Preface to the second edition | p. v |
Preface to the first edition | p. vii |
Radiation, physics, and measurement | p. 1 |
Introduction | p. 1 |
Radioactivity | p. 2 |
Types of radiation | p. 3 |
Units | p. 4 |
The measurement of radiation | p. 6 |
Radioactivity | p. 6 |
Ionization chamber | p. 6 |
Calorimeter | p. 7 |
Geiger-Muller and proportional counters | p. 7 |
Faraday Cup | p. 8 |
The Measurement of radiation by luminescence | p. 8 |
Perspex dosimeters | p. 11 |
Colour changes and optical transmission | p. 11 |
Fricke dosimeter | p. 12 |
Polyethylene and hydrogen pressure | p. 12 |
Silicon dosimeters | p. 12 |
General | p. 12 |
Surface-barrier p+/n/n+ particle detectors, gamma rate monitors | p. 12 |
p+/n/n+ diodes as neutron dosimeters | p. 13 |
The MOS dosimeter or RADFET | p. 13 |
References | p. 15 |
Radiation environments | p. 17 |
The space environment | p. 17 |
General | p. 17 |
The radiation belts | p. 18 |
Cosmic rays | p. 19 |
Geomagnetic shielding | p. 25 |
Other sources of cosmic rays | p. 25 |
Solar flares | p. 26 |
Trapped radiation around other planets | p. 27 |
SPENVIS--Earth orbit integration | p. 28 |
New models for trapped radiation | p. 28 |
Space weather | p. 28 |
Life science experiments and doses in low orbit | p. 30 |
The nuclear reactor environment | p. 31 |
General | p. 31 |
Reactor | p. 32 |
Reactor vessel and cavity | p. 32 |
Mobile nuclear reactors | p. 33 |
The radiation processing environment | p. 34 |
General | p. 34 |
Sources and doses | p. 34 |
The weapons environment | p. 35 |
General | p. 35 |
Radiation output | p. 35 |
Electromagnetic pulse | p. 37 |
The controlled-fusion environment | p. 37 |
The environment of robots | p. 38 |
High-energy physics accelerators | p. 39 |
Terrestrial and man-made environments | p. 43 |
General | p. 43 |
Current environmental issues | p. 44 |
The radon hazard | p. 48 |
Radiation protection | p. 49 |
References | p. 54 |
The response of materials and devices to radiation | p. 61 |
Fundamental damage effects | p. 61 |
Atomic displacement | p. 63 |
The nature of defects in silicon | p. 63 |
The intrinsic defects | p. 63 |
Multi-intrinsic defects | p. 64 |
Impurity complexes of the intrinsic defects: the trapped vacancy and trapped interstitial | p. 65 |
Dependence of bulk damage on particle energy and type | p. 69 |
Statistics of particle damage | p. 76 |
Degradation of transport in semiconductors | p. 76 |
Annealing of atomic displacement damage | p. 80 |
Total ionizing dose (TID) effects in devices | p. 85 |
Ionizing energy deposition and thin films | p. 85 |
Models for charge trapping in oxides after ionization | p. 86 |
The charge trap system at the surface of oxidized silicon | p. 88 |
'Colorability' of transparent materials | p. 91 |
General | p. 91 |
The dynamics of colour centres in alkali halide lattices | p. 95 |
How 'soft' are alkali halides and oxides?: units of colorability | p. 97 |
Colorability tables | p. 97 |
Induced radioactivity | p. 100 |
High dose-rate upsets (transient effects) | p. 101 |
General considerations | p. 101 |
Bulk semiconductor | p. 103 |
Transient photocurrents in p-n junctions | p. 104 |
Single-event phenomena | p. 106 |
General | p. 106 |
Single-event upset (SEU) | p. 106 |
Latch-up | p. 109 |
Consequences of long-lived degradation | p. 111 |
Estimating total ionizing dose (TID) or bulk damage (NIEL) | p. 113 |
Conclusions--an overall view of device response | p. 116 |
References | p. 116 |
Further reading | p. 128 |
Metal-oxide-semiconductor (MOS) devices | p. 129 |
Introduction | p. 129 |
Historical | p. 132 |
Charge trapping in MOS devices | p. 134 |
Oxide charge trapping and performance degradation--an overview | p. 134 |
MOS transistor action and threshold voltage shift | p. 134 |
Physical model for oxide trapped charge build-up | p. 138 |
General | p. 138 |
Interface charge trapping | p. 140 |
Metal-insulator-semiconductor (MIS) dielectrics | p. 141 |
Charge collection and trapping processes: the 'RAD' model | p. 141 |
