Dielectric Films for Advanced Microelectronics

by Baklanov, Mikhail; Maex, Karen; Green, Martin

• ISBN13: 9780470013601
• ISBN10: 0470013605
• Edition: 1st
• Format: Hardcover
• Copyright: 2007-03-19
• Publisher: WILEY

Summary

The topic of thin films is an area of increasing importance in materials science, electrical engineering and applied solid state physics; with both research and industrial applications in microelectronics, computer manufacturing, and physical devices. Advanced, high-performance computers, high-definition TV, broadband imaging systems, flat-panel displays, robotic systems, and medical electronics and diagnostics are a few examples of the miniaturized device technologies that depend on the utilization of thin film materials. This book presents an in-depth overview of the novel developments made by the scientific leaders in the area of modern dielectric films for advanced microelectronic applications. It contains clear, concise explanations of material science of dielectric films and their problem for device operation, including high-k, low-k, medium-k dielectric films and also specific features and requirements for dielectric films used in the packaging technology. A broad range of related topics are covered, from physical principles to design, fabrication, characterization, and applications of novel dielectric films.

Author Biography

Karen Maex, IMEC Fellow, Silicon Process and Device Technology Division, Leuven, Belgium & Professor at Katholieke Universiteit Leuven

Mikhail R. Baklanov, Principal Scientist, Silicon Process and Device Technology Division, IMEC, Leuven, Belgium

IMEC is the largest independent microelectronics R&D centre in Europe, with over 1250 staff. R&D ranges from the design of complex single-chip and single-package systems for telecommunications and multimedia, new process technologies for optoelectronics, photovoltaics, area-array packing, etc.

Table of Contents

Series Preface

Preface

Low and Ultralow Dielectric Constant Films Prepared by Plasma-Enhanced Chemical Vapor Deposition

Spin-On Dielectric Materials

Porosity of Low Dielectric Constant Materials

Positron Annihilation Spectroscopy

Structure Characterization of Nanoporous Interlevel Dielectric Thin Films with X-ray and Neutron Radiation

Ellipsometric Porosimetry

Mechanical and Transport Properties of Low-k Dielectrics

Integration of low-k dielectric films in damascene processes

ONO structures and oxynitrides in modern microelectronics. Material science, characterization and application

High Dielectric constant Materials

Material Engineering of High-k Gate Dielectrics

Physical Characterisation of ultra-thin high-k dielectric

Electrical Characterization of Advanced Gate Dielectrics

Medium dielectric constant materials

Integration Issues of High-k Gate Dielectrics

Dielectric films for interconnects (packaging)

Anisotropic Conductive Film (ACF) for Advanced Microelectronic Interconnects

Index

Table of Contents provided by Publisher. All Rights Reserved.