What is included with this book?
Foreword | p. xvii |
Preface | p. xix |
Introduction to the System-on-Package (SOP) Technology | p. 3 |
Introduction | p. 4 |
Electronic System Trend to Digital Convergence | p. 5 |
Building Blocks of an Electronic System | p. 7 |
System Technologies Evolution | p. 8 |
Five Major System Technologies | p. 11 |
System-on-Board (SOB) Technology with Discrete Components | p. 11 |
System-on-Chip (SOC) with Two or More System Functions on a Single Chip | p. 11 |
Multichip Module (MCM): Package-Enabled Integration of Two or More Chips Interconnected Horizontally | p. 13 |
Stacked ICs and Packages (SIP): Package-Enabled IC Integration with Two or More Chip Stacking (Moore's Law in the Third Dimension) | p. 13 |
System-on-Package Technology (Module with the Best of IC and System Integration) | p. 18 |
Miniaturization Trend | p. 22 |
Comparison of the Five System Technologies | p. 23 |
Status of SOP around the Globe | p. 26 |
Opto SOP | p. 26 |
RF SOP | p. 28 |
Embedded Passives SOP | p. 29 |
MEMS SOP | p. 29 |
SOP Technology Implementations | p. 29 |
SOP Technologies | p. 33 |
Summary | p. 34 |
Acknowledgment | p. 34 |
References | p. 34 |
Introduction to System-on-Chip (SOC) | p. 39 |
Introduction | p. 40 |
Key Customer Requirements | p. 42 |
SOC Architecture | p. 44 |
SOC Design Challenge | p. 50 |
SOC Design Phase 1-SOC Definition and Challenges | p. 50 |
SOC Design Phase II-SOC Create Process and Challenges | p. 57 |
Summary | p. 76 |
References | p. 76 |
Stacked ICs and Packages (SIP) | p. 81 |
SIP Definition | p. 82 |
Definition | p. 82 |
Applications | p. 82 |
CEO Figure and SIP Categories | p. 82 |
SIP Challenges | p. 85 |
Materials and Process Challenges | p. 85 |
Mechanical Challenges | p. 87 |
Electrical Challenges | p. 88 |
Thermal Challenges | p. 89 |
Non-TSV SIP | p. 93 |
Historical Evolution of Non-TSV SIP | p. 93 |
Chip Stacking | p. 96 |
Package Stacking | p. 113 |
Chip Stacking versus Package Stacking | p. 120 |
TSV SIP | p. 121 |
Introduction | p. 121 |
Historical Evolution of 3D TSV Technology | p. 124 |
Basic TSV Technologies | p. 126 |
Different 3D Integration Technologies using TSV | p. 134 |
Si Carrier Technology | p. 141 |
Future Trends | p. 143 |
Acknowledgments | p. 144 |
References | p. 144 |
Mixed-Signal (SOP) Design | p. 151 |
Introduction | p. 152 |
Mixed-Signal Devices and Systems | p. 153 |
Importance of Integration in Mobile Applications | p. 155 |
Mixed-Signal Architecture | p. 156 |
Mixed-Signal Design Challenges | p. 157 |
Fabrication Technologies | p. 159 |
Design of Embedded Passives in RF Front End | p. 160 |
Embedded Inductors | p. 161 |
Embedded Capacitors | p. 166 |
Embedded Filters | p. 167 |
Embedded Baluns | p. 171 |
Filter-Balun Networks | p. 175 |
Tunable Filters | p. 178 |
Chip-Package Codesign | p. 180 |
Low Noise Amplifier Design | p. 181 |
Concurrent Oscillator Design | p. 184 |
Design of WLAN Front-End Module | p. 191 |
Design Tools | p. 194 |
Synthesis of Embedded RF Circuits | p. 195 |
Modeling of Signal and Power Delivery Networks | p. 198 |
Rational Functions, Network Synthesis, and Transient Simulation | p. 204 |
Design for Manufacturing | p. 208 |
Coupling | p. 214 |
Analog-to-Analog Coupling | p. 214 |
Digital-to-Analog Coupling | p. 222 |
Decoupling | p. 227 |
Need for Decoupling in Digital Applications | p. 228 |
Issues with SMD Capacitors | p. 229 |
Embedded Decoupling | p. 230 |
Characterization of Embedded Capacitors | p. 235 |
Electromagnetic Bandgap (EBG) Structures | p. 239 |
Analysis and Design of EBG Structures | p. 242 |
Application of EBGs in Power Supply Noise Suppression | p. 246 |
Radiation Analysis of EBGs | p. 248 |
Summary | p. 250 |
Acknowledgments | p. 251 |
References | p. 251 |
Radio Frequency System-on-Package (RF SOP) | p. 261 |
