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Preface | p. xiii |
Author | p. xv |
Electromagnetic Interference Shielding Fundamentals and Design Guide | p. 1 |
Concepts of Electromagnetic Interference and Electromagnetic Compatibility | p. 1 |
EMI Problems and Common Concerns | p. 2 |
EMI Emissions and Controlling Methods | p. 3 |
Conducted EMI Emission | p. 4 |
Radiated EMI Emission | p. 5 |
EMC Regulations and Testing Standards | p. 8 |
The International Standard | p. 9 |
FCC Standard | p. 9 |
European Standard | p. 10 |
Military Standard | p. 10 |
EMI Shielding Principles | p. 11 |
Shielding Effects in the E-Field and H-Field | p. 11 |
Shielding Effectiveness | p. 13 |
Absorption Loss | p. 14 |
Reflection Loss | p. 15 |
Multiple Reflection Correction Factor | p. 16 |
Shielding Modeling in Practice | p. 18 |
Metallic Enclosure | p. 18 |
EMI Gasket | p. 19 |
Shield with Apertures | p. 20 |
Cavity Resonance | p. 23 |
EMC Design Guidelines and EMI Shielding Methodology | p. 24 |
Design for EMC | p. 24 |
Shielding Methods and Materials Selection | p. 27 |
Shielding Housing and Enclosures | p. 27 |
Gasketing | p. 29 |
Integral Assembly | p. 30 |
Corrosion and Material Galvanic Compatibility | p. 31 |
Environmental Compliance | p. 32 |
RoHS Directive | p. 33 |
WEEE Directive | p. 34 |
References | p. 35 |
Characterization Methodology of EMI Shielding Materials | p. 37 |
Shielding Effectiveness Measurement | p. 37 |
Testing Methods Based on MIL-STD-285 | p. 38 |
Modified Radiation Method for Shielding Effectiveness Testing Based on MIL-G-83528 | p. 39 |
Dual Mode Stirred Chamber | p. 39 |
Transverse Electromagnetic (TEM) Cell | p. 40 |
Circular Coaxial Holder | p. 42 |
Dual Chamber Test Fixture Based on ASTM ES7-83 | p. 42 |
Transfer Impedance Methods | p. 42 |
Transfer Impedance of Coaxial Cables | p. 43 |
Transfer Impedance Method for Shielding Effectiveness Measurement of Conductive Gaskets | p. 43 |
Electrical and Thermal Conductivities | p. 45 |
Electrical Conductivity and Contact Resistance | p. 45 |
Thermal Conductivity | p. 46 |
Permeability and Permittivity | p. 47 |
Permeability | p. 47 |
Permittivity | p. 48 |
Characterization of Permeability and Permittivity | p. 48 |
Mechanical Properties | p. 49 |
Uniaxial Tensile Testing | p. 49 |
Hardness | p. 50 |
Poisson's Ratio | p. 50 |
Stress Relaxation | p. 50 |
Contact Force | p. 51 |
Friction Force | p. 52 |
Permanent Set | p. 52 |
Surface Finish and Contact Interface Compatibility | p. 52 |
Corrosion and Oxidation Protection | p. 53 |
Noble Finish Selection | p. 53 |
Nonnoble Finishes | p. 54 |
Solderability of Surface Finishes | p. 55 |
Effects of Mating Cycles and Operating Environments on Contact Finishes | p. 57 |
Galvanic Corrosion and Contact Interface Compatibility | p. 58 |
Formability and Manufacturability | p. 58 |
Bending Formability | p. 59 |
Effect of Strain Hardening on Formability | p. 60 |
Anisotropy Coefficient | p. 61 |
Springback during Metal Strip Forming | p. 62 |
Environmental Performance Evaluation | p. 62 |
Thermal Cycling | p. 63 |
Thermal Aging | p. 63 |
Gaseous Testing | p. 63 |
Pore Corrosion and Fretting Corrosion | p. 63 |
Temperature and Humidity Testing | p. 64 |
Dust Sensitivity Test | p. 64 |
Vibration and Shock Test | p. 65 |
References | p. 65 |
EMI Shielding Enclosure and Access | p. 67 |
Enclosure Design and Materials Selection | p. 67 |
Magnetic Field Shielding Enclosure | p. 73 |
