayegh
J. Singh
Differentiators for insect vision motion detection [5274-33]
277(9)
L. Lee
S. F. Al-Sarawi
D. Abbott
Control unit implementation for a reconfigurable ADC [5274-34]
286(9)
A. Stojcevski
V. Vibhute
J. Singh
A. Zayegh
SESSION 9 DESIGN ISSUES
Egret: a platform for a reconfigurable system-on-chip [5274-37]
295(8)
N. W. Bergmann
J. A. Williams
A new small-swing domino logic for low-power consumption [5274-82]
303(7)
S.-H Yang
K.-R. Cho
SESSION 10 SIMULATION, MEASUREMENT, AND TESTING I
Harmonic distortion produced by cascaded delay elements [5274-40]
310(12)
D. Gangeshan
R. M. Howard
Process management and design for MEMS and microelectronics technologies [5274-41]
322(9)
K. Hahn
J. Popp
A. Wagener
Determination of junction depth and related current phenomena using laser-beam-induced current [5274-42]
331(11)
E. A. Gluszak
S. Hinckley
K. Eshraghian
IP validation in remote microelectronics testing [5274-43]
342(8)
A. Osseiran
K. Eshraghian
S. Lachowicz
X. Zhao
R. Jeffery
M. Robins
SESSION 11 SIMULATION, MEASUREMENT, AND TESTING II
Numerical analysis of the process-induced stresses in silicon microstructures [5274-44]
350(12)
V. Senez
T. Hoffmann
A. Armigliato
I. De Wolf
Signal analysis of accelerometry data using gravity-based modeling [5274-46]
362(9)
N. P. Davey
D. A. James
M. E. Anderson
A modular integrated platform for microsensor applications [5274-47]
371(8)
D. A. James
N. P. Davey
L. Gourdeas
SESSION 12 DIGITAL DESIGN
Sub-5.5 FO4 delay CMOS 64-bit domino/threshold logic adder design [5274-49]
379(11)
P. Celinski
S. D. Cotofana
S. F. Al-Sarawi
D. Abbott
Comparative study on low-power high-performance standard-cell flip-flops [5274-50]
390(9)
S. Tahmasbi Oskuii
A. Alvandpour
POSTER SESSION
Diode UV detectors using oxide semiconductor thin films deposited by magnetron sputtering [5274-52]
399(8)
T. Minami
H. Tanaka
T. Shimakawa
T. Miyata
InGaP/InGaAs quantum-well delta-doped-channel field-effect transistor [5274-53]
407(9)
C.-C. Cheng
S.-Y. Cheng
H.-M. Chuang
C.-Y. Chen
P.-H. Lai
C.-I Kao
C.-W. Hong
C.-W. Chen
W.-C. Liu
Comparison between conductometric and layered SAW hydrogen gas sensor [5274-54]
416(9)
S. J. Ippolito
S. Kandasamy
K. Kalantar-zadeh
W. Wlodarski
A. Holland
DC characterization of an InP/InGaAs tunneling emitter bipolar transistor (TEBT) [5274-55]
425(8)
C.-Y. Chen
S.-Y. Cheng
H.-M. Chuang
J.-Y. Chen
S.-I Fu
C.-H. Tsai
C.-Y. Chang
C.-W. Hung
C.-W. Chen
W.-C. Liu
The effects of vacuum baking on the I-V characteristics of LWIR HgCdTe photodiodes [5274-58]
433(9)
T. H. Nguyen
C. A. Musca
J. M. Dell
J. Antoszewski
L. Faraone
On-chip interconnect schemes for reconfigurable system-on-chip [5274-65]
442(12)
A. S. Lee
N. W. Bergmann
Interfacing methodologies for IP re-use in reconfigurable system-on-chip [5274-66]
454(10)
T.-L. Lee
N. W. Bergmann
Hardware support for a real-time reconfigurable system-on-chip [5274-67]
464(6)
P. J. Waldeck
N. W. Bergmann
A new user-assisted segmentation and tracking technique for an object-based video editing system [5274-70]
470(12)
H. Y. Yu
S.-H. Hong
M. M.-O. Lee
J.-G. Choi
MPLS switch architecture supporting Diffserv for high-speed switching and QoS [5274-71]
482(7)
T.-W. Lee
Y.-C. Kim
M. M.-O. Lee
The concept of field emission devices construction on the basis of self-assembling nanostructures [5274-73]
489(4)
N. I. Mukhurov
S. A. Zhdanok
I. V. Gasenkova
F. V. Plevako
Dependence of barrier height and effective electron mass on gate oxide thickness and nitrogen concentration at SiOxNy/Si interface [5274-74]
493(7)
C. Y. Ng
T. P. Chen
C. H. Ang
Pseudo-exhaustive testing using t-distribution [5274-75]
500(8)
K.-H. Rhee
Subband image encoder using discrete wavelet transform [5274-76]
508(8)
H.-K. Seong
K.-H. Rhee
InGaP/GaAs HBT grown by solid-source molecular-beam epitaxy with a GaP decomposition source [5274-77]
516(7)
P. Niu
H. Hu
X. Shang
S. Wu
W. Guo
C. Miao
X. Li
Z. Xu
D. Qu
A home-baked temperature-compensated integrated light sensor on silicon [5274-78]
523(8)
L. Gourdeas
D. A. James
N. P. Davey
Semi-automatic calibration technique using six inertial frames of reference [5274-79]
531(12)
A. Lai
D. A. James
J. P. Hayes
E. C. Harvey
Circuit analysis and simulation of an ultrahigh-frequency capacitance sensor for scanning capacitance microscopy [5274-80]
543(10)
J. Yang
A. Postula
M. Bialkowski
Toward the development of portable miniature intelligent electronic color identification devices [5274-81]
553(6)
D. V. Nicolau, Jr.
P. Livingston
D. Jahshan
R. Evans
Hardware cost-effective and low-power SoC design of DCT-based noise generation system [5274-83]
559(10)
D.-I. Kim
M. M.-O. Lee
S.-M. Lee
Review of quantum path integrals in fluctuating markets [5274-84]
569(12)
F. D. R. Bonnet
A. G. Allison
D. Abbott
Author Index 581

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