Modeling and Simulation for Microelectronic Packaging Assembly Manufacturing, Reliability and Testing

by Liu, Shen; Liu, Yong

• ISBN13: 9780470827802
• ISBN10: 0470827807
• Edition: 1st
• Format: Hardcover
• Copyright: 2011-05-17
• Publisher: Wiley

Summary

Teaches the skills needed to shorten the time for design, manufacturing, reliability, and testing of microelectronic package assembly Liu and Liu begin with an overview of mechanics and modeling, including modeling validation tools and an explanation of concurrent engineering. They then move on to modeling in microelectronic packaging and assembly, coving packaging and assembly for typical ICs, optoelectronics, MEMS, SIP/3D, and nano interconnects. The next section explains modeling methods for package reliability and test, followed my modern modeling and simulation methodologies. Models and simulates numerous processes in manufacturing, reliability and testing for the first time Provides the skills necessary for virtual prototyping and virtual reliability qualification and testing Demonstrates concurrent engineering and co-design approaches for advanced engineering design of microelectronic products. Subroutines and color images available for download from the books Companion Site

Author Biography

Sheng Liu is a ChangJiang Professor of Mechanical Engineering at Huazhong University of Science and Technology. He holds a dual appointment at Wuhan National Laboratory for Optoelectronics, and has served as tenured faculty at Wayne State University. He has over 14 years experience in LED/MEMS/IC packaging and extensive experience in consulting with many leading multi-national and Chinese companies. Liu was awarded the White House/NSF Presidential Faculty Fellowship in 1995, ASME Young Engineer Award in 1996, and China NSFC Overseas Young Scientist in 1999. He is currently one of the 11 National Committee Members in LED under Ministry of Science and Technology. He obtained a Ph.D. from Stanford in 1992, and got MS and BS in flight vehicle design, Nanjing University of Aeronautics and Astronautics, and he had three years industrial experience in China and USA. He has filed more than 70 patents in China and the USA, and has published more than 300 technical articles.

Yong Liu is a global team leader of electrical, thermal-mechanical modeling and analysis at Fairchild Semiconductor Corp in South Portland, Maine. His main interest areas are IC packaging, modeling and simulation, reliability and material characterization. He has previously served as Professor at Zhejiang University of Technology, and has worked as an opto package engineer at Nortel Networks in Boston. Liu has co-authored over 100 papers in journals and conferences, has filed over 40 US patents in the area of IC packaging and power device, and has won numerous awards and fellowships in academia and industry: the Fairchild President Award, Fairchild Key Technologist, Fairchild New Product Innovation Award, the Alexander von Humboldt European Fellowship for study at Braunschweig University of Technology and University of Cambridge. Liu holds a PhD from Nanjing University of Science and Technology.

