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Stress Management for 3D ICs Using Through Silicon Vias: International Workshop on Stress Management for 3D ICs Using Through Silicon Via, Albany, NY, U.S.A., March 16, 2010, San Francisco, CA, U.S.A. July 1

by Zschech, Ehrenfried; Radojcic, Riko; Sukharev, Valeriy; Smith, Larry

ISBN13: 9780735409385
ISBN10: 0735409382

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Format: NEW
Copyright: 11/23/2011
Publisher: Amer Inst of Physics

Availability: Usually Ships in 3-5 Business Days

Condition: NEW

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Price: $135.32

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