did-you-know? rent-now

Amazon no longer offers textbook rentals. We do!

did-you-know? rent-now

Amazon no longer offers textbook rentals. We do!

We're the #1 textbook rental company. Let us show you why.

9780521516136

Electronic Thin-Film Reliability

by
  • ISBN13:

    9780521516136

  • ISBN10:

    0521516137

  • Format: Hardcover
  • Copyright: 2011-01-17
  • Publisher: Cambridge University Press

Note: Supplemental materials are not guaranteed with Rental or Used book purchases.

Purchase Benefits

  • Free Shipping Icon Free Shipping On Orders Over $35!
    Your order must be $35 or more to qualify for free economy shipping. Bulk sales, PO's, Marketplace items, eBooks and apparel do not qualify for this offer.
  • eCampus.com Logo Get Rewarded for Ordering Your Textbooks! Enroll Now
  • Write a Review Icon Write a Review
List Price: $71.99 Save up to $24.12
  • Rent Book $47.87
    Add to Cart Free Shipping Icon Free Shipping

    TERM
    PRICE
    DUE
    SPECIAL ORDER: 1-2 WEEKS
    *This item is part of an exclusive publisher rental program and requires an additional convenience fee. This fee will be reflected in the shopping cart.

Supplemental Materials

What is included with this book?

Summary

Thin films are widely used in the electronic device industry. As the trend for miniaturization of electronic devices moves into the nanoscale domain, the reliability of thin films becomes an increasing concern. Building on the author's previous book, Electronic Thin Film Science by Tu, Mayer and Feldman, and based on a graduate course at UCLA given by the author, this new book focuses on reliability science and the processing of thin films. Early chapters address fundamental topics in thin film processes and reliability, including deposition, surface energy and atomic diffusion, before moving onto systematically explain irreversible processes in interconnect and packaging technologies. Describing electromigration, thermomigration and stress migration, with a closing chapter dedicated to failure analysis, the reader will come away with a complete theoretical and practical understanding of electronic thin film reliability. Kept mathematically simple, with real-world examples, this book is ideal for graduate students, researchers and practitioners.

Table of Contents

Thin film applications to microelectronic technology
Thin film deposition
Surface energy in thin films
Atomic diffusion in crystalline solids
Applications of diffusion equation
Elastic stress and strain in thin films
Surface kinetic processes on thin films
Interdiffusion and reaction in thin films
Grain boundary diffusion
Irreversible processes in interconnect and packaging technology
Electromigration in metals
Electromigration induced failure in Al and Cu interconnects
Thermomigration
Stress migration in thin films
Reliability science and analysis
A brief review of thermodynamic functions
Defect concentration in solids
Step-by-step derivation of Huntington's electron wind force
Elastic constants tables and conversions
Terrace size distribution in Si MBE
Interdiffusion coefficient
Units, tables of conversions, period table
Table of Contents provided by Publisher. All Rights Reserved.

Supplemental Materials

What is included with this book?

The New copy of this book will include any supplemental materials advertised. Please check the title of the book to determine if it should include any access cards, study guides, lab manuals, CDs, etc.

The Used, Rental and eBook copies of this book are not guaranteed to include any supplemental materials. Typically, only the book itself is included. This is true even if the title states it includes any access cards, study guides, lab manuals, CDs, etc.

Rewards Program