Introduction | p. 262 |
RF SOP Concept | p. 262 |
Historical Evolution of RF Packaging Technologies | p. 265 |
RF SOP Technologies | p. 267 |
Modeling and Optimization | p. 267 |
RF Substrate Materials Technologies | p. 268 |
Antennas | p. 269 |
Inductors | p. 278 |
RF Capacitors | p. 282 |
Resistors | p. 288 |
Filters | p. 295 |
Baluns | p. 297 |
Combiners | p. 298 |
RF MEMS Switches | p. 300 |
RFIDs | p. 305 |
Integrated RF Modules | p. 308 |
WLAN | p. 308 |
Intelligent Network Communicator (INC) | p. 310 |
Future Trends | p. 312 |
Acknowledgments | p. 313 |
References | p. 314 |
Integrated Chip-to-Chip Optoelectronic SOP | p. 321 |
Introduction | p. 322 |
Applications of Optoelectronic SOP | p. 323 |
High-Speed Digital Systems and High-Performance Computing | p. 323 |
RF-Optical Communication Systems | p. 324 |
Integration Challenges in Thin-Film Optoelectronic SOP | p. 325 |
Optical Alignment | p. 326 |
Key Physical and Optical Properties of Thin-Film Optical Waveguide Materials | p. 326 |
Advantages of Optoelectronic SOP | p. 331 |
Comparison of High-Speed Electrical and Optical Wiring Performance | p. 331 |
Wiring Density | p. 332 |
Power Dissipation | p. 334 |
Reliability | p. 335 |
Evolution of Optoelectronic SOP Technology | p. 336 |
Board-to-Board Optical Wiring | p. 336 |
Chip-to-Chip Optical Interconnects | p. 339 |
Optoelectronic SOP Thin-Film Components | p. 341 |
Passive Thin-Film Lightwave Circuits | p. 342 |
Active Optoelectronic SOP Thin-Film Components | p. 354 |
Opportunities for 3D Lightwave Circuits | p. 355 |
SOP Integration: Interface Optical Coupling | p. 357 |
On-Chip Optical Circuits | p. 363 |
Future Trends in Optoelectronic SOP | p. 365 |
Summary | p. 365 |
References | p. 366 |
Table 6.1 References | p. 374 |
SOP Substrate with Multilayer Wiring and Thin-Film Embedded Components | p. 377 |
Introduction | p. 378 |
Historical Evolution of Substrate Integration Technologies | p. 380 |
SOP Substrate | p. 381 |
Drivers and Challenges | p. 381 |
Ultrathin-Film Wiring with Embedded Low-K Dielectrics, Cores, and Conductors | p. 384 |
Embedded Passives | p. 415 |
Embedded Actives | p. 430 |
Miniaturized Thermal Materials and Structures | p. 434 |
Future SOP Substrate Integration | p. 435 |
Acknowledgments | p. 437 |
References | p. 437 |
Mixed-Signal (SOP) Reliability | p. 443 |
System-Level Reliability Considerations | p. 445 |
Failure Mechanisms | p. 446 |
Design-for-Reliability | p. 447 |
Reliability Verification | p. 449 |
Reliability of Multifunction SOP Substrate | p. 450 |
Materials and Process Reliability | p. 450 |
Digital Function Reliability and Verification | p. 458 |
RF Function Reliability and Verification | p. 461 |
Optical Function Reliability and Verification | p. 463 |
Multifunction System Reliability | p. 467 |
Substrate-to-IC Interconnection Reliability | p. 468 |
Factors Affecting the Substrate-to-IC Interconnection Reliability | p. 469 |
100-¿m Flip-Chip Assembly Reliability | p. 471 |
Reliability against Die Cracking | p. 476 |
Solder Joint Reliability | p. 476 |
Interfacial Adhesion and Effect of Moisture on Underfill Reliability | p. 478 |
Future Trends and Directions | p. 482 |
Extending Solder | p. 483 |
Complaint Interconnects | p. 484 |
Alternative to Solder and Nano Interconnects | p. 484 |
Summary | p. 486 |
References | p. 487 |
MEMS Packaging | p. 495 |
Introduction | p. 496 |
Challenges in MEMS Packaging | p. 497 |
Chip-Scale versus Wafer-Scale Packaging | p. 497 |
Wafer Bonding Techniques | p. 499 |
Direct Bonding | p. 500 |
Bonding Using Intermediate Layers | p. 500 |
Sacrificial Film-Based Sealing Techniques | p. 505 |
Etching the Sacrificial Material | p. 505 |
Decomposition of Sacrificial Polymers | p. 509 |
Low-Loss Polymer Encapsulation Techniques | p. 514 |
Techniques Utilizing Getters | p. 516 |