Table of Contents

Foreword	p. xiii
Foreword
Preface	p. xvii
Acknowledgments	p. xix
About the Authors xxi
Mechanics and Modeling	p. 1
Constitutive Models and Finite Element Method	p. 3
Constitutive Models for Typical Materials	p. 3
Linear Elasticity	p. 3
Elastic-Visco-Plasticity	p. 5
Finite Element Method	p. 9
Basic Finite Element Equations	p. 9
Nonlinear Solution Methods	p. 12
Advanced Modeling Techniques in Finite Element Analysis	p. 14
Finite Element Applications in Semiconductor Packaging Modeling	p. 17
Chapter Summary	p. 18
References	p. 19
Material and Structural Testing for Small Samples	p. 21
Material Testing for Solder Joints	p. 21
Specimens	p. 21
A Thermo-Mechanical Fatigue Tester	p. 23
Tensile Test	p. 24
Creep Test	p. 26
Fatigue Test	p. 31
Scale Effect of Packaging Materials	p. 32
Specimens	p. 33
Experimental Results and Discussions	p. 34
Thin Film Scale Dependence for Polymer Thin Films	p. 39
Two-Ball Joint Specimen Fatigue Testing	p. 41
Chapter Summary	p. 41
References	p. 43
Constitutive and User-Supplied Subroutines for Solders Considering Damage Evolution	p. 45
Constitutive Model for Tin-Lead Solder Joint	p. 45
Model Formulation	p. 45
Determination of Material Constants	p. 47
Model Prediction	p. 49
Visco-Elastic-Plastic Properties and Constitutive Modeling of Underfills	p. 50
Constitutive Modeling of Underfills	p. 50
Identification of Material Constants	p. 55
Model Verification and Prediction	p. 55
A Damage Coupling Framework of Unified Viscoplasticity for the Fatigue of Solder Alloys	p. 56
Damage Coupling Thermodynamic Framework	p. 56
Large Deformation Formulation	p. 62
Identification of the Material Parameters	p. 63
Creep Damage	p. 66
User-Supplied Subroutines for Solders Considering Damage Evolution	p. 67
Return-Mapping Algorithm and FEA Implementation	p. 67
Advanced Features of the Implementation	p. 69
Applications of the Methodology	p. 71
Chapter Summary	p. 76
References	p. 76
Accelerated Fatigue Life Assessment Approaches for Solders in Packages	p. 79
Life Prediction Methodology	p. 79
Strain-Based Approach	p. 80
Energy-Based Approach	p. 82
Fracture Mechanics-Based Approach	p. 82
Accelerated Testing Methodology	p. 82
Failure Modes via Accelerated Testing Bounds	p. 83
Isothermal Fatigue via Thermal Fatigue	p. 83
Constitutive Modeling Methodology	p. 83
Separated Modeling via Unified Modeling	p. 83
Viscoplasticity with Damage Evolution	p. 84
Solder Joint Reliability via FEA	p. 84
Life Prediction of Ford Joint Specimen	p. 84
Accelerated Testing: Insights from Life Prediction	p. 87
Fatigue Life Prediction of a PQFP Package	p. 91
Life Prediction of Flip-Chip Packages	p. 93
Fatigue Life Prediction with and without Underfill	p. 93
Life Prediction of Flip-Chips without Underfill via Unified and Separated Constitutive Modeling	p. 95
Life Prediction of Flip-Chips under Accelerated Testing	p. 96
Chapter Summary	p. 99
References	p. 99
Multi-Physics and Multi-Scale Modeling	p. 103
Multi-Physics Modeling	p. 103
Direct-Coupled Analysis	p. 103
Sequential Coupling	p. 104
Multi-Scale Modeling	p. 106
Chapter Summary	p. 107
References	p. 108
Modeling Validation Tools	p. 109
Structural Mechanics Analysis	p. 109
Requirements of Experimental Methods for Structural Mechanics Analysis	p. 111
Whole Field Optical Techniques	p. 112
Thermal Strains Measurements Using Moire Interferometry	p. 113
Thermal Strains in a Plastic Ball Grid Array (PBGA) Interconnection	p. 113
Real-Time Thermal Deformation Measurements Using Moire Interferometry	p. 116
In-Situ Measurements on Micro-Machined Sensors	p. 116
Micro-Machined Membrane Structure in a Chemical Sensor	p. 116
In-Situ Measurement Using Twyman-Green Interferometry	p. 118
Membrane Deformations due to Power Cycles	p. 118
Real-Time Measurements Using Speckle Interferometry	p. 119
Image Processing and Computer Aided Optical Techniques	p. 120
Image Processing for Fringe Analysis	p. 120
Phase Shifting Technique for Increasing Displacement Resolution	p. 120
Real-Time Thermal-Mechanical Loading Tools	p. 123
Micro-Mechanical Testing	p. 123
Environmental Chamber	p. 124
Warpage Measurement Using PM-SM System	p. 124
Shadow Moire and Project Moire Setup	p. 125
