Electronic Materials and Processes Handbook

by Harper, Charles A.

• ISBN13: 9780071402149
• ISBN10: 0071402144
• Edition: 3rd
• Format: Hardcover
• Copyright: 2003-08-07
• Publisher: McGraw-Hill Professional

Summary

Micro-miniaturization in electronics--a necessity for personal communications devices like cell phones and PDAs--has radically altered the materials these electronics are made from. This new edition, the first update of the handbook since 1993, is a complete rewrite, reflecting the great importance of engineering materials for thermal management and flexibility and microminiature sizes, and will be an invaluable tool to anyone working in electronic packaging, fabrication, or assembly design. * ALL NEW--A complete rewrite of the previous edition * Details and characterizes every major material type, allowing engineers to make accurate, cost-effective design choices * Full materials breakdown for high density packaging techniques * Materials for communications wiring and cabling

Author Biography

Charles A. Harper is President of Technology Seminars, Inc., of Lutherville, Maryland, an organization dedicated to presentation of educational seminars in the field of electronic packaging and materials. He has authored over a dozen well known books in the field and is among the founders and past presidents of the International Microelectronics and Packaging Society. He is also Series Editor for the McGraw-Hill Electronic Packaging and Interconnection Series. Mr. Harper is a graduate of The Johns Hopkins School of Engineering, where he also served as Adjunct Professor.

Table of Contents

Chapter 1: Development and Fabrication of IC Chips

Chapter 2: Plastics, Elastomers, and Composites

Chapter 3: Ceramics and Glasses

Chapter 4: Metals

Chapter 5: Solder Technologies for Electronic Packaging and Assembly

Chapter 6: Electroplating and Deposited Metallic Coatings

Chapter 7: Printed Circuit Board Fabrication

Chapter 8: Materials and Processes for Hybrid Microelectronics and Multichip Modules

Chapter 9: Adhestives Underfills, and Coatings in Electronics Assemblies

Chapter 10: Thermal Management Materials and Systems

Index