Advanced Electronic Packaging

by Ulrich, Richard K.; Brown, William D.

• ISBN13: 9780471466093
• ISBN10: 0471466093
• Edition: 2nd
• Format: Hardcover
• Copyright: 2006-02-24
• Publisher: Wiley-IEEE Press

Summary

As in theFirst Edition, each chapter in this newSecond Edition is authored by one or more acknowledged experts and then carefully edited to ensure a consistent level of quality and approach throughout. There are new chapters on passive devices, RF and microwave packaging, electronic package assembly, and cost evaluation and assembly, while organic and ceramic substrates are now covered in separate chapters. All the hallmarks of theFirst Edition, which became an industry standard and a popular graduate-level textbook, have been retained. An Instructor's Manual presenting detailed solutions to all the problems in the book is available upon request from the Wiley Makerting Department.

Author Biography

WILLIAM D. BROWN, PhD, is Associate Dean for Research, College of Engineering, and Distinguished Professor of Electrical Engineering, University of Arkansas. Since 1991, he has played an active role in sponsoring and guiding research at the University's High Density Electronics Center (HiDEC), which is dedicated to advancing the state of the art in electronics packaging materials and technologies.

Table of Contents

Preface to the Second Edition	xv
Contributors	xvii
Acronyms	xix
Introduction and Overview of Microelectronic Packaging	1	(28)
W. D. Brown
Introduction	1	(1)
Functions of an Electronic Package	2	(1)
Packaging Hierarchy	3	(5)
Die Attach	5	(1)
First-Level Interconnection	5	(2)
Package Lid and Pin Sealing	7	(1)
Second-Level Interconnection	7	(1)
Brief History of Microelectronic Packaging Technology	8	(11)
Driving Forces on Packaging Technology	19	(5)
Manufacturing Costs	20	(1)
Manufacturability Costs	20	(1)
Size and Weight	20	(1)
Electrical Design	21	(1)
Thermal Design	21	(1)
Mechanical Design	21	(1)
Manufacturability	22	(1)
Testability	22	(1)
Reliability	23	(1)
Serviceability	23	(1)
Material Selection	23	(1)
Summary	24	(5)
References	25	(1)
Exercises	26	(3)
Materials for Microelectronic Packaging	29	(48)
W. D. Brown
Richard Ulrich
Introduction	29	(1)
Some Important Packaging Material Properties	29	(6)
Mechanical Properties	30	(1)
Moisture Penetration	30	(1)
Interfacial Adhesion	31	(1)
Electrical Properties	31	(2)
Thermal Properties	33	(1)
Chemical Properties	34	(1)
System Reliability	34	(1)
Ceramics in Packaging	35	(8)
Alumina (Al2O3)	37	(2)
Beryllia (BeO)	39	(1)
Aluminum Nitride (AIN)	40	(1)
Silicon Carbide (SiC)	41	(1)
Boron Nitride (BN)	41	(1)
Glass--Ceramics	42	(1)
Polymers in Packaging	43	(14)
Fundamentals of Polymers	43	(2)
Thermoplastic and Thermosetting Polymers	45	(1)
Effects of Water and Solvents on Polymers	46	(1)
Some Polymer Properties of Interest	47	(3)
Primary Classes of Polymers Used in Microelectronics	50	(5)
First-Level Packaging Applications of Polymers	55	(2)
Metals in Packaging	57	(9)
Die Bonding	57	(1)
Chip to Package or Substrate	58	(6)
Package Construction	64	(2)
Materials Used in High-density Interconnect Substrates	66	(7)
Laminate Substrates	67	(3)
Ceramic Substrates	70	(1)
Deposited Thin-Film Substrates	71	(2)
Summary	73	(4)
References	73	(2)
Exercises	75	(2)
Processing Technologies	77	(28)
H. A. Naseem
Susan Burkett
Introduction	77	(1)
Thin-Film Deposition	77	(16)
Vacuum Facts	78	(1)
Vacuum Pumps	79	(2)
Evaporation	81	(3)
Sputtering	84	(4)
