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9783527409594

Organic Thin Film Transistor Integration A Hybrid Approach

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  • ISBN13:

    9783527409594

  • ISBN10:

    3527409599

  • Edition: 1st
  • Format: Hardcover
  • Copyright: 2011-05-16
  • Publisher: Wiley-VCH

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Summary

Research on organic electronics (or plastic electronics) is driven by the need to create systems that are lightweight, unbreakable, and mechanically flexible. With the remarkable improvement in the performance of organic semiconductor materials during the past few decades, organic electronics appeal to innovative, practical, and broad-impact applications requiring large-area coverage, mechanical flexibility, low-temperature processing, and low cost. Thus, organic electronics appeal to a broad range of electronic devices and products including transistors, diodes, sensors, solar cells, lighting, displays, and electronic identification and tracking devices A number of commercial opportunities have been identified for organic thin film transistors (OTFTs), ranging from flexible displays, electronic paper, radio-frequency identification (RFID) tags, smart cards, to low-cost disposable electronic products, and more are continually being invented as the technology matures. The potential applications for ?plastic electronics? are huge but several technological hurdles must be overcome. In many of these applications, transistor serves as a fundamental building block to implement the necessary electronic functionality. Hence, research in organic thin film transistors (OTFTs) or organic field effect transistors (OFETs) is eminently pertinent to the development and realization of organic electronics. This book presents a comprehensive investigation of the production and application of a variety of polymer based transistor devices and circuits. It begins with a detailed overview of Organic Thin Film Transistors (OTFTs) and discusses the various possible fabrication methods reported so far. This is followed by two major sections on the choice, optimization and implementation of the gate dielectric material to be used. Details of the effects of processing on the efficiency of the contacts are then provided. The book concludes with a chapter on the integration of such devices to produce a variety of OTFT based circuits and systems. The key objective is to examine strategies to exploit existing materials and techniques to advance OTFT technology in device performance, device manufacture, and device integration. Finally, the collective knowledge from these investigations facilitates the integration of OTFTs into organic circuits, which is expected to contribute to the development of new generation of all-organic displays for communication devices and other pertinent applications. Overall, a major outcome of this work is that it provides an economical means for organic transistor and circuit integration, by enabling the use of a well-established PECVD infrastructure, while not compromising the performance of electronics. The techniques established here are not limited to use in OTFTs only; the organic semiconductor and SiNx combination can be used in other device structures (e.g., sensors, diodes, photovoltaics). Furthermore, the approach and strategy used for interface optimization can be extended to the development of other materials systems.

Author Biography

Flora M. Li is a Research Associate at the Centre of Advanced Photonics and Electronics (CAPE) at the University of Cambridge, UK. She received her Ph.D. degree in Electrical and Computer Engineering from the University of Waterloo, Canada in 2008. She was a Visiting Scientist at Xerox Research Centre of Canada (XRCC) from 2005-2008. Her research interests are in the field of nano- and thin-film technology for applications in large area and flexible electronics, including displays, sensors, photovoltaics, circuits and systems. She has co-authored a book entitled CCD Image Sensors in Deep-Ultraviolet (2005), and published in various scientific journals.

Arokia Nathan holds the Sumitomo/STS Chair of Nanotechnology at the London Centre for Nanotechnology, University College London, UK. He is also the CTO of Ignis Innovation Inc., Waterloo, Canada, a company he founded to commercialize technology on thin film silicon backplanes on rigid and flexible substrates for large area electronics. He received his Ph.D. in Electrical Engineering from the University of Alberta, Canada, in 1988. In 1987, he joined LSI Logic Corp., Santa Clara, CA, USA where he worked on advanced multi-chip packaging techniques. Subsequently, he was at the Institute of Quantum Electronics, ETH Z?rich, Switzerland. In 1989, he joined the Department of Electrical and Computer Engineering, University of Waterloo. In 1995, he was a Visiting Professor at the Physical Electronics Laboratory, ETH Z?rich, Switzerland. In 1997 he held the DALSA/NSERC Industrial Research Chair in sensor technology, and was a recipient of the 2001 Natural Sciences and Engineering Research Council E.W.R. Steacie Fellowship. In 2004 he was awarded the Canada Research Chair in nano-scale flexible circuits. In 2005/2006, he was a Visiting Professor in the Engineering Department, University of Cambridge, U.K. In 2006, he joined the London Centre for Nanotechnology and is a recipient of the Royal Society Wolfson Research Merit Award. He has published extensively in the field of sensor technology, CAD, and thin film transistor electronics, and has over 40 patents filed/awarded. He is the co-author of two books, Microtransducer CAD and CCD Image Sensors in Deep-Ultraviolet, published in 1999 and 2005, respectively, and serves on technical committees and editorial boards at various capacities.

