Adhesives Technology for Electronic Applications:

by Licari, James J.; Swanson, Dale W.

• ISBN13: 9781437778892
• ISBN10: 1437778895
• Edition: 2nd
• Format: Hardcover
• Copyright: 2011-06-23
• Publisher: William Andrew Pub

Summary

This book is unique in its comprehensive coverage of all aspects of adhesive technology for microelectronic devices and packaging, from theory to bonding to test procedures. In addition to general applications, such as dies, substrate, and lid and chip stack attachments, the book includes new developments in anisotropic, electrically conductive, and underfill adhesives. Rapid curing methods such as UV, microwave, and moisture (which comply with current environmental and energy requirements) are covered. Over 80 tables and 120 figures provide a wealth of data on properties, performance, and reliability. Also included are examples of commercially available adhesives, suppliers, and equipment. Each chapter provides comprehensive references.

Author Biography

James J. Licari was Senior Scientist for Hughes' Microelectronics Division in Newport Beach, CA, where he led the development of high-density, high-performance multichip modules, and currently consults on materials and processes for microelectronics packaging. He is the recipient of six NASA awards, the annual Technical Achievement Award from NEPCON, the John Wagnon Technical Achievement Award and the prestigious Daniel C. Hughes Memorial Award, and author or co-author of seven books, over 100 publications and 12 patents. Dale W. Swanson recently retired as an Associate Technical Fellow from the Materials and Processes Laboratory of the Boeing Company after gaining over 20 years' experience in materials and processes engineering for electronic applications. He is an active member of the International Microelectronics and Packaging Society (IMAPS) and the author of over 20 technical publications.

Table of Contents

Preface	p. vii
Acknowledgments	p. ix
Introduction	p. 1
Functions and theory of adhesives	p. 35
Chemistry, Formulation, and Properties of Adhesives	p. 75
Adhesive Bonding Processes	p. 143
Applications	p. 217
Reliability	p. 289
Test and Inspection Methods	p. 345
Appendix	p. 379
Index	p. 385
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