Introduction to Robust Electronic Design | |
Preparation for Robust Electronic Design | |
Developing Products and Equipment Using Robust Electronic Design | |
Creating the Design Specification | |
Hammering Out Technical Issues (Engineering Verification) | |
Developing a Usable Product or Piece of Equipment and Getting All Necessary Approvals (Design Verification) | |
Tooling Up for Production (Manufacturing Verification) | |
Starting Production, Announcing the Product, and Celebrating | |
Noise Sources, Noise Coupling Paths, and Noise Victims | |
Noise Sources | |
Noise Victims | |
Noise-Coupling Paths | |
Selecting Passive Components | |
Resistors | |
Fuses | |
Capacitors | |
Inductors and Transformers | |
EMC Ferrites | |
Crystals and Ceramic Resonators | |
Switches, Controls, Indicators, Displays, and Relays | |
Batteries, Fuel Cells, and Solar Cells | |
Batteries | |
Fuel Cells | |
Solar Cells | |
Connectors | |
Selecting Active Components | |
Diodes | |
Transient Suppressors and Surge Suppressors | |
Transistors, FET's, and Thyristors | |
Optoelectronics | |
Integrated Circuits | |
Digital IC's | |
Analog IC's | |
Power IC's | |
IC Packages | |
Designing Digital Circuits | |
Designing Analog Circuits | |
Designing Interface Circuits | |
Designing Power Supply Circuits | |
Designing Microprocessor and Microcontroller Circuits | |
Partitioning | |
Grounds and Returns | |
Bypassing, Decoupling, and Power Distribution | |
Wires, Traces, and Planes | |
Transmission Lines | |
Designing Printed Circuit Boards | |
Product Safety | |
Preparation for PCB Layout | |
Printed Circuit Board Schematics | |
Peer Reviews | |
Choosing the Board Materials | |
Choosing the Board Thickness | |
Choosing the Board Outline | |
Choosing the Board Stackup | |
Partitioning | |
Placing Components | |
Routing Traces | |
Partitioning Power and Return Planes | |
Final Checks before Release | |
Ampacity "Cheat Sheet" | |
Designing Cables and Backplanes | |
Bonding | |
Shielding | |
Filtering | |
Enclosures and Mechanical Design | |
Software | |
Watchdog Timers | |
Thermal Considerations | |
Finding and Fixing Problems | |
Desk Checks | |
Lab Tests | |
ESD Testing | |
Approval Testing | |
EMC/EMI/ESD and Safety | |
Some Parting Thoughts | |
Acronyms and Common/Trade Names | |
Bibliography | |
Conversion Factors | |
Glossary | |
Schematic symbols | |
Definitions of Symbols and Units | |
Index, Volumes 1 and 2 | |
Appendix A: A Refresher on Circuit Analysis | |
Taylor Worst-Case Design | |
Important Properties of Conductors and Ferrites | |
Important Properties of Insulators and Semiconductors | |
Galvanic and Triboelectric Series | |
Important Properties of Wires and Cables | |
Important Properties of Printed Circuit Boards, Hybrid Modules, Flat Cables, and Busbars | |
Wire Gages | |
Sheet Metal Gages | |
Bergeron Diagrams | |
Electromagnetic Field Theory | |
International Power, Plugs, and Languages | |
International Safety Requirements | |
International EMC/EMI/ESD Requirements | |
Miscellaneous International Requirements | |
Finding and Buying Standards | |
Glossary | |
Acronyms and Common/Trade Names | |
Definitions of Units and Symbols | |
Conversion Factors | |
Schematic symbols | |
Index, Volume 2 | |
Table of Contents provided by Publisher. All Rights Reserved. |