Chemical Vapor Deposition	88	(1)
Plating	89	(4)
Patterning	93	(5)
Photolithography	93	(3)
Etching	96	(2)
Metal-to-Metal Joining	98	(4)
Solid-State Bonding	98	(3)
Soldering and Brazing	101	(1)
Summary	102	(3)
References	102	(1)
Exercises	103	(2)
Organic Printed Circuit Board Materials and Processes	105	(44)
Richard C. Snogren
Introduction	105	(1)
Common Issues for All PCB Layer Constructions	106	(6)
Data Formats and Specifications	106	(1)
Computer-Aided Manufacturing and Tooling	107	(1)
Panelization	108	(1)
Laminate Materials	109	(2)
Manufacturing Tolerance Overview	111	(1)
PCB Process Flow	112	(15)
Manufacture of Inner Layers	112	(6)
Manufacture of MLB Structure and Outer Layers	118	(6)
Electrical Test	124	(1)
Visual and Dimensional Inspection	124	(1)
Contract Review	125	(1)
Microsection Analysis	125	(2)
Dielectric Materials	127	(6)
Dielectric Material Drivers	127	(1)
Dielectric Material Constructions and Process Considerations	128	(5)
Surface Finishes	133	(1)
Advanced PCB Structures	134	(7)
High-density Interconnection (HDI) or Microvia	134	(7)
Specifications and Standards	141	(1)
The IPC, a Brief History	141	(1)
Relevant Standards to Organic Printed Circuit Boards	141	(1)
Key Terms	142	(7)
References	145	(1)
Exercises	145	(4)
Ceramic Substrates	149	(38)
Aicha A. R. Elshabini
Fred D. Barlow III
Ceramics in Electronic Packaging	149	(3)
Introduction and Background	149	(1)
Functions of Ceramic Substrates	149	(1)
Ceramic Advantages	150	(1)
Ceramic Compositions	150	(1)
Ceramic Substrate Manufacturing	151	(1)
Electrical Properties of Ceramic Substrates	152	(1)
Mechanical Properties of Ceramic Substrates	153	(1)
Physical Properties of Ceramic Substrates	154	(1)
Design Rules	154	(1)
Thin Film on Ceramics	155	(1)
Introduction and Background	155	(1)
Deposition Techniques	155	(1)
Thin-Film Substrate Properties	156	(1)
Thick Films on Ceramics	156	(7)
Introduction and Background	156	(1)
Screen Preparation and Inspection	157	(1)
Screen-Printing Process	158	(1)
Substrate Cleaning and Process Environment	159	(1)
Thick-Film Formulations	159	(1)
Heat Treatment Processes for Pastes	160	(1)
Thick-Film Metallizations	161	(1)
Thick-Film Dielectrics	162	(1)
Thick-Film Resistors	162	(1)
Low-Temperature Cofired Ceramics (LTCC)	163	(17)
LTCC Technology	163	(3)
Tape Handling and Cleanroom Environment	166	(1)
Via Formation	167	(2)
Via Fill	169	(2)
Screen-Printing Considerations for Tape Materials	171	(1)
Inspection	172	(1)
Tape Layer Collation	172	(1)
Lamination	173	(2)
Firing	175	(2)
Postprocessing	177	(1)
Design Considerations	178	(1)
Shrinkage Prediction and Control	179	(1)
HTCC Fabrication Process	180	(1)
HTCC Process	180	(1)
Multilayer ALN	180	(1)
High-Current Substrates	180	(2)
Direct Bonded Copper Process	181	(1)
Active Metal Brazing (AMB)	182	(1)
Summary	182	(5)
References	183	(1)
Exercises	184	(3)
Electrical Considerations, Modeling, and Simulation	187	(60)
S. S. Ang
L. W. Schaper
Introduction	187	(1)
When Is a Wire Not a Wire?	187	(1)
Packaging Electrical Functions	187	(1)
Fundamental Considerations	188	(14)
Resistance	189	(5)
Self and Mutual Inductance	194	(6)
Capacitance	200	(2)
Parameter Extraction Programs	202	(1)
Signal Integrity and Modeling	202	(10)
Digital Signal Representation and Spectrum	203	(2)
Driver and Receiver Models	205	(2)
RC Delay	207	(5)
Transmission Lines	212	(14)
Microstrip Transmission Lines	215	(2)
Termination Reflections	217	(6)
Signal Line Losses and Skin Effect	223	(1)
