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Preface | p. XI |
Abbreviations | p. XIII |
Introduction | p. 1 |
Printed Circuits | p. 3 |
Technology Presentation | p. 3 |
Inner-Layer Processing | p. 4 |
Materials Preparation | p. 4 |
Lamination | p. 5 |
Drilling | p. 5 |
Making the Hole Conductive | p. 6 |
Imaging | p. 7 |
Electroplating | p. 8 |
Copper Etching | p. 9 |
Solder Masking | p. 9 |
Surface Finishing | p. 10 |
Routing | p. 10 |
Testing and Inspection | p. 10 |
Assembling | p. 11 |
Problem Solving for Reliability and Quality | p. 15 |
Conventional Paradigms | p. 15 |
Complexity and Time Frames | p. 18 |
Quasilinearity, Circularity, and Closure | p. 21 |
Advance of Reliability Paradigms | p. 23 |
Evolvable Designs of Experiments (EDOE) | p. 27 |
Polystochastic Models | p. 29 |
What Is PSM? | p. 29 |
Basic Notions for Categorical Frame | p. 32 |
Illustrative Examples of PSM and Categorical Frames | p. 34 |
Lumped Stochastic Chains | p. 34 |
Conditional Stochastic Chains | p. 35 |
First-Order Wave Equation | p. 37 |
Algebraic Frames for Time "T" and Space "Z" | p. 37 |
The First-Order Wave Equation | p. 41 |
"Kinetic" Model: Walsh-Hadamard Matrices | p. 42 |
"Convection" Model: Latin Squares | p. 44 |
GF(3) Solution | p. 45 |
GF(4) Solution | p. 47 |
Spectral Analysis: Correlation | p. 49 |
Informational Analysis: EDOE Matrices | p. 51 |
Walsh-Hadamard Matrices and Latin Square Designs | p. 51 |
Classification Procedures: Informational Criteria | p. 52 |
Informational Entropy and Distances | p. 53 |
Adaptability in Classification | p. 54 |
Informational Results | p. 55 |
Proposition 1 | p. 55 |
Proposition 2 | p. 56 |
Proposition 3 | p. 56 |
Relation with Thermodynamics | p. 58 |
Ranking, Discarding, and Replication of the Columns | p. 59 |
Lumping and Splitting Columns | p. 60 |
Juxtaposing and Cutting | p. 61 |
Tables of DOE Matrices | p. 62 |
EDOE Methodology | p. 65 |
Scientific and Engineering Methods | p. 65 |
Center Design and Hierarchy | p. 66 |
Recursivity and Focusing | p. 66 |
Problem-Solving Framework for PCB Quality | p. 67 |
Forward and Backward Search | p. 69 |
Interactions: Dissociation-Integration | p. 71 |
EDOE Basic Steps | p. 73 |
Problem Statement | p. 73 |
Propose the Preliminary Problem-Solving Framework | p. 73 |
Select the DOE Matrices | p. 73 |
Run Center Design | p. 74 |
Analyze Results | p. 74 |
Run Multiple Forward and Backward Steps | p. 74 |
Perform Dissociation-Integration Experiments | p. 74 |
Establish the New Center Design | p. 75 |
Repeat the Testing Procedure from the New Center Design | p. 75 |
Run Simulations: Analyze the Solutions of the Problem | p. 75 |
EDOE Frame and SKUP Schema | p. 75 |
Comparison of EDOE with Other Methods | p. 81 |
Case Studies | p. 85 |
Solder Wicking | p. 87 |
Illustrative Failure Analysis | p. 87 |
Illustrative EDOE Frame | p. 91 |
SKUP Schema for Solder Wicking | p. 92 |
Reliability Analysis | p. 95 |
EDOE for Reliability | p. 95 |
SKUP Schema for Reliability | p. 99 |
Reliability Management System: Main Elements | p. 100 |
Reliability Prediction Software | p. 101 |
Minicoupons | p. 103 |
Reliability Analysis | p. 104 |
