Printed Circuits Handbook

by Coombs, Clyde; Holden, Happy

• ISBN13: 9780071467346
• ISBN10: 0071467343
• Edition: 6th
• Format: Hardcover
• Copyright: 2007-09-19
• Publisher: McGraw-Hill Education

Summary

The World's #1 Guide to Printed Circuit Boards_Now Completely Updated with the Latest Information on Lead-Free Manufacturing!The best reference in the field for over 30 years, thePrinted Circuits Handbookequips you with definitive coverage of every facet of printed circuit assemblies_from design methods to fabrication processes. Now completely revised and updated, the Sixth Edition presents the latest information on lead-free manufacturing, including lead-free PCB design and fabrication techniques, lead-free materials, and lead-free reliability models. The new edition also explores best practices for High Density Interconnect (HDI), as well as flexible printed circuits.Written by a team of experts from around the world, the Sixth Edition of this renowned handbook contains cutting-edge material on engineering and design of printed circuits fabrication methods...assembly processes... solders and soldering...test and repair...waste minimization and treatment ...quality and reliability of printed circuit processes...and much more. The updatedPrinted Circuits Handbookprovides you with: Unsurpassed guidance on printed circuits_from design to manufacturing Over 500 illustrations, charts, and tables for quick access to essential data New to this edition: New coverage of lead-free PCB design and manufacturing techniques, lead-free materials, lead-free reliability models, best practices for High Density Interconnect (HDI), and flexible printed circuitsInside This State-of-the-Art Printed Circuits Guide Introduction to Printed Circuits Engineering and Design of Printed Circuits Fabrication Processes Assembly Processes Solders and Soldering Test and Repair Waste Minimization and Treatment Quality and Reliability of Printed Circuit Processes Flexible Circuits

Author Biography

Clyde F. Coombs, Jr. (Los Altos, CA) recently retired from Hewlett-Packard. He is the editor of all five editions of the Printed Circuits Handbook, the first of which was published in 1967. He is also the editor of two editions of the Electronic Instrument Handbook.

Table of Contents

List of Contributors

Preface

Lead-Free Legislation

Legislation and Impact on Printed Circuits

Printed Circuit Technology Drivers

Electronic Packaging and High-Density Interconnectivity

Semiconductor Packaging Technology

Advanced Component Packaging

Types of Printed Wiring Boards

Materials

Introduction to Base Materials

Base Material Components

Properties of Base Materials

Base Materials Performance Issues

The Impact of Lead-Free Assembly on Base Materials

Selecting Base Materials for Lead-Free Assembly Applications

Laminate Qualification and Testing

Engineering and Design

Physical Characteristics of the PCBM

The PCB Design Process

Electrical and Mechanical Design Parameters

Current Carrying Capacity in Printed Circuits

PCB Design for Thermal Performance

Information Formatting and Exchange

Planning for Design, Fabrication, and Assembly

Manufacturing Information, Documentation, and Transfer Including CAM Tooling for Fab and Assembly

Embedded Components

High Density Interconnection

Introduction to High-Density Interconnection (HDI) Technology

Advanced High-Density Interconnection (HDI) Technologies

Fabrication

Drilling Processes

Precision Interconnect Drilling

Imaging

Multilayer Materials and Processing

Preparing Boards for Plating

Electroplating

Direct Plating

PWB Manufacture Using Fully Electroless Copper

Printed Circuit Board Surface Finishes

Solder Mask

Etching Process and Technologies

Machining and Routing

Bare Board Test

Bare Board Test Objectives and Definitions

Bare Board Test Methods

Bare Board Test Equipment

HDI Bare Board Special Testing Methods

Assembly

Assembly Processes

Conformal Costing

Solderability Technology

Solderability: Incoming Inspection and Wet Balance Technique

Fluxes and Cleaning

Solder Materials and Processes

Soldering Fundamentals

Soldering Materials and Metallurgy

Solder Fluxes

Soldering Techniques

Soldering Repair and Rework

Nonsolder Interconnection

Press-Fit Interconnection

Land Grid Array Interconnect

Quality

Acceptability and Quality of Fabricated Boards

Acceptability of Printed Circuit Board Assemblies

Assembly Inspection

Design for Testing

Loaded Board Testing

Reliability

Conductive Anodic Filament Formation

Reliability of Printed Circuit Assemblies

Component-to-PWB Reliability: The Impact of Design Variables and Lead Free

Component-to-PWB Reliability: Estimating Solder-Joint Reliability and the Impact of Lead-Free Solders

Environmental Issues

Process Waste Minimization and Treatment

Flexible Circ

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