Basics of Magnetic Shielding | p. 73 |
Magnetic Shielding Materials Selection | p. 74 |
Magnetic Shielding Enclosure Design Consideration | p. 76 |
Shielding Enclosure Integrity | p. 78 |
Specialized Materials Used for Shielding Enclosure | p. 82 |
EMI Gaskets | p. 82 |
Metal Strip Gaskets | p. 82 |
Knitted Metal Wire Gaskets | p. 83 |
Metal-Plated Fabric-over-Foam (FOF) | p. 84 |
Electrically Conductive Elastomer (ECE) Gaskets | p. 84 |
Magnetic Screening Materials | p. 84 |
Shielding Tapes | p. 85 |
Thermoformable Alloys | p. 85 |
Honeycomb Materials | p. 85 |
Painted or Plated Plastic Enclosures | p. 86 |
Conductive Composite Shielding Materials | p. 86 |
Summary | p. 86 |
References | p. 87 |
Metal-Formed EMI Gaskets and Connectors | p. 89 |
Introduction | p. 89 |
Metal Strip Selection and Performance Requirement | p. 90 |
Copper Beryllium Alloys | p. 91 |
Phase Constitution and Primary Processing of CuBe Strips | p. 91 |
Performance and Availability of CuBe Alloys | p. 95 |
High-Strength Alloys | p. 95 |
High-Conductivity CuBe Alloys | p. 97 |
Nickel Beryllium | p. 97 |
Copper-Nickel-Tin Spinodal Alloys | p. 97 |
Composition and Physical Properties | p. 97 |
Strip Gauges and Temper Designations | p. 99 |
Mechanical Properties and Bending Formability | p. 100 |
Stress-Relaxation Resistance | p. 101 |
Heat Treatment and Spinodal Decomposition | p. 101 |
Surface Cleaning, Plating, and Soldering | p. 103 |
Elastic Performance | p. 103 |
Shielding Effectiveness | p. 104 |
Fatigue Strength | p. 104 |
Some Considerations to Improve Performance of CuNiSn Gasketing | p. 105 |
Copper-Titanium Alloy | p. 107 |
Stainless Steel | p. 108 |
Other Materials Options | p. 110 |
Phosphor Bronze | p. 110 |
Brass | p. 111 |
Nickel Silver | p. 111 |
Other High Strength and High Conductive Copper Alloys | p. 112 |
Design Guideline of Metal Gaskets and Connectors | p. 113 |
Primary Approaches | p. 114 |
Some Special Design Options | p. 115 |
Gasketing Design Guideline | p. 116 |
Fabrication Process and Types of Metal Gaskets and Connectors | p. 118 |
Progressive Die Forming | p. 118 |
Roll Forming | p. 119 |
Multiple-Slide Stamping | p. 120 |
Photoetching | p. 120 |
Typical Part Profiles | p. 120 |
Mounting Methods and Surface Mating Assurance | p. 122 |
Summary | p. 124 |
References | p. 124 |
Conductive Elastomer and Flexible Graphite Gaskets | p. 127 |
Introduction | p. 127 |
Raw Material Selection and Conductive Elastomer Fabrication | p. 128 |
Base Binder Materials | p. 128 |
Silicone | p. 128 |
Fluorosilicone | p. 129 |
Ethylene Propylene Diene Monomer (EPDM) | p. 129 |
Fluorocarbon | p. 129 |
Natural Rubber and Butadiene-Acrylonitrile | p. 129 |
Conductive Fillers | p. 129 |
Fabrication of Conductive Elastomer Materials | p. 130 |
Conduction Mechanism and Processing Optimization of Conductive Elastomer Materials | p. 131 |
Conduction Mechanism and Process Parameters | p. 131 |
Appearance Properties and Performance Evaluation | p. 133 |
Physical and Mechanical Properties | p. 133 |
Electrical Properties | p. 135 |
Thermal Properties | p. 137 |
Conductive Elastomer Gasket Design Guideline | p. 137 |
Flange Joint Geometry and Unevenness | p. 138 |
Applied Clamping/Compressive Force and Deformation Range | p. 139 |
Gasket Profile and Materials Selection | p. 141 |
Flange Materials and Joint Surface Treatment | p. 145 |
Conductive Elastomer Gasket Fabrication | p. 146 |
Extrusion | p. 146 |
Molding | p. 147 |