Net Topology	224	(2)
Coupled Noise or Crosstalk	226	(4)
Power and Ground	230	(6)
Dynamic Power Distribution	231	(1)
Power System Impedance	231	(1)
Resonance of Decoupling Capacitance	232	(1)
Power Distribution Modeling	232	(1)
Switching Noise	233	(3)
Overall Packaged IC Models and Simulation	236	(2)
Simulation	237	(1)
Time-Domain Reflectometry	238	(4)
Summary	242	(5)
References	242	(1)
Exercises	243	(4)
Thermal Considerations	247	(52)
Rick J. Couvillion
Introduction	247	(4)
Heat Sources	247	(2)
Approaches to Heat Removal	249	(1)
Failure Modes	250	(1)
Heat Transfer Fundamentals	251	(31)
Heat Transfer Rate Equations	251	(4)
Transient Thermal Response of Components	255	(2)
Conduction in Various Shapes	257	(7)
Overall Resistance	264	(4)
Forced Convection Heat Transfer	268	(8)
Natural or Free Convection Heat Transfer	276	(6)
Air Cooling	282	(1)
Liquid Cooling	282	(4)
Single-Phase Liquid Cooling	282	(1)
Two-Phase Liquid Cooling	282	(4)
Advanced Cooling Methods	286	(3)
Heat Pipes	286	(1)
Thermoelectric Cooling	287	(1)
Microchannel Cooling	288	(1)
Computer-Aided Modeling	289	(1)
Solids Modeling	289	(1)
Computational Fluid Dynamics	290	(1)
Levels of Decoupling	290	(1)
Typical Results	290	(1)
Summary	290	(9)
References	292	(1)
Appendix: Thermophysical Properties for Heat Transfer Calculations	292	(5)
Exercises	297	(2)
Mechanical Design Considerations	299	(50)
William F. Schmidt
Introduction	299	(1)
Deformation and Strain	299	(4)
Stress	303	(4)
Constitutive Relations	307	(4)
Elastic Material	307	(2)
Plastic Material	309	(1)
Creep	310	(1)
Simplified Forms	311	(6)
Plane Stress and Plane Strain	311	(1)
Beams	312	(5)
Failure Theories	317	(6)
Static Failure	318	(2)
Fracture Mechanics	320	(1)
Fatigue	321	(2)
Analytical Determination of Stress	323	(12)
Bi-Material Assembly--Axial Effects	323	(5)
Bi-Material Assembly--Bending Effects	328	(1)
Peeling Stress	329	(2)
Tri-Material Assembly	331	(4)
Numerical Formulations	335	(6)
Finite-Element Method	335	(3)
Commercial Codes	338	(2)
Limitations and Hazards	340	(1)
Summary	341	(8)
References	341	(1)
Bibliography	341	(1)
Exercises	342	(7)
Discrete and Embedded Passive Devices	349	(40)
Richard Ulrich
Introduction	349	(1)
Passives in Modern Electronic Systems	350	(4)
Definitions and Configurations of Passives	354	(2)
Film-Based Passives	356	(2)
Resistors	358	(5)
Design Equations	358	(2)
Sizing Embedded Resistors	360	(1)
Materials for Resistors	361	(2)
Capacitors	363	(8)
Paraelectrics and Ferroelectrics	365	(2)
Sizing Dielectric Areas	367	(2)
Dielectric Materials Used in Capacitors	369	(2)
Inductors	371	(1)
Electrical Characteristics of Passives	372	(7)
Modeling Ideal Passives	373	(1)
Modeling Real Capacitors	374	(1)
Differences in Parasitics Between Discrete and Embedded Capacitors	375	(2)
Modeling Real Inductors	377	(2)
Modeling Real Resistors	379	(1)
Issues in Embedding Passives	379	(2)
Reasons for Embedding Passives	379	(1)
Problems with Embedding Passive Devices	380	(1)
Decoupling Capacitors	381	(3)
Decoupling Issues	381	(1)
Decoupling with Discrete Capacitors	382	(1)
Decoupling with Embedded Capacitors	383	(1)
Future of Passives	384	(5)
References	385	(1)
Exercises	386	(3)
Electronic Package Assembly	389	(48)
Tarak A. Railkar
Robert W. Warren
Introduction	389	(1)
Facilities	389	(4)
Cleanroom Requirements	389	(2)
Electrostatic Discharge Requirements	391	(1)
Moisture Sensitivity Level (MSL) Requirements	392	(1)
Reflow Temperatures	393	(1)