Electrostatics in MOS devices | p. 142 |
Dynamics of charge collection and trapping in MIS devices | p. 144 |
Effect of oxide field and gate bias | p. 145 |
Roll-off, saturation, and turn-over in MIS devices | p. 150 |
'Large' MOS technology and the four-lane chart | p. 155 |
Submicron MOS technology and the four-lane chart | p. 157 |
Real MOS devices in the millenium | p. 159 |
MIIS systems: the dual dielectric | p. 163 |
Electrostatics in MIIS devices | p. 163 |
Charge collection and trapping processes: the 'RAID' model | p. 164 |
Experimental data on MIIS devices | p. 165 |
Time dependence | p. 169 |
Annealing and reverse annealing equations | p. 169 |
High temperature: high recovery rate | p. 171 |
Room temperature: some recovery | p. 171 |
Cryogenic temperatures: little recovery | p. 174 |
'Rebound', 'overshoot', or 'super-recovery' | p. 175 |
'Reverse annealing' | p. 176 |
Electron and hole injection: radiation annealing | p. 176 |
Dose-rate dependence: the problem of enhanced low dose-rate sensitivity (ELDRS) in dielectrics | p. 177 |
Border-state drift | p. 179 |
Transient effects | p. 180 |
Gamma-ray pulses | p. 180 |
Some advanced MOS structures: potential problems | p. 183 |
Introduction | p. 183 |
Insulator layers and trenches | p. 184 |
Lightly and moderately doped drains (LDD and MDD) | p. 185 |
Non-volatile memories | p. 185 |
Heavy metals disturb equilibrium | p. 187 |
CMOS imagers | p. 187 |
Ferroelectric memories | p. 188 |
GaAs-on-Si | p. 189 |
High-voltage and power CMOS ICs | p. 189 |
Conclusions | p. 189 |
References | p. 190 |
Further reading | p. 203 |
Bipolar transistors and integrated circuits | p. 205 |
Introduction | p. 205 |
Effects of radiation on device function | p. 205 |
Gain | p. 205 |
Degradation of gain | p. 206 |
Other permanent effects | p. 207 |
Transient effects | p. 209 |
Bulk damage | p. 209 |
General | p. 209 |
Influence of base width | p. 211 |
Influence of type and energy of radiation | p. 213 |
Irradiation resulsts | p. 216 |
Prediction of degradation | p. 221 |
Selection principles for bipolar transistors | p. 221 |
Surface-linked degradation in gain | p. 222 |
Introduction | p. 222 |
Statistical prediction of surface damage | p. 223 |
Collector-base leakage current | p. 224 |
The 'maverick' device | p. 224 |
Annealing of surface effects | p. 225 |
Slow thermal annealing of bulk damage | p. 225 |
Saturation voltage | p. 226 |
Long-lived radiation effects in bipolar integrated circuits | p. 227 |
Digital ICs | p. 228 |
Emitter-base surface effects in integrated transistors | p. 229 |
Analogue ICs | p. 231 |
Lateral p-n-p transistors | p. 232 |
Isolation technology | p. 233 |
Enhanced low-dose-rate sensitivity (ELDRS) in junction passivation dielectries | p. 236 |
Transient effects in bipolar integrated circuits | p. 238 |
Summary | p. 240 |
References | p. 241 |
Diodes, solar cells, and optoelectronics | p. 244 |
Introduction | p. 244 |
Changes in diode parameters | p. 245 |
The I-V curve | p. 245 |
The capacitance-voltage curve | p. 246 |
[Delta]I[subscript F] at low currents | p. 246 |
[Delta]I[subscript F] at high currents | p. 247 |
Reverse current [Delta]I[subscript R] and damage constant [alpha] | p. 247 |
Solar cells | p. 248 |
General | p. 248 |
Degradation of diffusion length | p. 248 |
Background | p. 250 |
Predicting the degradation of solar-cell arrays | p. 251 |
Equivalence fluences for solar cells | p. 252 |
Advances in photovoltaics--more tolerance? | p. 254 |
Low-power rectifier diodes | p. 256 |
p-n junctions | p. 256 |
Schottky-barrier diodes | p. 257 |
High-power rectifier diodes | p. 258 |
Zener diodes | p. 258 |
Microwave diodes | p. 259 |
Light-detecting devices | p. 259 |
Photodiodes | p. 259 |
Detector diodes for high-energy physics | p. 260 |
Introducing radiation tolerace into p+/n/n+ diodes--'defect engineering | p. 263 |
Wide-base p+/n/n+ diodes-forward voltage drop | p. 264 |
