Advanced Integrated Communication Microsystems

by Joy Laskar (Georgia Institute of Technology); Sudipto Chakraborty (Georgia Institute of Technology); Anh-Vu Pham (University of California, Davis ); Manos M. Tantzeris (Georgia Institute of Technology )

• ISBN13: 9780470409787
• ISBN10: 0470409789
• Format: eBook
• Copyright: 2009-02-01
• Publisher: Wiley-IEEE Press

Summary

Advanced Mixed Signal Communication Systems explains the synergistic nature of systems, circuits, and device fundamentals in designing a mixed signal system. Unlike the current practice which views the separate functionalities as building blocks of the new system and then concentrates on interfacing them, the novel approach of this text places emphasis on providing a fundamental understanding of the component parts of such a system.

Table of Contents

Preface

Acknowledgements

Fundamentals of Communication Systems

Introduction

Communication systems

History and Overview of Wireless Communication Systems

History and Overview of Wired Communication Systems

Communication System Fundamentals

Electromagnetics

Analysis of circuits and systems

Broadband,wideband and narrowband systems

Semiconductor technology and devices

Key circuit topologies

Gain/Linearity/Noise

Conclusion

Wireless Communication Systems Architectures

Introduction

Fundamental considerations

Link Budget Analysis

Propagation Effects

Interface Planning

Superheterodyne architecture

Low IF architecture

Direct conversion architecture

Two stage direct conversion

Current mode architecture

Subsampling architecture

Multi-band direct conversion radio

Polar modulator

Harmonic reject architectures

Practical considerations for transceiver integration

Conclusion

Systems Architectures for High Speed Wired Communications.

Introduction

Band-limited channel

Equalizer system study

References

Mixed Signal Communication Systems Building Blocks.

Introduction

Inverters

Static D flipflop

Bias circuits

Transconductor cores

Load networks

A versatile analog signal processing core

Low noise amplifier

Power amplifiers

Balun

Signal Generation Path

Mixers

Baseband filters

Signal strength indicator (SSI)

ADC/DAC

Conclusion

Examples of Integrated Communication Microsystems.

Introduction

Direct conversion receiver front-end

Debugging: A practical scenario

High speed wired communication example

Conclusion

References

Low voltage, low power and low area designs

Introduction

Power consumption considerations

Device technology and scaling

Low voltage design techniques

Injection locked techniques

Subharmonic architectures

Superregenerative architectures

Hearing aid applications

Radio frequency identification tags

Ultra low power radios

Conclusion

References

Packaging for Integrated Communication Microsystems

Introduction

Background

Elements of a package

Driving Forces for RF Packaging Technology

MCM Definitions and Classifications

RF - SOP modules

Package modeling and optimization

Future packaging trends

Chip Package Co-design

Package models and transmission lines

Calculations for package elements

Cross-talk

Grounding

Practical issues in working with packages

Chip-package codesign examples

Wafer scale package

Filters using bondwire

Packaging Limitation

Conclusion

References

Advanced SOP Components and Signal Processing.

Introduction

History of compact design

Previous Techniques in Performance Enhancement

Design Complexities

Modeling Complexities

Compact Stacked Patch Antennas Using LTCC Multilayer Technology

Suppression of Surface Waves and Radiation Pattern Improvement Using SHS Technology

Radiation-Pattern Improvement Using a Compact Soft Surface Structure

A Package-Level Integrated Antenna Based on LTCC Technology

Characterization and Computer aided analysis of integrated microsystems

Introduction

Computer aided analysis of wireless systems

Measurement equipments and their operation

Network analyzer calibration

Wafer probing measurement

Characterization of integrated radios

In the laboratory

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