Note: Supplemental materials are not guaranteed with Rental or Used book purchases.
Purchase Benefits
What is included with this book?
Geometric Optimization of Cooling Techniques, A. Bejan | |
Introduction | |
Stack of Parallel Vertical Plates Cooled by Natural Convection | |
Bundle of Horizontal Cylinders (Pin Fins) Cooled by Natural Convection | |
Stack of Parallel Plates Cooled by Laminar Forced Convection | |
Stack of Parallel Plates With Flush-Mounted and Protruding Heat Sources | |
Stack of Parallel Plates Cooled by Turbulent Forced Convection | |
Stack of Parallel Plates Immersed in a Free Stream | |
Bundle of Cylinders Cooled by Forced Convection | |
Heat Generating Plate Cooled Inside a Parallel Plate Channel | |
Stacks of Plates Shielded by Porous Screens | |
Plate Fins with Variable Thickness and Height | |
Heat Sinks with Pin Fins and Plate Fins | |
Conclusion | |
Entrance Design Correlations for Circuit Boards in Forced-Air Cooling, M. Faghri, M. Molki, and Y. Asako | |
Introduction | |
A New Correlation for Pressure Drop | |
A Correlation for Heat Transfer and Wake Effect | |
A User-Friendly Program for Prediction of Array Temperature | |
Conclusion | |
Forced Air Cooling of Low-Profile Package Arrays, R.A. Wirtz | |
Introduction | |
Array Geometry | |
Convection Processes | |
Estimation of Package Temperature | |
Determination of h (sub K) and q | |
Package Heat Transfer - Uniform, In-line Arrays | |
Coolant Pressure Drop - Uniform, In-Line Arrays | |
Non-Uniform Arrays | |
Conclusion | |
Conjugate Heat Transfer in Forced Air Cooling of Electronic Components, A. Ortega | |
Introduction | |
Background | |
Classification of Problems | |
Two Dimensional Situation: Strip Source of Heat in Boundary Layer and Channel Flow | |
Three Dimensional Situations: Rectangular Source of Heat | |
Closure | |
Enhanced Air Cooling of Electronic Equipment, S.V. Garimella | |
Introduction | |
Enhancement Strategies | |
Enhancement Techniques | |
Performance Evaluation Criteria | |
Closure | |
Limits of Air Cooling - A Methodological Approach, K. Azar | |
Introduction | |
Thermal Phenomena in Electronic Enclosures | |
Thermal Coupling in Electronic Enclosures | |
Understanding The Concept of Cooling Limit | |
Parameters Impacting Heat Transfer | |
Potential Limits of Natural and Forced Convection Cooling | |
Index |
The New copy of this book will include any supplemental materials advertised. Please check the title of the book to determine if it should include any access cards, study guides, lab manuals, CDs, etc.
The Used, Rental and eBook copies of this book are not guaranteed to include any supplemental materials. Typically, only the book itself is included. This is true even if the title states it includes any access cards, study guides, lab manuals, CDs, etc.