Spectroscopy and defect movement in highly-doped diodes | p. 265 |
Avalanche photodiodes (APD) | p. 266 |
Phototransistors | p. 267 |
Light-emitting diodes (LEDs) and lasers | p. 267 |
General | p. 267 |
LEDs | p. 268 |
Diode lasers | p. 268 |
Optocouplers | p. 270 |
Charge-coupled devices (CCDs) | p. 271 |
General | p. 271 |
Ionization effects in CCDs: principles | p. 273 |
Ionization effects in CCDs: test results | p. 274 |
Bulk damage in CCDs: principles | p. 278 |
Semiconductor chemistry and defect engineering | p. 280 |
Principles for recovering from or reducing CTI growth | p. 280 |
Dark current from bulk damage | p. 281 |
Bulk damage effects in CCDs: experiment | p. 282 |
Transient effects in CCDs | p. 282 |
In-flight prediction tools for CCDs | p. 282 |
Electro-optic crystals | p. 283 |
Opto-electronic systems | p. 284 |
New computational electronics | p. 284 |
Vacuum devices and extreme environments | p. 287 |
Conclusions | p. 287 |
References | p. 288 |
Power semiconductors | p. 303 |
General | p. 303 |
Bipolar power transistors | p. 303 |
Thyristors (silicon-controlled rectifiers | p. 305 |
Power MOSFETs | p. 306 |
Parameter changes under radiation | p. 306 |
Radiation-tolerant power MOS circuits | p. 307 |
Transient and heavy-ion-induced burn out | p. 307 |
Static induction transistor | p. 308 |
Insulated-Gate Bipolar Transistor (IGBT) | p. 308 |
Conclusions | p. 309 |
References | p. 309 |
Optical media | p. 311 |
General | p. 311 |
Window materials and crystals | p. 312 |
General | p. 312 |
Alkali halides, oxides, glasses and colour centres | p. 312 |
Glasses | p. 319 |
The stability of colour-centres in glass | p. 325 |
Coatings | p. 327 |
Light guides | p. 327 |
Introduction | p. 327 |
Sources of 'colorability' in silica and galsses | p. 327 |
Prediction models for optical fibre loss versus dose | p. 328 |
Vapour-deposited fibre technology | p. 331 |
Fibres drawn from synthetic fused silica rods | p. 333 |
Fibre luminescence | p. 334 |
Polymeric optical fibres | p. 334 |
Neutron-gamma test results on fibres at high-dose values | p. 334 |
Scintillators | p. 337 |
Inorganic crystals and glasses | p. 337 |
Afterglow--long-lived luminescence after irradiation | p. 338 |
Conclusions | p. 340 |
References | p. 341 |
Microelectronics, sensors, MEMs, passives, and other components | p. 346 |
Junction field-effect and heterojunction transistors | p. 346 |
Introduction | p. 346 |
Mechanisms of degradation of FETs | p. 347 |
Heterojunction bipolar transistors | p. 347 |
Transducers | p. 350 |
General | p. 350 |
Previous transducer studies | p. 350 |
Temperature sensors | p. 351 |
Magnetics | p. 351 |
Superconductors | p. 354 |
Mechanical sensors | p. 355 |
General | p. 355 |
Microelectromechanical systems (MEMs) | p. 355 |
Miscellaneous electronic components | p. 356 |
Capacitors | p. 356 |
Resistors and conductors | p. 357 |
Quartz crystals and ferroelectric memories | p. 358 |
Vacuum tubes | p. 359 |
Semiconductor microwave devices | p. 360 |
Miscellaneous hardware | p. 360 |
References | p. 361 |
Polymers and other organics | p. 365 |
Introduction | p. 365 |
Radiolytic reactions | p. 366 |
Radiation tolerance of polymers and organics according to application | p. 368 |
General | p. 368 |
Passive polymers in electronics | p. 369 |
Remote handling | p. 369 |
Accelerator parts | p. 370 |
Optical fibres, windows, and scintillators | p. 370 |
Lubricants | p. 371 |
Bombardment of coatings in space | p. 371 |
Thin-film electronics | p. 371 |
Radiation processing | p. 373 |
Sterilization of products | p. 373 |
Irradiation of foods | p. 373 |
Radiation curing of plastics | p. 374 |
Resists | p. 374 |
Long-lived degradation in polymers | p. 374 |
Relative sensitivity | p. 374 |
Effects of additives and fillers | p. 375 |
Combined effects of stress (fields, vacuum, and temperature) and ageing with irradiation | p. 376 |
Radiation-tolerance of plastics according to technology | p. 376 |
General | p. 376 |
Thermoplastics | p. 377 |
