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Preface | p. XIII |
Glossary | p. XV |
Introduction | p. 1 |
Organic Electronics: History and Market Opportunities | p. 3 |
Large-Area Displays | p. 4 |
Rollable Displays | p. 5 |
Radio Frequency Identification (RFID) Tag | p. 6 |
Technological Challenges | p. 6 |
Device Performance | p. 7 |
Device Manufacture | p. 8 |
Scope and Organization | p. 8 |
References | p. 10 |
Organic Thin Film Transistor (OTFT) Overview | p. 13 |
Organic Semiconductor Overview | p. 14 |
Basic Properties | p. 15 |
Charge Transport | p. 17 |
Micro structure and Molecular Alignment | p. 18 |
Material Development and Classifications | p. 21 |
Small Molecules | p. 22 |
Polymers | p. 24 |
n-Type Semiconductors | p. 25 |
Sensitivity to Environmental Influences | p. 26 |
OTFT Operation and Characteristics | p. 27 |
OTFT Parameter Extraction | p. 30 |
Contact Resistance Extraction | p. 32 |
Desirable OTFT Characteristics | p. 34 |
OTFT Device Architecture | p. 34 |
Top-Contact and Bottom-Contact OTFTs | p. 35 |
Top-Gate, Bottom-Gate, and Dual-Gate OTFTs | p. 37 |
OTFT Device Material Selection | p. 38 |
Organic Semiconductor | p. 39 |
Gate Dielectric | p. 41 |
Electrodes/Contacts | p. 43 |
Substrate | p. 45 |
Encapsulation Strategies | p. 47 |
Summary | p. 49 |
References | p. 49 |
OTFT Integration Strategies | p. 55 |
Technological Challenge in OTFT Integration | p. 55 |
Overview of Processing and Fabrication Techniques | p. 58 |
Deposition Methods for Organic Semiconductors | p. 61 |
Vacuum Evaporation | p. 61 |
Solution-Processed Deposition | p. 61 |
Patterning by Shadow Mask | p. 62 |
Patterning by Photolithography | p. 64 |
Photolithography Basics | p. 65 |
Photolithography Considerations for OTFTs | p. 66 |
Patterning by Inkjet Printing | p. 68 |
Inkjet Printing of OTFTs | p. 71 |
Improved Resolution by Surface-Energy Assisted Inkjet Printing | p. 72 |
Printing Peripheral Circuit: Vias and Interconnects | p. 73 |
Microcontact Printing | p. 73 |
Other Deposition Methods | p. 75 |
OTFT Fabrication Schemes | p. 76 |
Basic One-Mask Processing Scheme for Bottom-Gate OTFT | p. 76 |
Photolithography Scheme for Fully-Patterned and Fully-Encapsulated Bottom-Gate OTPT | p. 78 |
Directly Patterned OTFTs | p. 79 |
Indirectly Patterned OTFTs | p. 81 |
Hybrid Photolithography-Inkjet Printing Scheme for Fully-Patterned Bottom-Gate OTFT | p. 83 |
Photolithography Scheme for Top-Gate and Dual-Gate OTFTs | p. 85 |
Top-GateOTFT | p. 87 |
Dual-Gate OTFT | p. 90 |
Analysis | p. 92 |
Fabrication Scheme Comparisons | p. 93 |
Summary and Contributions | p. 94 |
References | p. 96 |
Gate Dielectrics by Plasma Enhanced Chemical Vapor Deposition (PECVD) | p. 101 |
Overview of Gate Dielectrics | p. 101 |
Organic Dielectrics | p. 101 |
Inorganic Dielectrics | p. 104 |
Experimental Details and Characterization Methods | p. 105 |
Deposition Conditions of PECVD Silicon Nitride (SiNx) | p. 105 |
Thin Film Characterization Methods | p. 105 |
Fourier Transform Infrared Spectroscopy (FTIR) | p. 106 |
Ellipsometry | p. 106 |
X-Ray Photoelectron Spectroscopy (XPS) | p. 106 |
Atomic Force Microscopy (AFM) | p. 107 |
Contact Angle Analysis | p. 107 |
Material Characterization of PECVD'SiNx Films | p. 108 |
