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9781574981537

Advances in Joining of Ceramics

by ; ;
  • ISBN13:

    9781574981537

  • ISBN10:

    1574981536

  • Edition: 1st
  • Format: Hardcover
  • Copyright: 2003-01-03
  • Publisher: Wiley-American Ceramic Society
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Summary

Joining remains an enabling technology in several key areas related to the use of ceramics. Development of ceramic materials for electronic, biomedical, power generation, and many other fields continues at a rapid pace. Joining of ceramics is a critical issue in the integration of ceramic components in engineering design. This book includes reviews on the state-of-the-art in ceramic joining, new joining materials and methods, and modeling joint behavior and properties.

Author Biography

Charles A. Lewinsohn is the editor of Advances in Joining of Ceramics, published by Wiley.

Mrityunjay Singh is the editor of Advances in Joining of Ceramics, published by Wiley.

Ronald Loehman is the editor of Advances in Joining of Ceramics, published by Wiley.

Table of Contents

Designing Joints in Ceramics
Selection and Function of Interlayer Materials in Ceramic/Ceramic Joining
Numerical Modeling of Solid State Bonding Based on Fundamental Bonding Mechanisms: For Bonding between Dissimilar Materials
Designing Joints with Graded Layers
Engineering High-Quality Ceramic-Metal Bonds
Brazing
Particulate Loading of High Temperature Brazes for Joining Engineering Ceramics
Development of a Copper Oxide-Silver Braze for Ceramic Joining
Biomedical Applications
A Review of Recent Investigations on Zirconia Joining for Biomedical Applications
Joining Zirconia and Alumina Bioceramics
Graded Coatings for Metallic Implant Alloy
High Temperature Applications
Thermal Cycling of Advanced Compressive Seal for Solid Oxide Fuel Cells
Brazing a Mixed Ionic/Electronic Conductor to an Oxidation Resistant Metal
Brazeless Approaches to Joining Silicon Carbide-based Ceramics for High Temperature Applications
Processing Issues in Fabricating Ceramic Micro-Heat Exchangers by Joining Components
Table of Contents provided by Publisher. All Rights Reserved.

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