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Pcb Design for Real-World Emi Control,9781402071300
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Pcb Design for Real-World Emi Control

by
ISBN13:

9781402071300

ISBN10:
1402071302
Format:
Hardcover
Pub. Date:
8/1/2002
Publisher(s):
Kluwer Academic Pub
List Price: $183.00
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Summary

PCB Design for Real-World EMI Control is intended for EMC designers and electronic design engineers. It emphasizes understanding basic concepts of controlling the currents on printed circuit boards (pcb's), and provides a wealth of insightful information detailing the possible sources of emissions. Numerous design strategies are presented to help readers understand how to produce, control and eliminate emission sources.Additional highlights include the following:-Information explaining how to design pcb's to pass EMC Requirements the first time! -Controlling intentional and unintentional currents at their source; -Decoupling strategies explained and myths exposed; -Proper I/O filter design and connection strategy explained; -Not simply a list of do's and don't's....but an explanation of "why" things work as they do; -"Ground is a place where potatoes and carrots grow!" -Basic shielding design considerations for PCBs included, and more.This 'hands-on' book will help designers understand "why" or "why not" to implement a specific design practice. PCB Design for Real-World EMI Control will be an invaluable resource for the pcb designer.

Table of Contents

Introduction to EMI/EMC Design for Printed Circuit Boards
1(8)
Introduction to EMI/EMC
1(3)
EMI Emissions Sources
4(1)
Inductance
5(1)
``Ground''
6(1)
Shielding
6(1)
Summary
7(2)
EMC Fundamentals
9(16)
Introduction
9(1)
Coupling Mechanisms
10(4)
Electric Field Coupling
10(2)
Magnetic Field Coupling
12(2)
Signal Spectra
14(5)
Clock Signals Harmonic Frequencies
14(3)
Hertz vs. Bits-per-Second
17(1)
Non-Squarewave Data Signals
18(1)
Resonance Effects
19(2)
Magic and Luck
20(1)
Potential Emissions Sources
21(2)
Shielded Products
21(1)
Unshielded Products
22(1)
Intentional Signal Content
23(1)
Summary
23(2)
What is Inductance?
25(18)
Introduction
25(1)
Electromagnetic Induction
25(2)
Mutual Inductance
27(2)
Self-Inductance
29(7)
Self-Inductance per Unit Length
33(3)
Partial Inductance
36(4)
Summary
40(3)
The Ground Myth
43(26)
Where Did The Term ``Ground'' Originate?
43(3)
What Do We Mean When We Say ``Ground''?
46(9)
Signal Reference
46(3)
Power Reference
49(1)
Chassis Reference
50(1)
Unshielded Cables
51(3)
Shielded Cables
54(1)
Earth Safety Reference
55(1)
`Ground' is Not a Current Sink
55(1)
Referencing Strategies
55(3)
Single-Point Ground-Reference Strategy
56(1)
Multi-Point Ground-Reference Strategy
56(2)
Grounding Heatsinks to PC boards
58(6)
Heatsink ``Grounding'' Example
61(3)
PCB Reference Connection to Chassis Reference
64(2)
I/O Area Connection
64(2)
Summary
66(3)
Return Current Design
69(16)
Introduction
69(2)
Split Reference Planes
71(5)
Stitching Capacitors
72(4)
Trace Changing Reference Planes
76(4)
Motherboards and Daughter Cards
80(3)
Connector Pin Assignments
82(1)
Summary
83(2)
Controlling EMI Sources -- Intentional Signals
85(20)
Introduction
85(1)
Critical Signals
86(1)
Intentional Signals
86(7)
Intentional Signals -- Loop-Mode
93(2)
Controlling Emissions from Intentional Signals -- Loop-Mode
95(1)
Intentional Signals -- Common-mode
96(3)
Intentional Signals -- Common-mode with Interrupted Return Path
99(3)
