Signal and Power Integrity - Simplified

  • ISBN13:


  • ISBN10:


  • Edition: 2nd
  • Format: Hardcover
  • Copyright: 2009-07-17
  • Publisher: Prentice Hall

Note: Supplemental materials are not guaranteed with Rental or Used book purchases.

Purchase Benefits

  • Free Shipping On Orders Over $35!
    Your order must be $35 or more to qualify for free economy shipping. Bulk sales, PO's, Marketplace items, eBooks and apparel do not qualify for this offer.
  • Get Rewarded for Ordering Your Textbooks! Enroll Now
List Price: $115.00 Save up to $28.75
  • Rent Book $86.25
    Add to Cart Free Shipping


Supplemental Materials

What is included with this book?

  • The New copy of this book will include any supplemental materials advertised. Please check the title of the book to determine if it should include any access cards, study guides, lab manuals, CDs, etc.
  • The Rental and eBook copies of this book are not guaranteed to include any supplemental materials. Typically, only the book itself is included. This is true even if the title states it includes any access cards, study guides, lab manuals, CDs, etc.


The #1 Practical Guide to Signal Integrity Design-Now Updated with Extensive New Coverage! This book brings together up-to-the-minute techniques for finding, fixing, and avoiding signal integrity problems in your design. Drawing on his work teaching more than five thousand engineers, world-class signal and power integrity expert Eric Bogatin systematically reviews the root causes of all six families of signal integrity problems and shows how to design them out early in the design cycle. This editionrs"s extensive new content includes a brand-new chapter on S-parameters in signal integrity applications, and another on power integrity and power distribution network design-topics at the forefront of contemporary electronics design. Coverage includes A fully up-to-date introduction to signal integrity and physical design How design and technology selection can make or break the performance of the power distribution network Exploration of key concepts, such as plane impedance, spreading inductance, decoupling capacitors, and capacitor loop inductance Practical techniques for analyzing resistance, capacitance, inductance, and impedance Solving signal integrity problems via rules of thumb, analytic approximation, numerical simulation, and measurement Understanding how interconnect physical design impacts signal integrity Managing differential pairs and losses Harnessing the full power of S-parameters in high-speed serial link applications Ensuring power integrity throughout the entire power distribution path Realistic design guidelines for improving signal integrity, and much more Unlike books that concentrate on theoretical derivation and mathematical rigor, this book emphasizes intuitive understanding, practical tools, and engineering discipline. Designed for electronics industry professionals from beginners to experts it will be an invaluable resource for getting signal integrity designs right the first time, every time.

Author Biography

Eric Bogatin received his B.S. in physics from MIT in 1976 and his M.S. and Ph.D. in physics from the University of Arizona in Tucson in 1980. For more than thirty years he has been active in the fields of signal integrity and interconnect design. He worked in senior engineering and management roles at AT&T Bell Labs, Raychem Corp., Sun Microsystems, and Interconnect Devices Inc.

Recognizing a need in the industry for quality technical training in signal integrity, he created Bogatin Enterprises, which has grown to be a world-leading provider of signal integrity training services. As a “Signal Integrity Evangelist,” Eric turns complexity into practical design principles, leveraging commercially available analysis techniques and measurement tools.

Over the years, he has created a number of live classes and presented to more than five thousand engineers, worldwide. These include topics on transmission lines, differential pairs, switching noise, ground bounce, the power distribution network, and EMI. Some courses cover the use of TDR and VNA measurement techniques to characterize interconnects.

In addition, Eric is a prolific author with more than three hundred publications, many posted on his web site, www.beTheSignal.com, for free download. He regularly presents at DesignCon, PCB West, Mentor User Group Meetings, and the IPC’s Designer Day annual event.

In the past ten years, he has written regular monthly columns for Printed Circuit Design and Fabrication magazine, Semiconductor International, Electronic Packaging and Production, Altera Corporation, and Mentor Graphics Corporation. He is on the editorial board of Printed Circuit Design and Fabrication magazine and Microinterconnects Newsletter.

Table of Contents

Signal Integrity Is In Your Future
Tools and Technologies for Signal Integrity Solutions (New)
Time and Frequency Domains
Impedance and Electrical Models
The Physical Basis of Resistance
The Physical Basis of Capacitance
The Physical Basis of Inductance
Power Integrity and the Design of the Power Distribution Network (PDN) (New)
The Physical Basis of Transmission Lines
Transmission Lines and Reflections
Lossy Lines, Rise Time Degradation and Material Properties
Cross Talk in Transmission Lines
Differential Pairs and Differential Impedance
4-Port S-Parameters: The Complete Description of a Differential Channel (New)
Table of Contents provided by Publisher. All Rights Reserved.

Rewards Program

Write a Review