Bulk/Structural Characterization | p. 108 |
FTIR Spectroscopy | p. 108 |
Refractive Index | p. 111 |
[N]/[Si] Ratio | p. 113 |
Surface Characterization | p. 114 |
Contact Angle | p. 114 |
Surface Morphology and Roughness | p. 115 |
Chemical Composition | p. 116 |
Electrical Characterization | p. 117 |
I-V Measurements | p. 117 |
C-V Measurements | p. 120 |
Summary | p. 121 |
Electrical Characterization of OTFTs with PECVD Gate Dielectric | p. 124 |
300°C SiNx Gate Dielectrics | p. 125 |
150°C SiNx Gate Dielectrics | p. 129 |
Stacked SiNx Gate Dielectrics | p. 131 |
200°C SiOx Gate Dielectrics | p. 134 |
OTFTs on Plastic Substrates | p. 136 |
Summary and Contributions | p. 139 |
References | p. 142 |
Dielectric Interface Engineering | p. 147 |
Background | p. 148 |
Self Assembled Monolayer (SAM) | p. 148 |
Oxygen Plasma Treatment | p. 151 |
Basics of Plasma Processing (Etching) | p. 152 |
Experimental Details | p. 154 |
Impact of Dielectric Surface Treatments | p. 155 |
Electrical Characterization | p. 156 |
Interface Characterization | p. 158 |
Contact Angle | p. 159 |
Surface Roughness | p. 161 |
Chemical Composition | p. 163 |
Analysis | p. 164 |
Impact of Oxygen Plasma Exposure Conditions | p. 166 |
Electrical Characterization | p. 167 |
Impact of Exposure Duration | p. 167 |
Impact of Exposure Power | p. 169 |
Interface Characterization | p. 170 |
Contact Angle | p. 170 |
Surface Roughness | p. 172 |
Chemical Composition | p. 173 |
XPS Depth Profile Analysis | p. 177 |
Analysis and Discussion | p. 178 |
Summary and Contributions | p. 181 |
References | p. 182 |
Contact Interface Engineering | p. 185 |
Background | p. 186 |
Charge Injection | p. 186 |
Alkanethiol SAM on Metals | p. 189 |
Experimental Details | p. 190 |
Impact of Contact Surface Treatment | p. 192 |
Electrical Characterization | p. 192 |
Interface Characterization | p. 197 |
Contact Angle | p. 197 |
Surface Roughness | p. 198 |
Chemical Composition | p. 198 |
Analysis | p. 199 |
Impact of Execution Sequence of Surface Treatment | p. 201 |
Electrical Characterization | p. 202 |
Interface Characterization | p. 203 |
Contact Angle | p. 203 |
Surface Roughness | p. 203 |
Chemical Composition | p. 204 |
Summary and Contributions | p. 205 |
References | p. 206 |
Further Reading | p. 207 |
OTFT Circuits and Systems | p. 209 |
OTFT Requirements for Circuit Applications | p. 209 |
Speed | p. 210 |
Leakage | p. 212 |
Current Drive Capacity | p. 212 |
Stability | p. 213 |
Applications | p. 213 |
Displays | p. 213 |
RFID Tags | p. 214 |
Circuit Demonstration | p. 218 |
Fabrication Schemes | p. 218 |
Inverters | p. 219 |
Current Mirrors | p. 223 |
Ring Oscillators | p. 225 |
Display Pixel Circuits | p. 226 |
Conventional 2-TFT Pixel Circuit | p. 226 |
Compensating 2-TFT Pixel Circuit | p. 229 |
4-TFT Current Mirror Pixel Circuit | p. 231 |
Summary, Contributions, and Outlook | p. 232 |
Active-Matrix Backplane Integration | p. 233 |
Back-End Process Integration: Bonding and Packaging | p. 234 |
References | p. 235 |
Further Reading | p. 237 |
Outlook and Future Challenges | p. 239 |
Device Performance | p. 240 |
Device Manufacture | p. 241 |
Device Integration | p. 242 |
References | p. 243 |
Index | p. 245 |
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