Form-in-Place and Screen Printing | p. 148 |
Reinforced Shielding Gaskets with Oriented Wires and Metal Meshes | p. 149 |
Conductive Elastomer Gasket Installation and Application | p. 149 |
Comparable Flexible Graphite Gaskets | p. 152 |
Flexible Graphite and Its Properties | p. 153 |
Fabrication and Application of Flexible Graphite Gaskets | p. 155 |
Summary | p. 157 |
References | p. 157 |
Conductive Foam and Ventilation Structure | p. 159 |
Introduction | p. 159 |
Waveguide Aperture and Ventilation Panel | p. 159 |
Waveguide Aperture and Its Design | p. 160 |
Materials Selection and Fabrication Options | p. 163 |
Conductive Foam and Integral Window Structure | p. 165 |
Conductive Plastic Foam and Vent Panels | p. 165 |
Integral EMI Window Structure | p. 168 |
Metallized Fabrics and Fabric-over-Foam | p. 169 |
Metallized Fabrics | p. 170 |
Fabric-over-Foam | p. 171 |
Summary | p. 175 |
References | p. 175 |
Board-Level Shielding Materials and Components | p. 177 |
Introduction | p. 177 |
Board-Level Shielding Design and Materials Selection | p. 178 |
Basic Principles of Board Circuit EMC Design | p. 178 |
PCB Layout | p. 178 |
Power Decoupling | p. 179 |
Trace Separation | p. 179 |
Grounding Techniques | p. 180 |
Chassis Construction and Cabling | p. 180 |
Board-Level Shielding Design with Proper Materials Selection | p. 181 |
Board-Level Shielding Components and Their Manufacturing Technology | p. 185 |
Metal Cans | p. 186 |
Single-Piece Shielding Cans | p. 186 |
Two-Piece Cans | p. 189 |
Multilevel Shielding and Multicompartment Cans | p. 190 |
Metal-Coated Thermoform Shields | p. 190 |
snapSHOT Shield | p. 191 |
Form/Met Shield | p. 192 |
Formable Shielding Film | p. 196 |
Conductive Coating Methods Used for EMI Shielding Components | p. 196 |
Electroplating | p. 197 |
Electroless Plating | p. 197 |
Electrolytic Plating | p. 198 |
Tin Plating and Tin Whisker Growth in EMI Shielding Systems | p. 199 |
Immersion Surface Finishes | p. 202 |
Conductive Paints | p. 204 |
Vapor Deposition | p. 205 |
Conductive Coating Application and Design Consideration for EMI Shielding | p. 206 |
Board-Level Shielding with Enhanced Heat Dissipating | p. 207 |
Minimizing EMI from Heat Sinks | p. 207 |
Combination of Board-Level Shielding and Heat Dissipation | p. 207 |
Thermal Interface Materials (TIMs) for Thermal-Enhanced Board-Level Shielding | p. 208 |
Summary | p. 211 |
References | p. 212 |
Composite Materials and Hybrid Structures for EMI Shielding | p. 215 |
Introduction | p. 215 |
Knitted Wire/Elastomer Gaskets | p. 215 |
Fabrication Process and Materials Selection | p. 216 |
Knitted Wire Gasket Performance | p. 218 |
Typical Gasket Types and Mounting Methods | p. 219 |
EMI Shielding Tapes | p. 221 |
Conductive Fiber/Whisker Reinforced Composites | p. 224 |
Materials Selection and Process of Conductive Composites | p. 225 |
Carbon Fiber/Whisker Reinforced Materials | p. 226 |
Metal Fiber/Whisker Reinforced Composites | p. 227 |
Nanofiber Reinforced Polymer Composites | p. 229 |
Hybrid Flexible Structures for EMI Shielding | p. 230 |
Electroless Metal Deposition for Reinforcements of Composite Shielding Materials | p. 231 |
Summary | p. 234 |
References | p. 234 |
Absorber Materials | p. 237 |
Introduction | p. 237 |
Microwave Absorber Materials | p. 238 |
Resonant Absorbers | p. 240 |
Dallenbach Tuned Layer Absorbers | p. 240 |
Salisbury Screens | p. 241 |
Jaumann Layers | p. 242 |
