Sub-half-micron Lithography for Ulsis

by Edited by Katsumi Suzuki , Shinji Matsui , Yukinori Ochiai

• ISBN13: 9780521022347
• ISBN10: 0521022347
• Format: Paperback
• Copyright: 2005-11-10
• Publisher: Cambridge University Press

Summary

In semiconductor-device fabrication processes, lithography technology is used to print circuit patterns on semiconductor wafers. The remarkable miniaturization of semiconductor devices has been made possible only because of the continuous progress in lithography technology. However, for the trend of ever-increasing miniaturization to continue, a breakthrough in lithography technology is now needed. This book describes advanced techniques under development that represent the key to future semiconductor-device fabrication. To help the reader understand the background to developments in lithography technology, trends in ULSI technology and future prospects are reviewed, and the requirements that future lithography technology must meet are described. Several important lithography methods, such as deep UV lithography, x-ray lithography, electron-beam lithography, and focused ion-beam lithography are described in detail by experts in each area. Other relevant technologies, such as those that concern resist materials, metrology, and defect inspection and repair are also described.

Table of Contents

1. Introduction Masao Fukuma

2. Optical lithography Kunihiko Kasama, Shinji Okazaki, Hisatake Sano and Wataru Wakamiya

3. X-ray lithography Kimiyoshi Deguchi, Teruo Hosokawa, Sunao Ishihara and Katsumi Suzuki

4. Electron beam lithography Takayuki Abe, Koichi Moriizumi, Yukinori Ochiai, Norio Saitou, Tadahiro Takigawa and Akio Yamada

5. Ion beam lithography Masanori Komuro and Shinj Matsui

6. Resists Hiroshi Ban, Tadayoshi Kokubo, Makoto Nakase and Takeshi Ohfuji

7. Metrology, defect inspection and repair Tadahito Matsuda, Toru Tojo and Seiichi Yabumoto

Index.