Nanopackaging

by Morris, James E.

• ISBN13: 9780387473253
• ISBN10: 0387473254
• Format: Hardcover
• Copyright: 2008-10-03
• Publisher: Springer Verlag

Summary

Nanotechnologies are being applied to microelectronics packaging, primarily in the applications of nanoparticle nanocomposites, or in the exploitation of the superior mechanical, electrical, or thermal properties of carbon nanotubes. Composite materials are studied for high-k dielectrics, resistors and inductors, electrically conductive adhesives, conductive"inks," underfill fillers, and solder enhancement."Nanopackaging" is intended for industrial and academic researchers, industrial electronics packaging engineers who need to keep abreast of their field, and others with interests in nanotechnology. It will survey the application of nanotechnologies to electronics packaging, as represented by current research across the field.

Table of Contents

Nanopackaging: Nanotechnologies and Electronics Packaging	p. 1
Modelling Technologies and Applications	p. 15
Application of Molecular Dynamics Simulation in Electronic Packaging	p. 39
Advances in Delamination Modeling	p. 61
Nanoparticle Properties	p. 93
Nanoparticle Fabrication	p. 109
Nanoparticle-Based High-k Dielectric Composites: Opportunities and Challenges	p. 121
Nanostructured Resistor Materials	p. 139
Nanogranular Magnetic Core Inductors: Design, Fabrication, and Packaging	p. 163
Nanoconductive Adhesives	p. 189
Nanoparticles in Microvias	p. 209
Materials and Technology for Conductive Microstructures	p. 239
A Study of Nanoparticles in SnAg-Based Lead-Free Solders	p. 265
Nano-Underfills for Fine-Pitch Electronics	p. 287
Carbon Nanotubes: Synthesis and Characterization	p. 325
Characteristics of Carbon Nanotubes for Nanoelectronic Device Applications	p. 345
Carbon Nanotubes for Thermal Management of Microsystems	p. 377
Electromagnetic Shielding of Transceiver Packaging Using Multiwall Carbon Nanotubes	p. 395
Properties of 63Sn-37Pb and Sn-3.8Ag-0.7Cu Solders Reinforced With Single-Wall Carbon Nanotubes	p. 415
Nanowires in Electronics Packaging	p. 441
Design and Development of Stress-Engineered Compliant Interconnect for Microelectronic Packaging	p. 465
Flip Chip Packaging for Nanoscale Silicon Logic Devices: Challenges and Opportunities	p. 491
Nanoelectronics Landscape: Application, Technology, and Economy	p. 517
Index	p. 537
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