Graded Dielectric Absorbers: Impedance Matching | p. 242 |
Pyramidal Absorbers | p. 242 |
Tapered Loading Absorbers | p. 243 |
Matching Layer Absorbers | p. 244 |
Cavity Damping Absorbers | p. 244 |
Anechoic Chambers | p. 245 |
Antennas | p. 245 |
Absorber Materials Used in Anechoic Chambers | p. 246 |
Dielectric Materials for Absorber Applications | p. 246 |
Electromagnetic Wave Absorbers | p. 249 |
Absorbing Materials Selection and Absorber Applications | p. 251 |
Absorbing Materials and Absorber Types | p. 251 |
Applications | p. 252 |
Military | p. 252 |
Commercial | p. 253 |
Summary | p. 253 |
References | p. 254 |
Grounding and Cable-Level Shielding Materials | p. 257 |
Introduction | p. 257 |
Cable Assembly and Its EMI Shielding Design | p. 257 |
Cable-Level Shielding Materials | p. 261 |
Metallic Shielding | p. 261 |
Conductive Heat-Shrinkable Shielding | p. 263 |
Ferrite Shielding Materials | p. 264 |
Bonding and Grounding | p. 267 |
Bonding | p. 268 |
Grounding | p. 269 |
Shields Grounded at One Point | p. 270 |
Multigrounded Shields | p. 271 |
Hybrid Grounding | p. 271 |
Summary | p. 271 |
References | p. 272 |
Special Shielding Materials in Aerospace and Nuclear Industries | p. 275 |
Introduction | p. 275 |
Lightweight Shielding Materials for Aerospace Applications | p. 275 |
Lightweight Radiation Shielding Material | p. 276 |
Fiber Reinforced Composite Materials | p. 277 |
Nanomaterials | p. 279 |
Foam Structures | p. 280 |
Radiation Shielding for Space Power Systems | p. 281 |
Neutron Shielding Design and Materials Selection | p. 282 |
Shielding Materials for Earth Neighborhood Infrastructure | p. 282 |
Active Electromagnetic Shielding for Space Radiation | p. 283 |
Optimization of Space Radiation Shielding | p. 285 |
Nuclear Shielding Materials | p. 286 |
Summary | p. 289 |
References | p. 291 |
Perspectives and Future Trends | p. 293 |
Introduction | p. 293 |
Early Design-in for EMC and Optimal Design of EMI Shielding | p. 293 |
Advanced Materials Selection for EMI Shielding | p. 297 |
Materials Selection for EMI Shielding Enclosure/Cover/Barrier | p. 298 |
EMI Gasketing Material Selection | p. 299 |
Other Shielding Materials Selection | p. 301 |
Future Trends and Applications | p. 302 |
EMI Shielding Design Techniques | p. 302 |
Integrated Circuit-Level Shielding | p. 303 |
Printed Circuit Board (PCB)-Level Shielding | p. 305 |
Lightweight Shields for PCB-Level Shielding | p. 305 |
Mold-in-Place Combination Gaskets for Multicompartment Shields | p. 306 |
Rotary Form-in-Place Gaskets | p. 307 |
EMI Shielding Modules or Enclosures | p. 308 |
Conductive Foam with Z-Axis Conductivity | p. 308 |
Dent-Resistant Vent Panels | p. 309 |
Nanocomposite Shielding Materials | p. 309 |
Ultrasoft Sculpted Fabric-over-Foam | p. 310 |
Interconnecting Level Shielding | p. 310 |
EMI Control or Immunity by Software | p. 311 |
Summary | p. 311 |
References | p. 312 |
Index | p. 315 |
Table of Contents provided by Ingram. All Rights Reserved. |
The New copy of this book will include any supplemental materials advertised. Please check the title of the book to determine if it should include any access cards, study guides, lab manuals, CDs, etc.
The Used, Rental and eBook copies of this book are not guaranteed to include any supplemental materials. Typically, only the book itself is included. This is true even if the title states it includes any access cards, study guides, lab manuals, CDs, etc.