Advanced MEMS Packaging

by Lau, John; Lee, Cheng; Premachandran, C.; Aibin, Yu

• ISBN13: 9780071626231
• ISBN10: 0071626239
• Edition: 1st
• Format: Hardcover
• Copyright: 2009-11-12
• Publisher: McGraw-Hill Education

Summary

An comprehensive guide to advanced MEMS packaging methodsThis book presents the latest and cutting-edge MEMS (Microelectromechanical systems) packaging techniques such as low-temperature bonding and 3D packaging. Written by experts in the field, Advanced MEMS Packaging serves as a valuable reference for those faced with the challenging problems created by the ever-increasing interests in MEMS devices and packaging.This authoritative guide is ideal for anyone who needs to choose a reliable, creative, high-performance, robust, and cost-effective packaging technique for MEMS devices. The book will also aid in stimulating further research and development in optical, electrical, and thermal designs as well as materials, process, manufacturing, testing, and reliability.

Author Biography

John H. Lau, Ph.D., P.E., IEEE Fellow, ASME Fellow is a senior engineer in the microsystems, modules, and components laboratory at the Institute of Microelectronics(IME) in Singapore..

Cheng Kuo Lee is at the National University of Singapore..

C. S. Premachandran is at the Institute of Microelectronics in Singapore..

Yu Aibin is at the Institute of Microelectronics in Singapore..

Table of Contents

Fundamental of MEMS Packaging

MEMS Packaging

MEMS Patents

Optical MEMS

Optical MEMS in Communications Applications

Optical MEMS in Industrial/Consumers Electronics/Medical Applications

Optical MEMS Bolometer

Bio MEMS Packaging

Bio MEMS packaging

Biosensor Packaging

Inertial MEMS

Inertial MEMS-Accelerometer

Wafer Level Assembly, Packaging and Testing for MEMS Applications

RF MEMS

Introduction to RF MEMS and Its Packaging

RF MEMS Switches

RF MEMS Tunable Circuits

Advanced Packaging of RF MEMS

Table of Contents provided by Publisher. All Rights Reserved.