Computational Modeling and Simulation of Heat Treatment for Metal Alloy

by Wang, Qigui

• ISBN13: 9781118398098
• ISBN10: 1118398092
• Format: Hardcover
• Copyright: 2013-11-18
• Publisher: Wiley
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Summary

A comprehensive evaluation of the modeling of heat treatment processes

The book summarizes the current achievements on numerical modeling for the heat treatment process, providing academic researchers and engineers with a comprehensive understanding, helping to realize the physical problems, improve the studies, optimize the operation, and enhance the quality of parts for the heat treatment process.  The book summarizes years of the authors’ research work, and a systematic structure is presented for numerical modeling of heat treatment processes with the integration of multi-physics models stressed. It includes the thermal analysis, microstructural evolution, mechanical modeling, diffusion, compound formation, modeling of equipment and the concept of integration. It covers the fundamentals of simulation for heat treatment processes, illustrate physics-based models to the pertinent phenomena, and help the readers to have a general and comprehensive understanding to this field.  Together with a small group of contributors, the authors present current research on: Thermal Modeling in Heat Treatment Processes; Microstructural Evolution for Steel and Aluminum; Mechanical Modeling; Diffusion and Compound Formation; Heat Treatment Equipment; Integration Modeling.

• Provides a systematic structure for the numerical modeling of heat treatment processes with integration of multi-physics models.
• Includes thermal analysis, microstructure evolution, mechanical modeling, diffusion, compound formation, modeling of equipments and the concept of integration
• Covers the fundamental technologies of heat treatment based on theory and experimental results, introducing computational simulation for such treatments which affect physical properties of metallic alloys
• Fully illustrated throughout and accompanied by a website to include supplementary papers, demo case files, programs and source code