Component Handling	393	(2)
Shipping	393	(1)
Storage	393	(1)
Handling/Processing	394	(1)
Surface-Mount Technology (SMT) Assembly	395	(4)
Solder Printing and Related Defects	395	(2)
Component Placement	397	(1)
Solder Reflow	398	(1)
Cleaning	399	(1)
Wafer Preparation	399	(6)
Wafer Probing	399	(2)
Wafer Mounting	401	(1)
Wafer Backgrinding/Thinning	401	(1)
Wafer Sawing	402	(1)
Wafer Scribing	403	(1)
Equipment	404	(1)
Die Attachment	405	(4)
Epoxy	405	(1)
Thermoplastics and Thermosets	406	(1)
Solder	407	(1)
Rework	407	(1)
Die-Attach Equipment	408	(1)
Wirebonding	409	(8)
Thermocompression Wirebonding	409	(1)
Ultrasonic Wirebonding	409	(1)
Thermosonic Wirebonding	410	(1)
Ribbon Bonding	410	(1)
Ball Bonding	410	(1)
Wedge Bonding	411	(1)
Wirebond Testing	411	(3)
Tape-Automated Bonding	414	(1)
Plasma Surface Treatment	415	(2)
Flip-Chip	417	(8)
Wafer Bumping	419	(3)
Fluxing	422	(3)
Package Sealing/Encapsulation/Coating	425	(4)
Hermetic Package Sealing	426	(1)
Hermetic Package Testing	426	(1)
Nonhermetic Encapsulation	427	(2)
Package-Level Processes	429	(1)
Lead Trim, Form, and Singulation	430	(1)
Solder Ball Attach and Singulation	430	(1)
Marking	430	(1)
State-of-the-Art Technologies	430	(5)
3D and Stacked Die	430	(1)
Radio Frequency (RF) Modules	431	(1)
Microelectromechanical Systems (MEMS) and Microoptoelectromechanical Systems (MOEMS)	432	(2)
Nanotechnology	434	(1)
Summary	435	(2)
References	435	(1)
Exercises	436	(1)
Design Considerations	437	(50)
J. P. Parkerson
L. W. Schaper
Introduction	437	(1)
Packaging and the Electronic System	437	(8)
Packaging Functions	437	(1)
System and Packaging Metrics	438	(2)
System Constraints and Trade-Offs	440	(2)
System Partitioning	442	(3)
Trade-Offs Among Packaging Functions	445	(13)
Signal Wiring	445	(7)
Power Distribution	452	(3)
Thermal Management	455	(1)
Interconnect Testing	456	(2)
Trade-Off Design Example	458	(2)
Product Development Cycle	460	(8)
Traditional and Modified Product Cycles	461	(2)
Market Analysis and Product Specification	463	(1)
Block Diagram and Partitioning	464	(1)
Technology Selection	464	(1)
ASIC/PCB/MCM Design	465	(1)
Thermal/Mechanical Design	466	(1)
Test Program Development	466	(1)
Manufacturing Tooling	467	(1)
Fabrication/Assembly	467	(1)
Characterization	467	(1)
Qualification	467	(1)
Product Introduction	468	(1)
Design Concepts	468	(9)
Component Overview	469	(2)
Schematic Overview	471	(3)
Design Viewpoint	474	(1)
Back Annotation	475	(1)
Simulation and Evaluation	476	(1)
PCB/MCM Board Design Process	477	(7)
PCB Design Flow	477	(1)
Librarian	477	(2)
Package	479	(1)
Layout	479	(2)
Fablink	481	(3)
Summary of Design Concepts	484	(1)
Summary	484	(3)
References	484	(1)
Bibliography	485	(1)
Exercises	485	(2)
Radio Frequency and Microwave Packaging	487	(50)
Fred Barlow
Aicha Elshabini
Introduction and Background	487	(7)
Nature of High-Frequency Circuits	487	(1)
Applications of High-Frequency Circuits	488	(2)
Basic Concepts	490	(4)
Transmission Lines	494	(16)
Transmission Line Modes	495	(1)
System-Level Transmission Lines	496	(3)
Planar Transmission Lines	499	(6)
Discontinuities	505	(5)
High-Frequency Circuit Implementation	510	(5)
Material Considerations	510	(3)
Microwave Monolithic Integrated Circuits	513	(1)
MIC Technologies	513	(2)
Lumped-Element Components	515	(3)
Capacitors	515	(1)
Inductors	516	(2)
Resistors and Terminations	518	(1)
Distributed Components	518	(5)
Impedance-Matching Devices	518	(1)
Filters	519	(1)
Power Dividers	520	(2)