Table of Contents

Prefacep. XIII
Glossaryp. XV
Introductionp. 1
Organic Electronics: History and Market Opportunitiesp. 3
Large-Area Displaysp. 4
Rollable Displaysp. 5
Radio Frequency Identification (RFID) Tagp. 6
Technological Challengesp. 6
Device Performancep. 7
Device Manufacturep. 8
Scope and Organizationp. 8
Referencesp. 10
Organic Thin Film Transistor (OTFT) Overviewp. 13
Organic Semiconductor Overviewp. 14
Basic Propertiesp. 15
Charge Transportp. 17
Micro structure and Molecular Alignmentp. 18
Material Development and Classificationsp. 21
Small Moleculesp. 22
Polymersp. 24
n-Type Semiconductorsp. 25
Sensitivity to Environmental Influencesp. 26
OTFT Operation and Characteristicsp. 27
OTFT Parameter Extractionp. 30
Contact Resistance Extractionp. 32
Desirable OTFT Characteristicsp. 34
OTFT Device Architecturep. 34
Top-Contact and Bottom-Contact OTFTsp. 35
Top-Gate, Bottom-Gate, and Dual-Gate OTFTsp. 37
OTFT Device Material Selectionp. 38
Organic Semiconductorp. 39
Gate Dielectricp. 41
Electrodes/Contactsp. 43
Substratep. 45
Encapsulation Strategiesp. 47
Summaryp. 49
Referencesp. 49
OTFT Integration Strategiesp. 55
Technological Challenge in OTFT Integrationp. 55
Overview of Processing and Fabrication Techniquesp. 58
Deposition Methods for Organic Semiconductorsp. 61
Vacuum Evaporationp. 61
Solution-Processed Depositionp. 61
Patterning by Shadow Maskp. 62
Patterning by Photolithographyp. 64
Photolithography Basicsp. 65
Photolithography Considerations for OTFTsp. 66
Patterning by Inkjet Printingp. 68
Inkjet Printing of OTFTsp. 71
Improved Resolution by Surface-Energy Assisted Inkjet Printingp. 72
Printing Peripheral Circuit: Vias and Interconnectsp. 73
Microcontact Printingp. 73
Other Deposition Methodsp. 75
OTFT Fabrication Schemesp. 76
Basic One-Mask Processing Scheme for Bottom-Gate OTFTp. 76
Photolithography Scheme for Fully-Patterned and Fully-Encapsulated Bottom-Gate OTPTp. 78
Directly Patterned OTFTsp. 79
Indirectly Patterned OTFTsp. 81
Hybrid Photolithography-Inkjet Printing Scheme for Fully-Patterned Bottom-Gate OTFTp. 83
Photolithography Scheme for Top-Gate and Dual-Gate OTFTsp. 85
Top-GateOTFTp. 87
Dual-Gate OTFTp. 90
Analysisp. 92
Fabrication Scheme Comparisonsp. 93
Summary and Contributionsp. 94
Referencesp. 96
Gate Dielectrics by Plasma Enhanced Chemical Vapor Deposition (PECVD)p. 101
Overview of Gate Dielectricsp. 101
Organic Dielectricsp. 101
Inorganic Dielectricsp. 104
Experimental Details and Characterization Methodsp. 105
Deposition Conditions of PECVD Silicon Nitride (SiNx)p. 105
Thin Film Characterization Methodsp. 105
Fourier Transform Infrared Spectroscopy (FTIR)p. 106
Ellipsometryp. 106
X-Ray Photoelectron Spectroscopy (XPS)p. 106
Atomic Force Microscopy (AFM)p. 107
Contact Angle Analysisp. 107
Material Characterization of PECVD'SiNx Filmsp. 108
