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9780819431011

Optoelectronic Integrated Circuits and Packaging III

by ; ;
  • ISBN13:

    9780819431011

  • ISBN10:

    081943101X

  • Format: Paperback
  • Copyright: 1999-04-01
  • Publisher: Society of Photo Optical
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List Price: $106.66

Table of Contents

Conference Committees vii
PART A Optoelectronic Integrated Circuits iii
SESSION 1 OPTOELECTRONICS APPLICATIONS AND INFRASTRUCTURE
Large-area high-throughput high-resolution lithography systems for optoelectronics and microelectronics (Invited Paper) [3631-02]
4(6)
K. Jain
T.J. Dunn
N. Farmiga
M. Zemel
Optical interconnects for high-speed data links [3631-03]
10(8)
C. M. Ryu
U. Koelle
S. R. Johnson
P. Dowd
R. D. Turpin
P. Kelkar
Y.-H. Zhang
50-Mb/s 32-channel CMOS VCSEL driver with built-in self-test and clock generation circuitry [3631-04]
18(10)
F. E. Kiamilev
A. V. Krishnamoorthy
SESSION 2 FREE-SPACE OPTOELECTRONIC DEVICES
Recent progress on PLC hybrid integration (Invited Paper) [3631-05]
28(9)
K. Kato
Y. Inoue
Optical transposition transform interconnects using a free-space and fiber hybrid module (Invited Paper) [3631-06]
37(7)
J. Popelek
Y. Li
Electrical crosstalk analysis in OEIC modules [3631-08]
44(11)
D. Varoutas
A. Arapogianni
D. Syvridis
T. Sphicopoulos
Multiple quantum well self-electro-optic effect devices for optoelectronic smart pixels [3631-09]
55(11)
H. Chen
R. Wu
Z. Chen
Y. H. Zhang
Y. Du
Q. Zeng
X. Li
Y. Zhang
G. Zhou
F. Hua
SESSION 3 OPTOELECTRONIC WAVEGUIDE DEVICES
Low-cost planer optical couplers for large-core POF-based interconnects [3631-11]
66(5)
Y. Li
K. Fascanella
T. Wang
High-speed switching characteristics of an integrated optoelectronic crossbar switch [3631-12]
71(9)
F. L. Gouin
C. Almeida
C. L. Callender
L. Robitaille
J. P. Noad
Preparation of SiO2 on an InP substrate by a sol-gel technique for integrated optics [3631-13]
80(6)
J. Liu
Y. L. Lam
Y. C. Chan
Y. Zhou
B. S. Ooi
Nonlinear optic polymer core conductive-polymer-clad optoelectronic device [3631-14]
86(12)
J. G. Grote
J. P. Drummond
SESSION 4 OPTOELECTRONIC LASERS AND DETECTORS
Widely tunable hybrid semiconductor lasers [3631-15]
98(10)
P. C. Koh
R. G. S. Plumb
Waveguide heterojunction phototransistors for the analog fiber optic link and signal processing applications [3631-16]
108(5)
D. S. Shin
H. Jiang
C. K. Sun
W. X. Chen
J. T. Zhu
S. A. Pappert
P. K. L. Yu
Simulation of integrated silicon-based Ge/Si quantum well and superlattice infrared photodetectors [3631-17]
113(9)
R. A. Soref
L. R. Friedman
M. J. Noble
D. Schwall
L. R. Ram-Mohan
Characteristics of monolithically integrated InGaAs active pixel imager array [3631-19]
122(10)
Q. Kim
T. J. Cunningham
B. Pain
M. J. Lange
G. H. Olsen
SESSION 5 OPTOELECTRONIC DEVICE MODELING
Modeling and synthesis of silica-glass waveguide networks using FD-BPM simulations [3631-22]
132(10)
S. Koh
D. Wu
PART B Photonics Packaging and Integration
SESSION 6 MICRO-OPTICAL SYSTEMS
Packaging for 3D optoelectronic stacked processors (Invited Paper) [3631-23]
142(6)
P. J. Marchand
X. Zheng
D. Huang
V. H. Ozguz
S. C. Esener
Integration techniques of micro-optical components for miniaturized optomechanical switches [3631-24]
148(8)
R. Goering
B. Goetz
P. Buecker
Packaging of lenslet array on micromirrors [3631-25]
156(9)
A. Tuantranont
V. M. Bright
W. Zhang
Y. C. Lee
Main characteristics of a miniaturized multipurpose infrared spectrometer [3631-26]
165(8)
K. Keranen
M. Blomberg
O. Rusanen
P. Karioja
J. Tenhunen
H. K. Kopola
A. Lehto
Laser interferometer using thin film photodetector [3631-27]
173(9)
M. Sasaki
X. Mi
K. Hane
SESSION 7 PACKAGING FOR INTERCONNECTS AND TELECOMMUNICATIONS
ASOC silicon integrated optics technology (Invited Paper) [3631-28]
182(9)
T. Bestwick
Integration of high-power laser diodes with micro-optical components in a compact pumping source for visible fiber laser [3631-29]
191(7)
R. Goering
B. Hoefer
A. Kraeplin
P. Schreiber
E.-B. Kley
V. SchmeiBer
Design of CMOS ICs for flip-chip integration with optoelectronic device arrays [3631-30]
198(7)
P. Chandramani
F. E. Kiamilev
A. V. Krishnamoorthy
R. G. Rozier
J. Ekman
R. Farbarik
Passive polymer optical waveguides for interconnecting lightwave components [3631-31]
205(11)
R. S. Fan
R. B. Hooker
SESSION 8 COMPONENT INTEGRATION
Micro-integration of VCSELs, detectors, and optics [3631-33]
216(8)
B. Hammond
E. G. Johnson
H. Han
A. S. Fedor
Manufacturing cost analysis of integrated photonic packages [3631-34]
224(10)
C. W. Stirk
Q. Liu
M. Ball
Integration of silicon bench micro-optics [3631-35]
234(10)
H. Han
J. D. Stack
J. Mathews
C. S. Koehler
E. G. Johnson
A. D. Kathman
Wafer scale integration of micro-optic and optoelectronic elements by polymer UV reaction molding [3631-36]
244(8)
P. Dannberg
R. Bierbaum
L. Erdmann
A. H. Brauer
Addendum 252(1)
Author Index 253

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