Thermosetting plastics | p. 378 |
Elastomers | p. 378 |
Radiation-induced conductivity and charging in insulators | p. 379 |
The space environment | p. 381 |
Conclusion | p. 381 |
References | p. 382 |
The interaction of radiation with shielding materials | p. 386 |
Introduction | p. 386 |
Particle radiation transport and range | p. 387 |
General | p. 387 |
Range | p. 387 |
Transport of electrons | p. 389 |
Transmission coefficients for electrons | p. 389 |
Stopping power | p. 391 |
Internal spectrum | p. 392 |
Transport of protons and other heavy particles | p. 394 |
Interactions | p. 394 |
Energy loss and attenuation | p. 394 |
Electromagnetic radiation: bremsstrahlung, X- and gamma-rays | p. 395 |
General | p. 395 |
Bremsstrahlung | p. 395 |
Gamma rays | p. 397 |
Other electromagnetic radiation | p. 397 |
Production and attenuation of electromagnetic radiation | p. 398 |
Soft X-rays and vacuum ultraviolet: generation and special effects of long-wavelength X-rays | p. 403 |
Radiation attenuation by shielding; deposition of dose in targets | p. 407 |
Dose versus depth | p. 407 |
Shielding: relation between space radiation flux and deposited dose | p. 407 |
Atomic displacement damage versus depth | p. 412 |
Influence of material type on radiation stopping | p. 413 |
Deposition of dose | p. 413 |
Shielding materials | p. 413 |
Conclusions | p. 416 |
References | p. 417 |
Computer methods for particle transport | p. 420 |
Introduction | p. 420 |
Environment calculations | p. 421 |
Dose computation | p. 422 |
Space particle types | p. 422 |
Monte Carlo techniques | p. 423 |
Methods using a dose 'look-up table': SHIELDOSE | p. 424 |
Methods using straight-ahead approximation | p. 424 |
CHARGE program | p. 426 |
Evolving environmental software | p. 427 |
Sector analyses | p. 428 |
Evolving transport software | p. 429 |
Prediction of single-event upsets | p. 432 |
Earth orbit: SPENVIS dose-depth curves | p. 432 |
Neutrons, gamma-rays, and X-rays | p. 433 |
Conclusions | p. 434 |
References | p. 435 |
Radiation testing | p. 437 |
Introduction | p. 437 |
Radiation sources | p. 437 |
Simulation of radiation environments | p. 437 |
Gamma-rays | p. 439 |
X-rays: steady-state and pulsed | p. 441 |
Electrons: steady-state and pulsed | p. 443 |
Protons and pions | p. 446 |
Neutrons: steady-state and pulsed | p. 448 |
UV photon beams and other advanced oxide-injection methods | p. 450 |
Summary of requirements for steady-state radiation sources | p. 451 |
Cosmic ray upset simulation | p. 451 |
Heavy ions | p. 451 |
Fission fragments | p. 454 |
Laser light | p. 455 |
Dosimetry for radiation testing | p. 455 |
Test procedures for semiconductor devices | p. 457 |
Introduction | p. 457 |
Objectives | p. 459 |
Comparison of space with military requirements | p. 459 |
Radiation response specifications | p. 460 |
General | p. 460 |
Product assurance techniques and special radiation assessment | p. 460 |
ESA/SCC and ECSS specifications (Europe) | p. 461 |
BS 9000 specifications and CECC (Europe) | p. 461 |
MIL specifications (USA) | p. 462 |
ASTM specifications (USA) | p. 462 |
Electronic Industries Association EIA (USA) | p. 463 |
Comparison of standards | p. 463 |
Engineering materials | p. 463 |
Time-dependent effects and post-irradiation effects | p. 464 |
Conclusions | p. 468 |
References | p. 468 |
Radiation-hardening of semiconductor parts | p. 474 |
General | p. 474 |
Methodology of total-dose hardening | p. 474 |
Hardening of a process | p. 476 |
Introduction | p. 476 |
Material preparation and cleaning | p. 478 |
Oxide growth | p. 478 |
Oxide anneal | p. 479 |
Gate electrode | p. 479 |
Modified gate insulators | p. 480 |
Field oxide hardening | p. 480 |
Other processing steps | p. 480 |
Hardening for total dose by 'layout' | p. 481 |
Hardening against transient radiation | p. 482 |
Pulsed gamma rays | p. 482 |
Single-event upsets | p. 482 |
Commercial radiation-hard and radiation-tolerant technologies | p. 484 |
