Power Integrity Modeling and Design for Semiconductors and Systems

by Swaminathan, Madhavan; Engin, Ege

• ISBN13: 9780136152064
• ISBN10: 0136152066
• Edition: 1st
• Format: Hardcover
• Copyright: 2007-11-19
• Publisher: Prentice Hall

Summary

Professionals such as signal integrity engineers, package designers, and system architects need to thoroughly understand signal and power integrity issues in order to successfully design packages and boards for high-speed systems. Now, for the first time, there's a complete guide to power integrity modeling: everything you need to know, from the basics through the state of the art.

Author Biography

Madhavan Swaminathan is Joseph M. Pettit Professor in Electronics at the School of Electrical and Computer Engineering, and Deputy Director of the Packaging Research Center at Georgia Tech. A. Ege Engin is Research Engineer in the School of Electrical and Computer Engineering and Assistant Research Director of the Packaging Research Center at Georgia Tech.

Table of Contents

Preface	p. xiii
Acknowledgments	p. xvii
About the Authors	p. xxi
Basic Concepts	p. 1
Introduction	p. 1
Functioning of Transistors	p. 1
What Are the Problems with Power Delivery?	p. 4
Importance of Power Delivery in Microprocessors and ICs	p. 5
Power Delivery Network	p. 6
Transients on the Power Supply	p. 8
Simple Relationships for Power Delivery	p. 10
Core Circuits	p. 10
I/O Circuits	p. 14
Delay Due to SSN	p. 15
Timing and Voltage Margin Due to SSN	p. 16
Relationship between Capacitor and Current	p. 17
Design of PDNs	p. 17
Target Impedance	p. 20
Impedance and Noise Voltage	p. 22
Components of a PDN	p. 24
Voltage Regulator	p. 24
Bypass or Decoupling Capacitors	p. 28
Package and Board Planes	p. 37
On-Chip Power Distribution	p. 42
PDN with Components	p. 45
Analysis of PDNs	p. 45
Single-Node Analysis	p. 48
Distributed Analysis	p. 55
Chip-Package Antiresonance: An Example	p. 61
High-Frequency Measurements	p. 65
Measurement of Impedance	p. 66
Measurement of Self-Impedance	p. 68
Measurement of Transfer Impedance	p. 70
Measurement of Impedance by Completely Eliminating Probe Inductance	p. 70
Signal Lines Referenced to Planes	p. 71
Signal Lines as Transmission Lines	p. 72
Relationship between Transmission-Line Parameters and SSN	p. 74
Relationship between SSN and Return Path Discontinuities	p. 75
PDN Modeling Methodology	p. 77
Summary	p. 79
Modeling of Planes	p. 83
Introduction	p. 83
Behavior of Planes	p. 84
Frequency Domain	p. 84
Time Domain	p. 86
Two-Dimensional Planes	p. 88
Lumped Modeling Using Partial Inductances	p. 89
Extracting the Inductance and Resistance Matrices	p. 90
Distributed Circuit-Based Approaches	p. 94
Modeling Using Transmission Lines	p. 94
Transmission Matrix Method (TMM)	p. 97
Frequency-Dependent Behavior of Unit-Cell Elements	p. 104
Modeling of Gaps in Planes	p. 113
Discretization-Based Plane Models	p. 117
Finite-Difference Method	p. 117
Finite-Difference Time-Domain Method	p. 128
Finite-Element Method	p. 132
Analytical Methods	p. 133
Cavity Resonator Method	p. 133
Network Representation of the Cavity Resonator Model	p. 135
Multiple Plane Pairs	p. 138
Coupling through the Vias	p. 141
Coupling through the Conductors	p. 154
Coupling through the Apertures	p. 158
Summary	p. 169
Simultaneous Switching Noise	p. 175
Introduction	p. 175
Methods for Modeling SSN	p. 175
Simple Models	p. 177
Modeling of Output Buffers	p. 180
Modeling of Transmission Lines and Planes	p. 185
Microstrip Configuration	p. 186
Stripline Configuration	p. 189
Conductor-Backed Coplanar Waveguide Configuration	p. 205
Summary of Modal Decomposition Methods	p. 207
Application of Models in Time-Domain Analysis	p. 209
Plane Bounce from Return Currents	p. 209
Microstrip-to-Microstrip Via Transition	p. 217
Split Planes	p. 222
Application of Models in Frequency-Domain Analysis	p. 226
Stripline between a Power and a Ground Plane	p. 226
Microstrip-to-Stripline Via Transition	p. 228
Reduction of Noise Coupling Using Thin Dielectrics	p. 231
Extension of M-FDM to Incorporate Transmission Lines	p. 233
Analysis of a Complex Board Design	p. 236
Summary	p. 239
Time-Domain Simulation Methods	p. 243
Introduction	p. 243
Rational Function Method	p. 244
Basic Theory	p. 244
Interpolation Schemes	p. 246
Properties of Rational Functions	p. 252
Passivity Enforcement	p. 257
Integration in a Circuit Solver	p. 283
Disadvantages	p. 291
Signal Flow Graphs	p. 295
Causality	p. 296
Transfer-Function Causality	p. 296
Minimum Phase	p. 296
Delay Extraction from Frequency Response	p. 300
Causal Signal Flow Graphs	p. 302
Computational Aspects in SFG	p. 303
Fast Convolution Methods	p. 307
Cosimulation of Signal and Power Using SFGs	p. 312
Modified Nodal Analysis (MNA)	p. 317
What Is MNA?	p. 317
Frequency Domain	p. 318
Time Domain	p. 320
MNA Formulation with S-Parameters	p. 322
Summary	p. 327
Applications	p. 333
Introduction	p. 333
High-Speed Servers	p. 334
Core PDN Noise	p. 336
I/O PDN Noise	p. 345
Summary	p. 349
High-Speed Differential Signaling	p. 349
Test Vehicle Description	p. 350
Plane Modeling	p. 352
Modeling of Master and Slave Islands	p. 358
Rational Function Modeling	p. 361
Modal Decomposition and Noise Simulation	p. 361
Summary	p. 364
Analysis of IC Packages	p. 365
Simulation of a Multilayered Package Using M-FDM	p. 366
Causal Simulation of HyperBGA Package	p. 368
Summary	p. 372
Extraction of Dielectric Constant and Loss Tangent	p. 372
Problem Definition	p. 373
Corner-to-Corner Plane-Probing Method	p. 378
Causal Model Development	p. 386
Summary	p. 391
Embedded Decoupling Capacitors	p. 392
Embedded Individual Thin- or Thick-Film Capacitors	p. 394
Why Embed Individual Capacitors	p. 395
Design of an Embedded Thick-Film Capacitor Array	p. 395
Integration of Embedded Capacitors into IBM Package	p. 400
Embedded Planar Capacitors	p. 404
Summary	p. 415
Electromagnetic Bandgap (EBG) Structures	p. 415
Basic Theory	p. 416
Response of EBG Structures	p. 417
Dispersion-Diagram Analysis	p. 420
Modification of M-FDM Using Fringe and Gap Fields	p. 424
Scalable Design of EBG Structures for Power Plane Isolation	p. 430
Digital-RF Integration	p. 434
ADC Load-Board Design	p. 436
Issues with EBG Structures for Digital Systems	p. 439
Summary	p. 442
Future Challenges	p. 443
	p. 451
Multiport Networks	p. 451
Matrix Representation of Transmission Lines	p. 453
Spectrum of Digital Signals	p. 454
Software list	p. 459
Index	p. 461
Table of Contents provided by Ingram. All Rights Reserved.

