Printed Circuits Handbook

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  • Edition: 6th
  • Format: Hardcover
  • Copyright: 2007-09-19
  • Publisher: McGraw-Hill Education
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Supplemental Materials

What is included with this book?


The World's #1 Guide to Printed Circuit Boards_Now Completely Updated with the Latest Information on Lead-Free Manufacturing!The best reference in the field for over 30 years, thePrinted Circuits Handbookequips you with definitive coverage of every facet of printed circuit assemblies_from design methods to fabrication processes. Now completely revised and updated, the Sixth Edition presents the latest information on lead-free manufacturing, including lead-free PCB design and fabrication techniques, lead-free materials, and lead-free reliability models. The new edition also explores best practices for High Density Interconnect (HDI), as well as flexible printed circuits.Written by a team of experts from around the world, the Sixth Edition of this renowned handbook contains cutting-edge material on engineering and design of printed circuits fabrication methods...assembly processes... solders and soldering...test and repair...waste minimization and treatment ...quality and reliability of printed circuit processes...and much more. The updatedPrinted Circuits Handbookprovides you with: Unsurpassed guidance on printed circuits_from design to manufacturing Over 500 illustrations, charts, and tables for quick access to essential data New to this edition: New coverage of lead-free PCB design and manufacturing techniques, lead-free materials, lead-free reliability models, best practices for High Density Interconnect (HDI), and flexible printed circuitsInside This State-of-the-Art Printed Circuits Guide Introduction to Printed Circuits Engineering and Design of Printed Circuits Fabrication Processes Assembly Processes Solders and Soldering Test and Repair Waste Minimization and Treatment Quality and Reliability of Printed Circuit Processes Flexible Circuits

Author Biography

Clyde F. Coombs, Jr. (Los Altos, CA) recently retired from Hewlett-Packard. He is the editor of all five editions of the Printed Circuits Handbook, the first of which was published in 1967. He is also the editor of two editions of the Electronic Instrument Handbook.

Table of Contents

List of Contributors
Lead-Free Legislation
Legislation and Impact on Printed Circuits
Printed Circuit Technology Drivers
Electronic Packaging and High-Density Interconnectivity
Semiconductor Packaging Technology
Advanced Component Packaging
Types of Printed Wiring Boards
Introduction to Base Materials
Base Material Components
Properties of Base Materials
Base Materials Performance Issues
The Impact of Lead-Free Assembly on Base Materials
Selecting Base Materials for Lead-Free Assembly Applications
Laminate Qualification and Testing
Engineering and Design
Physical Characteristics of the PCBM
The PCB Design Process
Electrical and Mechanical Design Parameters
Current Carrying Capacity in Printed Circuits
PCB Design for Thermal Performance
Information Formatting and Exchange
Planning for Design, Fabrication, and Assembly
Manufacturing Information, Documentation, and Transfer Including CAM Tooling for Fab and Assembly
Embedded Components
High Density Interconnection
Introduction to High-Density Interconnection (HDI) Technology
Advanced High-Density Interconnection (HDI) Technologies
Drilling Processes
Precision Interconnect Drilling
Multilayer Materials and Processing
Preparing Boards for Plating
Direct Plating
PWB Manufacture Using Fully Electroless Copper
Printed Circuit Board Surface Finishes
Solder Mask
Etching Process and Technologies
Machining and Routing
Bare Board Test
Bare Board Test Objectives and Definitions
Bare Board Test Methods
Bare Board Test Equipment
HDI Bare Board Special Testing Methods
Assembly Processes
Conformal Costing
Solderability Technology
Solderability: Incoming Inspection and Wet Balance Technique
Fluxes and Cleaning
Solder Materials and Processes
Soldering Fundamentals
Soldering Materials and Metallurgy
Solder Fluxes
Soldering Techniques
Soldering Repair and Rework
Nonsolder Interconnection
Press-Fit Interconnection
Land Grid Array Interconnect
Acceptability and Quality of Fabricated Boards
Acceptability of Printed Circuit Board Assemblies
Assembly Inspection
Design for Testing
Loaded Board Testing
Conductive Anodic Filament Formation
Reliability of Printed Circuit Assemblies
Component-to-PWB Reliability: The Impact of Design Variables and Lead Free
Component-to-PWB Reliability: Estimating Solder-Joint Reliability and the Impact of Lead-Free Solders
Environmental Issues
Process Waste Minimization and Treatment
Flexible Circ
Table of Contents provided by Publisher. All Rights Reserved.

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