Bulk/Structural Characterizationp. 108
FTIR Spectroscopyp. 108
Refractive Indexp. 111
[N]/[Si] Ratiop. 113
Surface Characterizationp. 114
Contact Anglep. 114
Surface Morphology and Roughnessp. 115
Chemical Compositionp. 116
Electrical Characterizationp. 117
I-V Measurementsp. 117
C-V Measurementsp. 120
Summaryp. 121
Electrical Characterization of OTFTs with PECVD Gate Dielectricp. 124
300°C SiNx Gate Dielectricsp. 125
150°C SiNx Gate Dielectricsp. 129
Stacked SiNx Gate Dielectricsp. 131
200°C SiOx Gate Dielectricsp. 134
OTFTs on Plastic Substratesp. 136
Summary and Contributionsp. 139
Referencesp. 142
Dielectric Interface Engineeringp. 147
Backgroundp. 148
Self Assembled Monolayer (SAM)p. 148
Oxygen Plasma Treatmentp. 151
Basics of Plasma Processing (Etching)p. 152
Experimental Detailsp. 154
Impact of Dielectric Surface Treatmentsp. 155
Electrical Characterizationp. 156
Interface Characterizationp. 158
Contact Anglep. 159
Surface Roughnessp. 161
Chemical Compositionp. 163
Analysisp. 164
Impact of Oxygen Plasma Exposure Conditionsp. 166
Electrical Characterizationp. 167
Impact of Exposure Durationp. 167
Impact of Exposure Powerp. 169
Interface Characterizationp. 170
Contact Anglep. 170
Surface Roughnessp. 172
Chemical Compositionp. 173
XPS Depth Profile Analysisp. 177
Analysis and Discussionp. 178
Summary and Contributionsp. 181
Referencesp. 182
Contact Interface Engineeringp. 185
Backgroundp. 186
Charge Injectionp. 186
Alkanethiol SAM on Metalsp. 189
Experimental Detailsp. 190
Impact of Contact Surface Treatmentp. 192
Electrical Characterizationp. 192
Interface Characterizationp. 197
Contact Anglep. 197
Surface Roughnessp. 198
Chemical Compositionp. 198
Analysisp. 199
Impact of Execution Sequence of Surface Treatmentp. 201
Electrical Characterizationp. 202
Interface Characterizationp. 203
Contact Anglep. 203
Surface Roughnessp. 203
Chemical Compositionp. 204
Summary and Contributionsp. 205
Referencesp. 206
Further Readingp. 207
OTFT Circuits and Systemsp. 209
OTFT Requirements for Circuit Applicationsp. 209
Speedp. 210
Leakagep. 212
Current Drive Capacityp. 212
Stabilityp. 213
Applicationsp. 213
Displaysp. 213
RFID Tagsp. 214
Circuit Demonstrationp. 218
Fabrication Schemesp. 218
Invertersp. 219
Current Mirrorsp. 223
Ring Oscillatorsp. 225
Display Pixel Circuitsp. 226
Conventional 2-TFT Pixel Circuitp. 226
Compensating 2-TFT Pixel Circuitp. 229
4-TFT Current Mirror Pixel Circuitp. 231
Summary, Contributions, and Outlookp. 232
Active-Matrix Backplane Integrationp. 233
Back-End Process Integration: Bonding and Packagingp. 234
Referencesp. 235
Further Readingp. 237
Outlook and Future Challengesp. 239
Device Performancep. 240
Device Manufacturep. 241
Device Integrationp. 242
Referencesp. 243
Indexp. 245
Table of Contents provided by Ingram. All Rights Reserved.

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