Excerpts

During my (M.S.) undergraduate days in a little town called Tiruchirapalli in Southern India, we used to have frequent voltage and current surges that knocked out all the electrical equipment such as fans and lights in our rooms. Frustrated, my friend once remarked, "We arepowerlessto solve thecurrentproblem." Of course, he meant this in jest, but little did I realize that his statement would become the theme of my research for many years. Although my area of specialty is semiconductors and computer systems, the issues related to power haven't changed. Power represents the major bottleneck in modern semiconductors and systems. With transistor scaling over the last two decades, Moore's law has enabled the integration of millions of transistors within an integrated circuit. With lower gate capacitance and lower voltage, faster transistors have become available with each new generation of computers. However, increased transistor integration has resulted in an increase in the current supplied to the integrated circuit, thereby increasing power. Managing thetransient currentsupplied to the integrated circuit at gigahertz frequencies is one of the biggest challenges faced by the semiconductor industry. With lowering of the supply voltage to the transistors, dynamic variation in the power supply due to current transients is becoming a major bottleneck. The dynamic variation of the supply voltage, also called power supply noise, delta I noise, or simultaneous switching noise, is the subject of this book. Managing power integrity is the process by which the variations on the power supply of the transistors can be maintained within a specified tolerance value. Noise on the power supply can have a direct influence on the speed of an integrated circuit, and hence supplying clean power is a very important element in the design of a computer system. A power distribution network consists of interconnections in the chip, package, and board that include decoupling capacitors, ferrite beads, DC-DC converters, and other components. Both the package and board form a very critical part of the power distribution network, which is the focus of this book. The book covers two aspects of power distribution: design and modeling, with an emphasis on modeling. The book is organized into five chapters, which cover basic and advanced concepts. All chapters contain several examples to illustrate the concepts, some of which can be reproduced using the software provided. These examples can also be used to evaluate the accuracy and speed of several commercial tools that are available today. Chapter 1, "Basic Concepts," is for engineers and students who are entering the field of power integrity. The basic concepts are covered in this chapter, which includes a discussion on the fundamentals of power supply noise, its role in the speed of a computer system, the parasitics that produce it, and its effect on jitter and voltage margin for high-speed signal propagation. A power distribution network is best designed in the frequency domain, and the reasons for this are discussed in this chapter. The entire book is based on the parameter called target impedance, which can be used to evaluate the properties of a power distribution network. This parameter, developed in the mid-1990s, provides an elegant method of analysis, which can be used to understand the role of various components in the response of a power distribution network. The target impedance is therefore explained in detail in Chapter 1, with examples that can be reproduced using a circuit simulator such as Simulated Program with Integrated Circuit Emphasis (Spice). The concept of target impedance is used to promote better understanding of the placement of decoupling capacitors. The components of a power distribution network consist of several voltage regulator modules, decoupling capacitors, package and board interconnections, planes, and on-chip interconnection