IST Electrical Resistance Analysis | p. 105 |
Drilling | p. 111 |
Drilling Quality Framework | p. 111 |
Test Coupons | p. 111 |
Testing Small Plated Through Holes: SKUP Schema for Drilling | p. 113 |
Reliability Tests | p. 116 |
Lifetime Maps | p. 117 |
Drilling Quality Evaluations | p. 119 |
Testing the Design, D | p. 121 |
Testing for Processing, P | p. 122 |
Reliability Evaluations | p. 123 |
Surface Finish Solderability | p. 125 |
Finish Solderability Frame | p. 125 |
SKUP Schema for Surface Finish | p. 128 |
Direct Plate | p. 131 |
Direct Plate Reliability | p. 131 |
Microsectioning Results | p. 132 |
Electrical Resistance versus the Number of Cycles Classification Method | p. 132 |
Associated Vectors-Grids | p. 135 |
First Step of Classification | p. 136 |
Second Step of Classification | p. 137 |
IST Lifetime and Electroplated Cu Thickness | p. 138 |
Summary | p. 138 |
SKUP Schema for Direct Plate | p. 139 |
Plating Voids | p. 141 |
Plating Voids Type | p. 141 |
The SKUP Schema for Plating Voids | p. 145 |
Evolvability | p. 149 |
Self-Adaptive Circuits | p. 151 |
Evolvability Levels | p. 151 |
Self-Adaptivity | p. 152 |
Self-Adaptive Designs and Constructions | p. 152 |
Self-Adaptive Materials | p. 153 |
Self-Adaptive Processing | p. 155 |
Self-Adaptability to Testing and Field Conditions | p. 156 |
Proactive Circuits | p. 159 |
Proactiveness for Circuits | p. 159 |
Evolutionary Hardware | p. 160 |
Electrochemical Filament Circuits | p. 161 |
ECFC Design | p. 162 |
Materials for ECFC | p. 163 |
ECFC Processing | p. 163 |
Potential ECFC Products and Applications | p. 164 |
Evolvable Circuits | p. 165 |
Evolvability Challenges | p. 165 |
Molecular Electronics | p. 166 |
Bacteriorhodopsin for Optoelectronic Circuitry | p. 167 |
Embedded Symbolic-Connectionists Hybrids | p. 168 |
Temporal Synchrony for Embedded Symbolic-Connectionist Hybrids | p. 170 |
Embedded EDOE | p. 172 |
Hybrid Controlled Microfluidic Circuits | p. 173 |
Reconfigurable Microfluidic Circuits | p. 174 |
Self-Constructed Molecular Circuits and Computing | p. 175 |
Genetic Code-Like Mechanism for Molecular Circuitry | p. 177 |
Conventional Circuits versus Evolvable Circuits | p. 182 |
Evolvable Manufacturing Systems | p. 185 |
Manufacturing Paradigms | p. 185 |
Fractal Manufacturing System | p. 187 |
Holonic Manufacturing System | p. 187 |
Biologic Manufacturing System | p. 189 |
Virtual Manufacturing System | p. 190 |
SKUP Schema for Virtual Manufacturing Systems | p. 190 |
Multiagent Manufacturing Systems: Architecture | p. 192 |
Multiagent-Based Versus Conventional Manufacturing Systems | p. 195 |
Concluding Remarks | p. 199 |
Related Concepts | p. 201 |
Complexity | p. 201 |
Evolvability | p. 202 |
Polystochastic Method | p. 202 |
Constructivism | p. 203 |
Cybernetics and the Cycle of Sciences | p. 203 |
References | p. 205 |
Index | p. 211 |
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The Used, Rental and eBook copies of this book are not guaranteed to include any supplemental materials. Typically, only the book itself is included. This is true even if the title states it includes any access cards, study guides, lab manuals, CDs, etc.