Nonevaporable Getters | p. 516 |
Thin-Film Getters | p. 517 |
Improving MEMS Reliability through Getters | p. 520 |
Interconnections | p. 522 |
Assembly | p. 524 |
Summary and Future Trends | p. 527 |
References | p. 528 |
Wafer-Level SOP | p. 535 |
Introduction | p. 536 |
Definition | p. 536 |
Wafer-Level Packaging-Historical Evolution | p. 537 |
Buildup Wiring and Redistribution | p. 540 |
IC-Package Pitch Gap | p. 540 |
Redistribution Layers on Si to Close the Pitch Gap | p. 543 |
Wafer-Level Thin-Film Embedded Components | p. 544 |
Embedded Thin-Film Components in the ReDistribution Layer (RDL) | p. 544 |
Wafer-Level Packaging and Interconnections (WLPI) | p. 548 |
Classes of Wafer-Level Packaging and Interconnections (WLPI) | p. 552 |
Rigid Interconnections | p. 560 |
WLSOP Assembly | p. 585 |
WLSOP | p. 590 |
Wafer-Level Probing and Burn-In | p. 591 |
Summary | p. 595 |
Acknowledgments | p. 595 |
References | p. 595 |
Thermal SOP | p. 605 |
Fundamentals of Thermal SOP | p. 606 |
Thermal Implications of SOP | p. 607 |
System-Level Thermal Constraints in SOP-Based Portables | p. 609 |
Thermal Sources in SOP Modules | p. 610 |
Digital SOP | p. 611 |
RF SOP | p. 613 |
Optoelectronic SOP | p. 615 |
MEMS SOP | p. 617 |
Fundamental Heat Transfer Modes | p. 618 |
Conduction | p. 618 |
Convection | p. 623 |
Radiation | p. 626 |
Fundamentals of Thermal Characterization | p. 629 |
Numerical Methods for Thermal Characterization | p. 629 |
Experimental Methods for Thermal Characterization | p. 637 |
Thermal Management Technologies | p. 637 |
Thermal Design Methodologies | p. 638 |
Power Minimization Methodologies | p. 648 |
Parallel Processing | p. 649 |
Dynamic Voltage and Frequency Scaling (DVFS) | p. 649 |
Application-Specific Processors (ASP) | p. 650 |
Cache Power Minimization | p. 650 |
Power Harnessing | p. 651 |
Summary | p. 651 |
Acknowledgments | p. 651 |
References | p. 652 |
Electrical Test of SOP Modules and Systems | p. 659 |
SOP Electrical Test Challenges | p. 660 |
Objectives of the HVM Test Process and Challenges for SOPs | p. 662 |
HVM Test Flow for SOPs | p. 663 |
Known Good Embedded Substrate Test | p. 664 |
Substrate Interconnect Tests | p. 664 |
Testing Embedded Passives | p. 671 |
Known Good Embedded Module Test of Digital Subsystems | p. 677 |
Boundary Scan-IEEE 1149.1 | p. 677 |
Multi-gigahertz Digital Test: Recent Developments | p. 681 |
KGEM Test of Mixed-Signal and RF Subsystems | p. 685 |
Test Strategies | p. 685 |
Fault Models and Test Quality | p. 688 |
Direct Measurement of Specifications Using Dedicated Circuitry | p. 689 |
Alternate Testing Methods for Mixed-Signal and RF Circuits | p. 690 |
Summary | p. 707 |
Acknowledgments | p. 707 |
References | p. 707 |
Biosensor SOP | p. 717 |
Introduction to Biosensor SOP | p. 717 |
SOP: A Highly Miniaturized Electronic System Technology | p. 717 |
Biosensor SOP for Miniaturized Biomedical Implants and Sensor Systems | p. 718 |
Building Blocks of Biosensor SOP | p. 723 |
Biosensing | p. 723 |
Microchannels for Biofluid Transport | p. 723 |
Biosensing Element (Probe) Design and Preparation | p. 724 |
Probe-Target Molecular Hybridization | p. 727 |
Signal Conversion | p. 730 |
Nanomaterials and Nanostructures for Signal Conversion Components | p. 730 |
Surface Modification and Biofunctionalization of Signal Conversion Component | p. 734 |
Signal Conversion Methods | p. 735 |
Signal Detection and Electronic Processing | p. 741 |
Low-Power Application-Specific Integrated Circuits (ASICs) and Mixed-Signal Design for Biosensor SOP | p. 741 |
Bio- SOP Substrate Integration Technologies | p. 744 |
Summary and Future Trends | p. 745 |
Nano Bio-SOP Integration Challenges | p. 745 |
References | p. 746 |
Index | p. 749 |
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