Couplers	522	(1)
Simulation and Circuit Layout	523	(2)
Measurement and Testing	525	(1)
Frequency-Domain Measurements	525	(2)
Measurement Systems	525	(1)
Probing Hardware and Connectors	526	(1)
Time-Domain Measurements	527	(1)
Design Example	528	(3)
Summary	531	(6)
References	531	(4)
Exercises	535	(2)
Power Electronics Packaging	537	(46)
Alexander B. Lostetter
Kraig Olejniczak
Introduction	537	(1)
Semiconductor Power Device Technology	537	(10)
Ideal and Nonideal Power Switching	538	(2)
Power Diodes	540	(1)
Thyristors	541	(1)
Power Bipolar Junction Transistors	542	(1)
Power MOSFETs	542	(1)
Insulated Gate Bipolar Transistors	542	(1)
Static Induction Transistors (SITs)	543	(1)
Silicon Carbide Semiconductor Devices	543	(4)
Commercially Available Power Packages	547	(14)
Discrete Power Device Packages	547	(1)
Multichip Power Modules (MCPMs) and Completely Integrated Solutions	548	(4)
Thermal Performance of Commercial Packages [53--58]	552	(9)
Power Packaging Design Methodology	561	(16)
Overall System Design Philosophies	561	(2)
Substrate Selection	563	(2)
Baseplate and Heat Spreader Selection	565	(1)
Die-Attach Methods [62--64]	565	(5)
Wirebonding [65]	570	(3)
Thermal Design	573	(3)
Electromagnetic Interference (EMI) and Electromagnetic Compliance (EMC)	576	(1)
High-Temperature Power Electronics	576	(1)
Summary	577	(6)
References	577	(2)
Exercises	579	(4)
Multichip and Three-Dimensional Packaging	583	(42)
James Lyke
Introduction	583	(5)
Brief History of Multichip Packaging	583	(2)
Motivations for Multichip Packaging	585	(3)
Packaging Hierarchy and Taxonomy	588	(11)
Hierarchy	588	(1)
Anatomy of an MCM	588	(3)
Planar MCM Approaches	591	(8)
Three-Dimensional Systems	599	(9)
Defining Characteristics of 3D Systems	599	(3)
Die and Package Stacks	602	(3)
MCM Stacks	605	(2)
Folding Approaches	607	(1)
Options in Multichip Packaging	608	(7)
Yield/Known Good Die	608	(1)
Process Compatibility	609	(1)
Density Metrics in 2D and 3D Packaging	609	(1)
Wiring Density	609	(1)
Input/Output	610	(3)
Electrical Performance and Substrate Selection	613	(1)
Thermal Management	613	(2)
Testability	615	(1)
System in a Package Versus System on a Chip	615	(1)
Emerging Trends in Density Scaling	615	(6)
Method 1: For Regular and/or Low-Pincount Assemblies	617	(1)
Method 2: For Moderately Complex Pincount Assemblies	618	(1)
Method 3: For Moderately Complex Pincount Assemblies	619	(1)
Issues in Ultradense Packaging	619	(2)
Summary	621	(4)
References	622	(1)
Exercises	623	(2)
Packaging of MEMS and MOEMS: Challenges and a Case Study	625	(26)
Ajay P. Malshe
Volkan Ozguz
John Patrick O'Connor
Introduction	625	(1)
Background	625	(3)
Mixed Signals, Mixed Domains, and Mixed Scales Packaging: Toward the Next-Generation Application-Specific Integrated Systems	626	(1)
Microelectromechanical Systems	626	(2)
Challenges in Mems Integration	628	(8)
Release and Stiction	630	(1)
Dicing	631	(1)
Die Handling	631	(1)
Wafer-Level Encapsulation	631	(1)
Stress	632	(1)
Outgassing	632	(1)
Testing	633	(1)
State-of-the-Art in MEMS Packaging	633	(2)
Future Directions	635	(1)
Packaging Considerations and Guidelines Related to the Digital Micromirror Device	636	(11)
Introduction and Background to MOEMS and Particularly DMD Devices	636	(1)
Parameters Influencing DMD Packaging	637	(3)
DMD Package Design	640	(6)
DMD Hermetic Package Assembly	646	(1)
Future Packaging Challenges	647	(4)
References	648	(2)
Exercises	650	(1)
Reliability Considerations	651	(40)
