Advances in Abrasive Technology: Proceedings of the Internaitonal Symposium : Sydney, Australia 8-10 July 1997

by International Symposium on Advances in Abrasive Technology (1997 : Sydney, Australia); Yasunaga, N.; Zhang, L. C.; University of Sydney; Japan Society of Grinding Engineers

• ISBN13: 9789810231361
• ISBN10: 9810231369
• Format: Hardcover
• Copyright: 1997-06-01
• Publisher: WORLD SCIENTIFIC PUB CO INC

Summary

Proceedings of the International Symposium, held in Sydney, Australia, from July 8-10, 1997. DLC: Grinding and polishing.

Table of Contents

Preface	vii
Honour Lectures	1	(27)
Modelling the Related Processes of Abrasion, Wear and Polishing	1	(17)
P L B Oxley (Invited Opening Lecture)
Recent Advances in Ultraprecision Surface Finishing Technologies in Japan	18	(10)
N Yasunaga (Invited Closing Lecture)
Mechanisms of Material Removal and Related Problems	28	(20)
Possible Mechanism of Brittle-Ductile Transition in Material Removal in Micromachining of Brittle Materials	28	(5)
S Shimada
T Inamura
N Ikawa (Invited)
Subsurface Structure Change of Silicon after Ultra-Precision Grinding	33	(5)
I Zarudi
L C Zhang
Si-O-Si Bonding Configurations of Damaged Layer Formed after Diamond Grinding and Chemomechanical Polishing of Si Wafers	38	(5)
Y Chang
Y-T Hung
J-H Tsai
C-L Chao
S-C Chang
T-S Lin
Y-P Chiu
C-C Wang
Phase Transformation of Silicon during Nano-Indentation	43	(5)
H Tanaka
L C Zhang
Polishing and Lapping	48	(38)
Electrophoresis-Polishing with a Partial Electrode Tool	48	(5)
K Suzuki
A Ide
T Uematsu
T Kurobe
N Yasunaga (Invited)
Precision Optical Polishing Using Pitch and Teflon Laps at CSIRO TIP: A Review	53	(4)
A J Leistner (Invited)
Mechanisms of Silicon Polishing: Chemical, Mechanical and Electrical Effects	57	(4)
Y Samitsu
Mirror Finishing of 6Al-4V Titanium Alloy Utilizing New Lapping Tape Application of Polishing Fluid	61	(5)
K Kitajima
H Tomoda
H Ohtsubo
T Tottori
CMP Characteristics and Polishing Machine in ILD Planarization	66	(5)
J Watanabe
T Inamura
T Beppu
Y Minamikawa
Magnetic Field-Assisted Grinding-Like Polishing of Brittle Materials Effect of Magnetic Field and Magnetic Slurry on Polishing Characteristics	71	(5)
Y Yamada
T Kurobe
K Sakaya
Material Removal Evaluation in the Optical Polishing of Hydrophilic Polymer Materials	76	(5)
J Sun
L C Zhang
Y-W Mai
S Payor
M Hogg
Computer Controlled Lapping of Granite Plate	81	(5)
J Wang
B Zhang
B Xue
Grinding	86	(62)
High Efficiency Grinding of Difficult-to-Machine Materials	86	(5)
T Suto
T Waida
K Okano (Invited)
Practical Modelling of the Surface Integrity of Ground Components	91	(5)
L C Zhang (Invited)
Development of Sequential Grinding-Polishing Process Applicable to Large-Size Si Wafer Finishing	96	(5)
N Yasunaga
M Takashina
T Itoh
Control of Grain Depth of Cut in Ductile Mode Grinding of Brittle Materials and Practical Application	101	(5)
A Kanai
M Miyashita
F Inaba
M Sato
T Yokotsuka
R Kato
Elastic Recovery of Ground Traces Made by Single Grain Grinding	106	(5)
M Yoshioka
A Study on Grinding Quantities Using Chip Volume	111	(5)
P-L Tso
S-H Wu
Precision Grinding of Aspheric Surface Accuracy Improving by On-Machine Measurement	116	(5)
H Suzuki
N Wajima
M S S Zahmaty
T Kuriyagawa
K Syoji
Simulation of Cylindrical Plunge Grinding Based on the Behaviour of Cutting Edge Wear	121	(5)
E-S Lee
T Suto
M-Y Yang
Abrasive Technology -- Next Generation Processes Require Next Generation Machine Tool Technology	126	(8)
S C Salmon
A Study on the Relation between Outgassing and Characteristics of Ground Surfaces	134	(4)
J Shibata
Cylindrical Mirror Grinding with Extremely Fine Grit Wheels	138	(5)
N Wajima
Y Mori
K Syoji
T Kuriyagawa
H Suzuki
Performance of Grinding Fluids for High-Speed Grinding Using CBN Wheels	143	(5)
T Imai
R Mukai
T Yoshimi
M Yoshikawa
Grinding Wheels	148	(35)
Grinding Characteristics of Wheels with New cBN Grits "ABN800"	148	(5)
K Suzuki
Y Seki
T Makizaki
M Iwai (Invited)
On-Machine Electrodischarge Truing Dressing Method for Metal Bonded Wheels	153	(5)
T Uematsu
T Makizaki
K Suzuki
T Nakagawa (Invited)
Quantified Wear Mechanisms of Diamond Wheels in Creep-Feed Grinding of Ceramic Materials	158	(5)
T W Liao
K Li
S B McSpadden, Jr
L J O'Rourke
On-Machine Monitoring of Dulling Behaviour of Wheel Working Surface	163	(5)
S Shimizu
H Sakamoto
Research and Development of SF Dressing Method for Superabrasive Grinding Wheels Influence of Kind of Dressing Wheels and Flow Rate of Dressing Fluid	168	(4)
S-I Tooe
S-I Ninomiya
S Yokomizo
K Ohta
Characterisation of the Contacting Portion of Grinding Wheel Surfaces	172	(6)
W Scott
Fuzzy Modelling of Wear of Grinding Wheels	178	(5)
Z F Zhang
L C Zhang
Other Techniques	183	(40)
Newly Developed Micro-Processing and Measuring System Unifying Friction Force Microscope	183	(4)
K Ashida
S Hirai
N Morita
Y Yoshida (Invited)
Improving Surface Finish Generated by the Abrasive Waterjet Process	187	(5)
E Siores
L Chen
W C K Wong
R Begg
S Brandellero
D Boundy (Invited)
Effect of Abrasive Grain Size on Surface Finish and Abrasion in Abrasive-Flow Finishing of Aluminium	192	(5)
K Yamaguchi
N Takakura
Development of Automatic Measuring System of Cutting Tool Geometry	197	(5)
H Aoyama
T Aoyama
K Taguchi
S Inoue
Effect of Installation of Surface Grinding Machines on Wheel Unbalance Vibrations	202	(5)
K Yoshida
J Ishimatsu
S Koganei
M Tanaka
Robotics Deburring of GFRP Parts by Using Belt Sander -- Improvement in the Flexibility by Fuzzy Control	207	(5)
Y Nasu
S-I Kuroki
K Mitobe
M J Uddin
T Kuroda
Design and Manufacturing of Indexable Insert Grinding Machine: An Experimental Evaluation	212
A D Joshi
G K Awari
T Chandrasekhar
Nonaxisymmetric Aspheric Grinding Technique for Ceramic Mirrors
T Kuriyagawa
M S S Zahmaty
H Suzuki
K Syoji
T Tachibana
Author Index	223