Critical Signal Traces Crossing Splits
99(1)
Critical Signals Through Vias
100(2)
Summary
102(3)
Controlling EMI Sources -- Unintentional Signals
105(16)
Introduction
105(1)
Unintentional Signals
106(1)
Unintentional Signals -- Common-mode
106(2)
Controlling Emissions from Unintentional Signals -- Common-mode
108(5)
Unintentional Signals -- `Crosstalk' Coupling onto I/O Lines
113(2)
Controlling Emissions from Unintentional Signals -- `Crosstalk' Coupling to I/O Lines
115(3)
Summary
118(3)
Decoupling Power/Ground Planes
121(30)
Introduction
121(1)
Background
122(2)
Calculating the Source of Decoupling Noise
124(6)
Decoupling Noise from ASIC/ICs power pins
124(6)
Decoupling Capacitor Effectiveness
130(18)
Test Board Description
131(3)
Empty Test Board Configuration
134(2)
Quantity of Distributed (Global) Decoupling Capacitors (.0luf Only)
136(1)
Quantity of Distributed Decoupling Capacitors (0.0luf and 330 pF)
137(3)
Selecting the Value of the Decoupling Capacitors
140(1)
Perfect Decoupling Capacitors
140(1)
Source Vs Distributed Decoupling
141(3)
Buried Capacitance Decoupling
144(2)
Lossy Capacitors
146(2)
Summary
148(3)
EMC Filter Design
151(20)
Introduction
151(1)
Filter Design Concepts
151(4)
Filter Configurations
155(8)
Two-Component Filter Configurations
155(2)
Reference Connection for Two-Component Filters
157(4)
Three Component Filter Configurations
161(2)
Single Component Filter Configurations
163(1)
Non-Ideal Components and the Impact on Filters
163(5)
Non-Ideal Capacitors
164(2)
Non-Ideal Ferrite Beads
166(2)
Non-Ideal Zero Ohm Resistors
168(1)
Common-Mode Filters
168(1)
Summary
169(2)
Using Signal Integrity Tools for EMC Analysis
171(16)
Introduction
171(1)
Intentional Current Spectrum
172(5)
Trace Current for Decoupling Analysis
177(2)
Differential Signals Analysis
179(6)
Internal Differential Signal Lines
181(1)
External I/O Differential Signal Lines
182(3)
Crosstalk Analysis
185(1)
Summary
185(2)
Printed Circuit Board Layout
187(12)
Introduction
187(1)
PC Board Stack-up
187(8)
Many Layer Boards
188(3)
Six-Layer Boards
191(1)
Four-Layer Boards
192(1)
One and Two-Layer Boards
193(2)
Component Placement
195(1)
Isolation
195(1)
Summary
196(3)
Shielding in Enclosures with Apertures
199(22)
Introduction
199(3)
Resonance Mode within Shielded Enclosures
202(6)
Shielded Enclosures
208(5)
Apertures and Openings
208(2)
Gaskets
210(3)
Predicting the Shielding Effectiveness of Enclosures with Apertures
213(2)
Shielding the PC Board Edge
215(1)
Cable Shields
216(2)
Summary
218(3)
What To Do If a Product Fails in the EMC Lab
221(10)
Introduction
221(1)
Where Does the Signal Come From?
222(1)
How Does the Signal Get Out of the Shielded Enclosure?
223(4)
Leaks through slots holes and apertures
223(2)
Conducted through the shield on cables and wires
225(1)
Leaks from imperfect mating of shielded cable shields to the enclosure
226(1)
Coupling Mechanism
227(2)
Case 1 Clock signal leaking from seam
228(1)
Case 2 Clock signal leaking from an unshielded cable
228(1)
Summary
229(2)
Appendix A Introduction to EMI/EMC Computational Modeling 231(10)
A.1 Introduction
231(1)
A.2 Why Is EMI/EMC Modeling Important?
232(1)
A.3 EMI/EMC Modeling: State of the Art
233(1)
A.4 Tool Box Approach
234(1)
A.5 Brief Description of EMI Modeling Techniques
235(4)
A.5.1 Finite Difference Time-Domain
235(2)
A.5.2 Method of Moments
237(1)
A.5.3 Finite Element Method
238(1)
A.6. Other Uses for Electromagnetic Modeling
239(1)
A.7. Summary
239(2)
Index 241


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