Richard Ulrich
Introduction	651	(4)
Definitions	651	(2)
Patterns of Failure	653	(1)
Coverage in This Chapter	654	(1)
Failure Mechanisms	655	(6)
Corrosion	656	(3)
Mechanical Stress	659	(1)
Electrical Stress	660	(1)
Techniques for Failure Analysis	660	(1)
Accelerated Testing	661	(7)
Accelerated Environmental Testing	663	(3)
Electrostatic Discharge Accelerated Testing	666	(1)
Other Accelerated Tests	666	(1)
Test Structures	667	(1)
Reliability Metrology	668	(13)
Failure Rate, MTBF, and FITs	668	(1)
Reliability Functions	668	(6)
Weibull Distribution	674	(3)
Normal Distribution	677	(3)
Failure Distributions and the Bathtub Curve	680	(1)
Failure Statistics for Microelectronic Systems	681	(3)
Predicting Failure in Components That Have Multiple Failure Modes	683	(1)
Industrial Practice of Reliability Science for Microelectronics	684	(7)
Bibliography	684	(1)
Exercises	684	(7)
Cost Evaluation and Analysis	691	(34)
Terry R. Collins
Scott J. Mason
Heather Nachtmann
Introduction	691	(1)
Product Cost	691	(5)
Direct Costs	692	(1)
Indirect Costs	692	(1)
Traditional Volume-Based Costing	692	(2)
Activity-Based Costing	694	(2)
Break-even Analysis	696	(2)
Linear Break-even Analysis	696	(2)
Piecewise Linear Break-even Analysis	698	(1)
Learning Curve Relationships	698	(5)
Determining Exponent Values for Improvement Rates	700	(2)
Learning Curve Examples	702	(1)
Forecasting Models	703	(11)
Mean-Squared Error (MSE)	704	(1)
Mean Absolute Deviation (MAD)	704	(1)
Mean Percentage Error (MPE)	704	(1)
Mean Absolute Percentage Error (MAPE)	705	(1)
Moving Average	705	(1)
Forecasting Sales Based on Historical Data	706	(1)
Exponential Smoothing	707	(5)
Least-Squares Regression	712	(2)
Comparative Analysis	714	(3)
Capital Project Selection and Evaluation	715	(1)
Replacement Analysis	716	(1)
Sensitivity Analysis	717	(3)
Single-Parameter Sensitivity Analysis	718	(1)
Optimistic--Pessimistic Sensitivity Analysis	719	(1)
Summary	720	(5)
References	721	(1)
Exercises	721	(4)
Analytical Techniques for Materials Characterization	725	(68)
Emily A. Clark
Ingrid Fritsch
Seifollah Nasrazadani
Charles S. Henry
Overview	725	(1)
X-Ray Diffraction	725	(9)
Summary	728	(1)
Basic Principles	728	(1)
Instrumentation	729	(2)
Practical Considerations and Applications	731	(3)
Raman Spectroscopy	734	(6)
Summary	734	(1)
Basic Principles	735	(1)
Instrumentation	735	(1)
Practical Considerations and Applications	736	(4)
Scanning Probe Microscopy	740	(4)
Summary	740	(1)
STM Principles and Instrumentation	740	(1)
SFM Principles and Instrumentation	741	(1)
Practical Considerations and Applications	742	(2)
Scanning Electron Microscopy and Energy Dispersive X-ray Spectroscopy	744	(6)
Summary	744	(1)
Basic Principles	745	(1)
Instrumentation	746	(2)
Practical Considerations and Applications	748	(2)
Confocal Microscopy	750	(2)
Summary	750	(1)
Basic Principles	750	(1)
Instrumentation	750	(1)
Practical Considerations and Applications	751	(1)
Auger Electron Spectroscopy	752	(14)
Summary	752	(1)
Basic Principles	753	(4)
Instrumentation	757	(2)
Practical Considerations and Applications	759	(7)
X-ray Photoelectron Spectroscopy	766	(9)
Summary	766	(1)
Basic Principles	766	(3)
Instrumentation	769	(1)
Practical Considerations and Applications	770	(5)
Secondary Ion Mass Spectrometry	775	(18)
Summary	775	(1)
Basic Principles	776	(2)
Instrumentation	778	(4)
Practical Considerations and Applications	782	(4)
References	786	(4)
Exercises	790	(3)
Index	793