Warpage Measurement of a BGA, Two Crowded PCBs	p. 127
Chapter Summary	p. 131
References	p. 131
Application of Fracture Mechanics	p. 135
Fundamental of Fracture Mechanics	p. 135
Energy Release Rate	p. 136
J Integral	p. 138
Interfacial Crack	p. 139
Bulk Material Cracks in Electronic Packages	p. 141
Background	p. 141
Crack Propagation in Ceramic/Adhesive/Glass System	p. 142
Results	p. 146
Interfacial Fracture Toughness	p. 148
Background	p. 148
Interfacial Fracture Toughness of Flip-Chip Package between Passivated Silicon Chip and Underfill	p. 150
Three-Dimensional Energy Release Rate Calculation	p. 159
Fracture Analysis	p. 160
Results and Comparison	p. 160
Chapter Summary	p. 165
References	p. 165
Concurrent Engineering for Microelectronics	p. 169
Design Optimization	p. 169
New Developments and Trends in Integrated Design Tools	p. 179
Chapter Summary	p. 183
References	p. 183
Modeling in Microelectronic Packaging and Assembly	p. 185
Typical IC Packaging and Assembly Processes	p. 187
Wafer Process and Thinning	p. 188
Wafer Process Stress Models	p. 188
Thin Film Deposition	p. 189
Backside Grind for Thinning	p. 191
Die Pick Up	p. 193
Die Attach	p. 198
Material Constitutive Relations	p. 200
Modeling and Numerical Strategies	p. 201
FEA Simulation Result of Flip-Chip Attach	p. 204
Wire Bonding	p. 206
Assumption, Material Properties and Method of Analysis	p. 207
Wire Bonding Process with Different Parameters	p. 208
Impact of Ultrasonic Amplitude	p. 210
Impact of Ultrasonic Frequency	p. 212
Impact of Friction Coefficients between Bond Pad and FAB	p. 214
Impact of Different Bond Pad Thickness	p. 217
Impact of Different Bond Pad Structures	p. 217
Modeling Results and Discussion for Cooling Substrate Temperature after Wire Bonding	p. 221
Molding	p. 223
Molding Flow Simulation	p. 223
Curing Stress Model	p. 230
Molding Ejection and Clamping Simulation	p. 236
Leadframe Forming/Singulation	p. 241
Euler Forward versus Backward Solution Method	p. 242
Punch Process Setup	p. 242
Punch Simulation by ANSYS Implicit	p. 244
Punch Simulation by LS-DYNA	p. 246
Experimental Data	p. 248
Chapter Summary	p. 252
References	p. 252
Opto Packaging and Assembly	p. 255
Silicon Substrate Based Opto Package Assembly	p. 255
State of the Technology	p. 255
Monte Carlo Simulation of Bonding/Soldering Process	p. 256
Effect of Matching Fluid	p. 256
Effect of the Encapsulation	p. 258
Welding of a Pump Laser Module	p. 258
Module Description	p. 258
Module Packaging Process Flow	p. 258
Radiation Heat Transfer Modeling for Hermetic Sealing Process	p. 259
Two-Dimensional FEA Modeling for Hermetic Sealing	p. 260
Cavity Radiation Analyses Results and Discussions	p. 262
Chapter Summary	p. 264
References	p. 264
MEMS and MEMS Package Assembly	p. 267
A Pressure Sensor Packaging (Deformation and Stress)	p. 267
Piezoresistance in Silicon	p. 268
Finite Element Modeling and Geometry	p. 270
Material Properties	p. 270
Results and Discussion	p. 271
Mounting of Pressure Sensor	p. 273
Mounting Process	p. 273
Modeling	p. 274
Results	p. 276
Experiments and Discussions	p. 277
Thermo-Fluid Based Accelerometer Packaging	p. 279
Device Structure and Operation Principle	p. 279
Linearity Analysis	p. 280
Design Consideration	p. 284
Fabrication	p. 285
Experiment	p. 285
Plastic Packaging for a Capacitance Based Accelerometer	p. 288
Micro-Machined Accelerometer	p. 289
Wafer-Level Packaging	p. 290
Packaging of Capped Accelerometer	p. 296
Tire Pressure Monitoring System (TPMS) Antenna	p. 303
Test of TPMS System with Wheel Antenna	p. 304
3D Electromagnetic Modeling of Wheel Antenna	p. 306
Stress Modeling of Installed TPMS	p. 307
Thermo-Fluid Based Gyroscope Packaging	p. 310
Operating Principle and Design	p. 312
Analysis of Angular Acceleration Coupling	p. 313
Numerical Simulation and Analysis	p. 314
Microjets for Radar and LED Cooling	p. 316
Microjet Array Cooling System	p. 319
Preliminary Experiments	p. 320
Simulation and Model Verification	p. 322
Comparison and Optimization of Three Microjet Devices	p. 324
Air Flow Sensor	p. 327
Operation Principle	p. 329
Simulation of Flow Conditions	p. 331
Simulation of Temperature Field on the Sensor Chip Surface	p. 333
