We're sorry, but eCampus.com doesn't work properly without JavaScript.
Either your device does not support JavaScript or you do not have JavaScript enabled.
How to enable JavaScript in your browser.
Need help? Call 1-855-252-4222
Tatsuki Ohji is a Prime Senior Research Scientist of National Institute of Advanced Industrial Science and Technology (AIST) and a Designated Professor in the Graduate School of Science and Engineering, Meijo University, Japan. He has authored or coauthored more than 330 peer-reviewed papers and 12 book chapters, edited 30 book volumes, chaired or co-chaired more than 30 international conferences and symposia, and hold more than 40 patents. Fellow of the American Association for the Advancement of Science (AAAS), the American Ceramic Society and ASM International, and Academician of the World Academy of Ceramics, he has received numerous awards including ECD Bridge Building Award of the American Ceramic Society, Academic Achievement Award of the Ceramic Society of Japan, IIM Lectureship Award of ASM International, Lee Hsun Lecture Award of IMR Chinese Academy of Sciences, and Distinguished Research Achievement Award of the Japan Society of Powder and Powder Metallurgy.
Preface vii
Introduction ix
Contribution to the Understanding of the Microstructure of First Generation Si-C-O Fibers 1Francis Teyssandier, Geraldine Puyoo, Stephane Mazerat, Georges Chollon, Rene Pailler, and Florence Babonneau
The Control of Interphases in Carbon and Ceramic Matrix Composites 11Gerard Vignoles, Rene Pailler, and Francis Teyssandier
High Volume Production for High Performance Ceramics 25William J. Walker, Jr.
Low Pressure Injection Molding of Advanced Ceramic Components with Complex Shapes for Mass Production 35Eugene Medvedovski and Michael Peltsman
Ceramic Injection Molding Using a Partially Water-Soluble Binder System: Effect of Back-Bone Polymers on the Process 53Oxana Weber and Thomas Hanemann
Green-Conscious Ceramic Injection Molding 63Oxana Weber and Thomas Hanemann
Shaping of Large-Sized Sputtering Targets 73Alfred Kaiser
TEM Observation of the Ti Interlayer between SiC Substrates during Diffusion Bonding 81H. Tsuda, S. Mori, M. C. Halbig, and M. Singh
Joining of Alumina by Using of Polymer Blend and Aluminum 91Ken'ichiro Kita, Naoki Kondo, Hideki Kita, and Yasuhisa Izutsu
Diffusion Bonding of Rigid Alumina Pieces using Porous Alumina Interlayers 99Hiroyuki Miyazaki, Mikinori Hotta and Hideki Kita, and Yasuhisa Izutsu
Influence of Joining Pressure and Surface Roughness on Flexural Strength of Joined Boron Carbide Ceramics 105Kiyoto Sekine, Takeshi Kumazawa, Wu-Bian Tian, Hideki Hyuga, and Hideki Kita
Laser Machining of Melt Infiltrated Ceramic Matrix Composite 113D. C. Jarmon, G. Ojard, and D. Brewer
Fabrication of Dendritic Electrodes for Solid Oxide Fuel Cells by using Micro Stereolithography 123Naoki Komori, Satoko Tasaki, and Soshu Kirihara
Ion-Exchange Properties of Nano Zeolite a Prepared by Bead Milling and Post-Milling Recrystallization Method 129Toru Wakihara, Ryuma Ichikawa.Junichi Tatami, Katsutoshi Komeya, Takeshi Meguro
The Role of Milling Liquids in Processing of Metal-Ceramic-Precursor Powders 135Nadja Holstein, Katharina Wiegandt, Florian Holleyn, Jochen Kriegesmann, Michael R. Kunze, Joachim Scholz, and Rolf Janssen
Quantitative Validation of a Multi-Scale Model of Pyrocarbon Chemical Vapor Infiltration from Propane 147G. L. Vignoles, W. Ros, G. Chollon, F. Langlais, and C. Germain
Numerical Analysis of Fracture Behavior in Anisotropic Microstructures 159Hisashi Serizawa, Seigo Tomiyama, Tsuyoshi Hajima, and Hidekazu Murakawa
Author Index 169
The New copy of this book will include any supplemental materials advertised. Please check the title of the book to determine if it should include any access cards, study guides, lab manuals, CDs, etc.
The Used, Rental and eBook copies of this book are not guaranteed to include any supplemental materials. Typically, only the book itself is included. This is true even if the title states it includes any access cards, study guides, lab manuals, CDs, etc.