General | p. 484 |
Deep submicron technology | p. 484 |
Silicon on insulator (SOI) | p. 485 |
Standard products | p. 485 |
'Fabless' manufacturer | p. 486 |
Hardening of parts other than silicon | p. 487 |
Conclusions | p. 487 |
References | p. 487 |
Equipment hardening and hardness assurance | p. 490 |
Introduction | p. 490 |
Elementary rules of hardening | p. 490 |
General | p. 490 |
Hardening measures at the systems level | p. 491 |
Robots, diagnostics and military vehicles in penetrating radiation | p. 492 |
Manipulators for nuclear plant | p. 492 |
Hardening of a robotic vehicle | p. 495 |
Preventive replacement and fault detection | p. 497 |
The hardening of climbing and clean-up robots | p. 498 |
Energy industry | p. 502 |
Accelerator | p. 503 |
Instruments in a high-luminosity hadron collider | p. 503 |
Military vehicles | p. 504 |
General guidelines for hardening against pulsed gamma rays and neutrons | p. 506 |
When only vacuum electronics will do | p. 507 |
Equipment in non-penetrating radiation: space, x-rays, and beta rays | p. 508 |
Introduction | p. 508 |
Typical spacecraft configurations and materials | p. 510 |
Add-on shielding | p. 513 |
On-board radiation monitoring | p. 515 |
Hardness assurance | p. 517 |
General | p. 517 |
Hardness assurance defined | p. 517 |
Management of hardness assurance | p. 518 |
Databases | p. 519 |
Parts procurement and radiation design margins | p. 521 |
The economics of hardness assurance | p. 526 |
Conclusions | p. 530 |
References | p. 530 |
Further reading | p. 537 |
Conclusions | p. 538 |
Appendix | |
Useful general and geophysical data | |
Conversion factors, physical properties, and constants | p. 541 |
Frequency, wavelength, and energy | p. 542 |
Geophysical and orbital parameters and conversion factors | p. 542 |
Radiation quantities | |
Radiation units and data | p. 543 |
Isotope activity units: traditional and Systeme-International (SI) units of isotope activity | p. 544 |
Energy absorption versus photon energy for air | p. 544 |
Typical performance figures for high-energy radiation sources | p. 545 |
Typical photon energies and wavelengths | p. 546 |
Radioisotopes useful in radiation experiments: main emission energies | p. 547 |
Practical ranges of electrons in aluminium | p. 548 |
Selected values of range of protons in aluminium | p. 549 |
Range of alpha particles in silicon | p. 549 |
Total mass attenuation coefficients of selected materials | p. 550 |
Useful data on materials used in electronic equipment | |
Densities and chemical formulae of commercial plastics | p. 551 |
Radiation absorption effectiveness of various materials | p. 552 |
Bibliography of dosimeter research | |
Background references | p. 554 |
RADFET dosimetry | p. 554 |
Neutron diodes and dosimetry for other heavy particles | p. 560 |
Dose-depth curves for typical Earth orbits, calculated by ESA's Space Environment Information System (SPENVIS) software | |
Geostationary transfer orbit | p. 562 |
Geostationary orbit | p. 563 |
Low Earth orbit: polar | p. 564 |
Low Earth orbit: space station | p. 565 |
'Molniya' orbit | p. 566 |
Typical interplanetary mission | p. 567 |
Degradation in polymers in ionizing radiation | |
Radiation-tolerance of elastomers | p. 568 |
Radiation-tolerance of thermoplastic resins | p. 569 |
Radiation-tolerance of thermosetting resins | p. 570 |
Analysis of data on plastics from Figs F1-F3 | p. 571 |
Useful Web-sites | |
Space agencies and government agencies | p. 571 |
Specifications and standards | p. 572 |
Radiobiological effects and health issues | p. 573 |
Radiation environments and effects software | p. 573 |
Radiation effects databases | p. 574 |
Solid state technology | p. 575 |
Radiation test facilities | p. 575 |
General interest in radiation effects | p. 575 |
Integrated web-sites with a range of related topics | p. 577 |
RADFET technology | p. 577 |
For the family | p. 577 |
Index | p. 579 |
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