Direct Numerical Simulation of Particle Separation by Direct Current Dielectrophoresis	p. 335
Mathematical Model and Implementation	p. 335
Results and Discussion	p. 339
Modeling of Micro-Machine for Use in Gastrointestinal Endoscopy	p. 341
Methods	p. 343
Results and Discussion	p. 348
Chapter Summary	p. 353
References	p. 354
System in Package (SIP) Assembly	p. 361
Assembly Process of Side by Side Placed SIP	p. 361
Multiple Die Attach Process	p. 361
Cooling Stress and Warpage Simulation after Molding	p. 365
Stress Simulation in Trim Process	p. 366
Impact of the Nonlinear Materials Behaviors on the Flip-Chip Packaging Assembly Reliability	p. 369
Finite Element Modeling and Effect of Material Models	p. 371
Experiment	p. 374
Results and Discussions	p. 375
Stacked Die Flip-Chip Assembly Layout and the Material Selection	p. 381
Finite Element Model for the Stack Die FSBGA	p. 383
Assembly Layout Investigation	p. 385
Material Selection	p. 389
Chapter Summary	p. 393
References	p. 393
Modeling in Microelectronic Package Reliability and Test	p. 395
Wafer Probing Test	p. 397
Probe Test Model	p. 397
Parameter Probe Test Modeling Results and Discussions	p. 400
Impact of Probe Tip Geometry Shapes	p. 401
Impact of Contact Friction	p. 403
Impact of Probe Tip Scrub	p. 403
Comparison Modeling: Probe Test versus Wire Bonding	p. 406
Design of Experiment (DOE) Study and Correlation of Probing Experiment and FEA Modeling	p. 409
Chapter Summary	p. 411
References	p. 412
Power and Thermal Cycling, Solder Joint Fatigue Life	p. 413
Die Attach Process and Material Relations	p. 413
Power Cycling Modeling and Discussion	p. 413
Thermal Cycling Modeling and Discussion	p. 420
Methodology of Solder Joint Fatigue Life Prediction	p. 426
Fatigue Life Prediction of a Stack Die Flip-Chip on Silicon (FSBGA)	p. 427
Effect of Cleaned and Non-Cleaned Situations on the Reliability of Flip-Chip Packages	p. 434
Finite Element Models for the Clean and Non-Clean Cases	p. 435
Model Evaluation	p. 435
Reliability Study for the Solder Joints	p. 437
Chapter Summary	p. 438
References	p. 439
Passivation Crack Avoidance	p. 441
Ratcheting-Induced Stable Cracking: A Synopsis	p. 441
Ratcheting in Metal Films	p. 445
Cracking in Passivation Films	p. 447
Design Modifications	p. 452
Chapter Summary	p. 452
References	p. 452
Drop Test	p. 453
Controlled Pulse Drop Test	p. 453
Simulation Methods	p. 454
Simulation Results	p. 457
Parametric Study	p. 458
Free Drop	p. 460
Simulated Drop Test Procedure	p. 460
Modeling Results and Discussion	p. 461
Portable Electronic Devices Drop Test and Simulation	p. 467
Test Set-Up	p. 467
Modeling and Simulation	p. 468
Results	p. 470
Chapter Summary	p. 470
References	p. 471
Electromigration	p. 473
Basic Migration Formulation and Algorithm	p. 473
Electromigration Examples from IC Device and Package	p. 477
A Sweat Structure	p. 477
A Flip-Chip CSP with Solder Bumps	p. 480
Chapter Summary	p. 496
References	p. 497
Popcorning in Plastic Packages	p. 499
Statement of Problem	p. 499
Analysis	p. 501
Results and Comparisons	p. 503
Behavior of a Delaminated Package due to Pulsed Heating-Verification	p. 503
Convergence of the Total Strain Energy Release Rate	p. 504
Effect of Delamination Size and Various Processes for a Thick Package	p. 505
Effect of Moisture Expansion Coefficient	p. 514
Chapter Summary	p. 515
References	p. 516
Modern Modeling and Simulation Methodologies: Application to Nano Packaging	p. 519
Classical Molecular Dynamics	p. 521
General Description of Molecular Dynamics Method	p. 521
Mechanism of Carbon Nanotube Welding onto the Metal	p. 522
Computational Methodology	p. 522
Results and Discussion	p. 523
Applications of Car-Parrinello Molecular Dynamics	p. 530
Car-Parrinello Simulation of Initial Growth Stage of Gallium Nitride on Carbon Nanotube	p. 530
Effects of Mechanical Deformation on Outer Surface Reactivity of Carbon Nanotubes	p. 534
Adsorption Configuration of Magnesium on Wurtzite Gallium Nitride Surface Using First-Principles Calculations	p. 539
Nano-Welding by RF Heating	p. 544
Chapter Summary	p. 548
References	p. 548
Index	p. 553
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