Brent Keeth is a Fellow in DRAM Design R&D at Micron Technology, Inc. His twenty-five years of industry experience spans radar systems, avionics components, communicationsystems, professional production and post-production equipment for the broadcast television industry, and solid-state memory. He holds over 400 U.S. and foreign granted or pending patents.
R. Jacob Baker, PhD, is an engineer, educator, and inventor. He has more than twenty years of engineering experience and holds over 200 granted or pending patents in integrated circuit design. Dr. Baker is the author of several circuit design books. For a detailed biography, see http://cmosedu.com/jbaker/jbaker.htm.
Brian Johnson is a Senior Design Engineer in DRAM Design R&D at Micron Technology, Inc. His research interests include asynchronous sequential circuits, clock synchronization circuits, and high-speed logic design. He holds over 60 granted or pending patents related to DRAM design and integrated circuit design.
Feng Lin, PhD, is a Senior Design Engineer in DRAM Design R&D at Micron Technology, Inc. His research interests include high-speed I/O circuits, PLL/DLL, and mixed-signal circuit design. Dr. Lin holds over 50 granted or pending patents related to DRAM and integrated circuit design.
Preface | p. xi |
An Introduction to DRAM | |
DRAM Types and Operation | p. 1 |
The 1k DRAM (First Generation) | p. 1 |
The 4k-64 Meg DRAM (Second Generation) | p. 7 |
Synchronous DRAM (Third Generation) | p. 15 |
DRAM Basics | p. 22 |
Access and Sense Operations | p. 24 |
Write Operation | p. 28 |
Opening a Row (Summary) | p. 29 |
Open/Folded DRAM Array Architectures | p. 31 |
The DRAM Array | |
The Mbit Cell | p. 33 |
The Sense Amp | p. 44 |
Equilibration and Bias Circuits | p. 44 |
Isolation Devices | p. 46 |
Input/Output Transistors | p. 46 |
Nsense and Psense Amplifiers | p. 47 |
Rate of Activation | p. 49 |
Configurations | p. 49 |
Operation | p. 52 |
Row Decoder Elements | p. 54 |
Bootstrap Wordline Driver | p. 55 |
NOR Driver | p. 57 |
CMOS Driver | p. 58 |
Address Decode Tree | p. 58 |
Static Tree | p. 59 |
P&E Tree | p. 59 |
Predecoding | p. 60 |
Pass Transistor Tree | p. 61 |
Discussion | p. 61 |
Array Architectures | |
Array Architectures | p. 65 |
Open Digitline Array Architecture | p. 65 |
Folded Array Architecture | p. 75 |
Design Examples: Advanced Bilevel DRAM Architecture | p. 83 |
Array Architecture Objectives | p. 84 |
Bilevel Digitline Construction | p. 85 |
Bilevel Digitline Array Architecture | p. 68 |
Architectural Comparison | p. 93 |
The Peripheral Circuitry | |
Column Decoder Elements | p. 99 |
Column and Row Redundancy | p. 102 |
Row Redundancy | p. 104 |
Column Redundancy | p. 107 |
Global Circuitry and Considerations | |
Data Path Elements | p. 111 |
Data Input Buffer | p. 111 |
Data Write Muxes | p. 115 |
Write Driver Circuit | p. 116 |
Data Read Path | p. 118 |
DC Sense Amplifier (DCSA) | p. 119 |
Helper Flip-Flop (HFF) | p. 121 |
Data Read Muxes | p. 122 |
Output Buffer Circuit | p. 124 |
Test Modes | p. 125 |
Address Path Elements | p. 126 |
Row Address Path | p. 126 |
Row Address Buffer | p. 127 |
CBR Counter | p. 127 |
Predecode Logic | p. 128 |
Refresh Rate | p. 128 |
Array Buffers | p. 130 |
Phase Drivers | p. 131 |
Column Address Path | p. 131 |
Address Transition Detection | p. 132 |
Synchronization in DRAMs | p. 135 |
The Phase Detector | p. 137 |
The Basic Delay Element | p. 137 |
Control of the Shift Register | p. 138 |
Phase Detector Operation | p. 139 |
Experimental Results | p. 140 |
Discussion | p. 142 |
Voltage Converters | |
Internal Voltage Regulators | p. 147 |
Voltage Converters | p. 147 |
Voltage References | p. 148 |
Bandgap Reference | p. 153 |
The Power Stage | p. 154 |
Pumps and Generators | p. 158 |
Pumps | p. 158 |
DVC2 Generator | p. 165 |
Discussion | p. 165 |
An Introduction to High-Speed DRAM | |
The Performance Paradigm | p. 167 |
Performance for DRAM Memory Devices | p. 169 |
Underlying Technology Improvements | p. 171 |
High-Speed Die Architectures | |
Introduction: Optimizing DRAM Architecture for High Performance | p. 173 |
Architectural Features: Bandwidth, Latency, and Cycle Time | p. 175 |
Architectural Limiters: The Array Data Path | p. 176 |
Architectural Limiters: The Read Data Path | p. 183 |
Architectural Limiters: Latency | p. 186 |
Conclusion: Designing for High Performance | p. 190 |
Input Circuit Paths | |
Introduction | p. 193 |
Input Receivers | p. 196 |
Matched Routing | p. 200 |
Capture Latches | p. 203 |
Input Timing Adjustments | p. 206 |
Current Mode Logic (CML) | p. 212 |
Output Circuit Paths | |
Transmission Line, Impedance, and Termination | p. 220 |
Impedance Control | p. 224 |
Simultaneous Switching Noise (SSN) | p. 230 |
Signal Return Path Shift (SRPS) | p. 238 |
Electrostatic Discharge (ESD) | p. 242 |
Parallel-to-Serial Conversion | p. 244 |
Emerging Memory I/O Features | p. 248 |
Timing Circuits | |
Introduction | p. 251 |
All-Digital Clock Synchronization Design | p. 254 |
Timing Analysts | p. 255 |
Digital Delay Line | p. 259 |
Phase Detector (PD) | p. 267 |
Test and Debug | p. 273 |
Dual-Loop Architecture | p. 274 |
Mixed-Mode Clock Synchronization Design | p. 275 |
Analog Delay Line | p. 276 |
Charge-Pump Phase Detector (CPPD) | p. 283 |
Dual-Loop Analog DLL | p. 286 |
Mixed-Mode DLL and Its Applications | p. 289 |
What's Next for Timing | p. 291 |
Control Logic Design | |
Introduction | p. 295 |
DRAM Logic Styles | p. 298 |
Process Limitations | p. 298 |
Array Operation | p. 301 |
Performance Requirements | p. 304 |
Delay-Chain Logic Style | p. 306 |
Domino Logic | p. 309 |
Testability | p. 314 |
Command and Address Control | p. 317 |
Command Decoder | p. 318 |
Read and Write Data Address Registers | p. 324 |
Column Access Control | p. 328 |
Write Data Latency Timing and Data Demultiplexing | p. 330 |
Write Latency Timing | p. 332 |
Write Data Demultiplexing | p. 338 |
Read Data Latency Timing and Data Multiplexing | p. 346 |
Read Data FIFO | p. 350 |
Read Latency (CL) Tracking | p. 359 |
Comments on Future Direction for DRAM Logic Design | p. 367 |
Power Delivery | |
Power Delivery Network Design | p. 373 |
Device/Package Co-design | p. 376 |
Full-Chip Simulations | p. 380 |
Future Work in High-Performance Memory | p. 385 |
Appendix | p. 391 |
Glossary | p. 407 |
Index | p. 413 |
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