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9783527324248

Evolvable Designs of Experiments Applications for Circuits

by
  • ISBN13:

    9783527324248

  • ISBN10:

    3527324240

  • Edition: 1st
  • Format: Hardcover
  • Copyright: 2009-02-17
  • Publisher: Wiley-VCH

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Summary

Adopting a groundbreaking approach, the highly regarded author shows how to design methods for planning increasingly complex experiments. He begins with a brief introduction to standard quality methods and the technology in standard electric circuits. The book then gives numerous examples of how to apply the proposed methodology in a series of real-life case studies. Although these case studies are taken from the printed circuit board industry, the methods are equally applicable to other fields of engineering.

Author Biography

Octavian Iordache has a PhD in chemical engineering and a diploma in mathematics. He was a professor of chemical engineering and has conducted research at several universities in Europe and North America. He has managed the R&D Reliability Center for large companies in microelectronics. He has authored 8 books and over 100 papers.

Table of Contents

Prefacep. XI
Abbreviationsp. XIII
Introductionp. 1
Printed Circuitsp. 3
Technology Presentationp. 3
Inner-Layer Processingp. 4
Materials Preparationp. 4
Laminationp. 5
Drillingp. 5
Making the Hole Conductivep. 6
Imagingp. 7
Electroplatingp. 8
Copper Etchingp. 9
Solder Maskingp. 9
Surface Finishingp. 10
Routingp. 10
Testing and Inspectionp. 10
Assemblingp. 11
Problem Solving for Reliability and Qualityp. 15
Conventional Paradigmsp. 15
Complexity and Time Framesp. 18
Quasilinearity, Circularity, and Closurep. 21
Advance of Reliability Paradigmsp. 23
Evolvable Designs of Experiments (EDOE)p. 27
Polystochastic Modelsp. 29
What Is PSM?p. 29
Basic Notions for Categorical Framep. 32
Illustrative Examples of PSM and Categorical Framesp. 34
Lumped Stochastic Chainsp. 34
Conditional Stochastic Chainsp. 35
First-Order Wave Equationp. 37
Algebraic Frames for Time "T" and Space "Z"p. 37
The First-Order Wave Equationp. 41
"Kinetic" Model: Walsh-Hadamard Matricesp. 42
"Convection" Model: Latin Squaresp. 44
GF(3) Solutionp. 45
GF(4) Solutionp. 47
Spectral Analysis: Correlationp. 49
Informational Analysis: EDOE Matricesp. 51
Walsh-Hadamard Matrices and Latin Square Designsp. 51
Classification Procedures: Informational Criteriap. 52
Informational Entropy and Distancesp. 53
Adaptability in Classificationp. 54
Informational Resultsp. 55
Proposition 1p. 55
Proposition 2p. 56
Proposition 3p. 56
Relation with Thermodynamicsp. 58
Ranking, Discarding, and Replication of the Columnsp. 59
Lumping and Splitting Columnsp. 60
Juxtaposing and Cuttingp. 61
Tables of DOE Matricesp. 62
EDOE Methodologyp. 65
Scientific and Engineering Methodsp. 65
Center Design and Hierarchyp. 66
Recursivity and Focusingp. 66
Problem-Solving Framework for PCB Qualityp. 67
Forward and Backward Searchp. 69
Interactions: Dissociation-Integrationp. 71
EDOE Basic Stepsp. 73
Problem Statementp. 73
Propose the Preliminary Problem-Solving Frameworkp. 73
Select the DOE Matricesp. 73
Run Center Designp. 74
Analyze Resultsp. 74
Run Multiple Forward and Backward Stepsp. 74
Perform Dissociation-Integration Experimentsp. 74
Establish the New Center Designp. 75
Repeat the Testing Procedure from the New Center Designp. 75
Run Simulations: Analyze the Solutions of the Problemp. 75
EDOE Frame and SKUP Schemap. 75
Comparison of EDOE with Other Methodsp. 81
Case Studiesp. 85
Solder Wickingp. 87
Illustrative Failure Analysisp. 87
Illustrative EDOE Framep. 91
SKUP Schema for Solder Wickingp. 92
Reliability Analysisp. 95
EDOE for Reliabilityp. 95
SKUP Schema for Reliabilityp. 99
Reliability Management System: Main Elementsp. 100
Reliability Prediction Softwarep. 101
Minicouponsp. 103
Reliability Analysisp. 104
IST Electrical Resistance Analysisp. 105
Drillingp. 111
Drilling Quality Frameworkp. 111
Test Couponsp. 111
Testing Small Plated Through Holes: SKUP Schema for Drillingp. 113
Reliability Testsp. 116
Lifetime Mapsp. 117
Drilling Quality Evaluationsp. 119
Testing the Design, Dp. 121
Testing for Processing, Pp. 122
Reliability Evaluationsp. 123
Surface Finish Solderabilityp. 125
Finish Solderability Framep. 125
SKUP Schema for Surface Finishp. 128
Direct Platep. 131
Direct Plate Reliabilityp. 131
Microsectioning Resultsp. 132
Electrical Resistance versus the Number of Cycles Classification Methodp. 132
Associated Vectors-Gridsp. 135
First Step of Classificationp. 136
Second Step of Classificationp. 137
IST Lifetime and Electroplated Cu Thicknessp. 138
Summaryp. 138
SKUP Schema for Direct Platep. 139
Plating Voidsp. 141
Plating Voids Typep. 141
The SKUP Schema for Plating Voidsp. 145
Evolvabilityp. 149
Self-Adaptive Circuitsp. 151
Evolvability Levelsp. 151
Self-Adaptivityp. 152
Self-Adaptive Designs and Constructionsp. 152
Self-Adaptive Materialsp. 153
Self-Adaptive Processingp. 155
Self-Adaptability to Testing and Field Conditionsp. 156
Proactive Circuitsp. 159
Proactiveness for Circuitsp. 159
Evolutionary Hardwarep. 160
Electrochemical Filament Circuitsp. 161
ECFC Designp. 162
Materials for ECFCp. 163
ECFC Processingp. 163
Potential ECFC Products and Applicationsp. 164
Evolvable Circuitsp. 165
Evolvability Challengesp. 165
Molecular Electronicsp. 166
Bacteriorhodopsin for Optoelectronic Circuitryp. 167
Embedded Symbolic-Connectionists Hybridsp. 168
Temporal Synchrony for Embedded Symbolic-Connectionist Hybridsp. 170
Embedded EDOEp. 172
Hybrid Controlled Microfluidic Circuitsp. 173
Reconfigurable Microfluidic Circuitsp. 174
Self-Constructed Molecular Circuits and Computingp. 175
Genetic Code-Like Mechanism for Molecular Circuitryp. 177
Conventional Circuits versus Evolvable Circuitsp. 182
Evolvable Manufacturing Systemsp. 185
Manufacturing Paradigmsp. 185
Fractal Manufacturing Systemp. 187
Holonic Manufacturing Systemp. 187
Biologic Manufacturing Systemp. 189
Virtual Manufacturing Systemp. 190
SKUP Schema for Virtual Manufacturing Systemsp. 190
Multiagent Manufacturing Systems: Architecturep. 192
Multiagent-Based Versus Conventional Manufacturing Systemsp. 195
Concluding Remarksp. 199
Related Conceptsp. 201
Complexityp. 201
Evolvabilityp. 202
Polystochastic Methodp. 202
Constructivismp. 203
Cybernetics and the Cycle of Sciencesp. 203
Referencesp. 205
Indexp. 211
Table of Contents provided by Ingram. All Rights Reserved.

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