Electrothermal Analysis of Vlsi Systems

by Cheng, Yi-Kan; Tsai, Ching-Han; Teng, Chin-Chi; Kang, Sung-Mo

• ISBN13: 9780792378617
• ISBN10: 079237861X
• Format: Hardcover
• Copyright: 2000-05-01
• Publisher: Kluwer Academic Pub

Summary

Electrothermal Analysis of VLSI Systems addresses electrothermal problems in modern VLSI systems. Part I, The Building Blocks, discusses electrothermal phenomena and the fundamental building blocks that electrothermal simulation requires (including power analysis, temperature-dependent device modeling, thermal/electrothermal simulation, and experimental setup-calibration). Part II, The Applications, discusses three important applications of VLSI electrothermal analysis including temperature-dependent electromigration diagnosis, cell-level thermal placement and temperature-driven power and timing analysis. Electrothermal Analysis of VLSI Systems will be useful for researchers in the fields of IC reliability analysis and physical design, as well as VLSI designers and graduate students.

Table of Contents

List of Figures	ix
List of Tables	xv
Preface	xvii
Acknowledgments	xxi
Part I THE BUILDING BLOCKS
Introduction	3	(18)
Electrothermal Phenomena in VLSI Systems	4	(1)
Introduction to Electrothermal Simulation	5	(7)
Overview of Electrothermal Simulation for ICs	6	(6)
ILLIADS-T: An Electrothermal Simulator for VLSI Systems	12	(3)
Overview of this Book	15	(6)
Power Analysis for CMOS Circuits	21	(24)
Introduction	21	(1)
Sources of Power Consumption in CMOS Technology	21	(7)
Dynamic Power	22	(1)
Internal Power	23	(1)
Short-Circuit Power	24	(1)
Leakage Power	25	(3)
Power Analysis Overview	28	(1)
Introduction to Power Analysis Techniques	29	(10)
Deterministic Power Analysis	29	(1)
Probabilistic Power Analysis	30	(3)
Statistical Power Analysis	33	(4)
Power Analysis for Sequential Circuits	37	(2)
Summary	39	(6)
Temperature-Dependent MOS Device Modeling	45	(16)
Introduction	45	(1)
Temperature-dependent Device Physics and Modeling	46	(2)
Temperature-dependent Threshold Voltage	46	(1)
Temperature-dependent Carrier Mobility	47	(1)
Temperature-dependent BSIM Model for SPICE Simulation	48	(3)
Regionwise Quadratic (RWQ) Model	51	(6)
Temperature-dependent Mobility Modeling	53	(1)
μ0(T) Extraction for RWQ Modeling	54	(1)
Mobility and RWQ Fitting Examples	54	(3)
Summary	57	(4)
Thermal Simulation for VLSI Systems	61	(34)
Introduction	61	(3)
Substrate/Package Modeling: An Overview	64	(1)
Formulation of Thermal Analysis	65	(18)
Fast Thermal Analysis	65	(7)
Numerical Approach	72	(7)
Analytical Approach	79	(3)
Discussion	82	(1)
Package Simulation	83	(5)
Modeling of the Convective Boundaries	83	(1)
Modeling of Heat Flow Paths	84	(4)
Summary	88	(7)
Fast-Timing Electrothermal Simulation	95	(26)
Introduction	95	(1)
ILLIADS: A Fast Timing Simulator	96	(5)
Primitive Formation and Solutions	96	(2)
Simulation Strategies	98	(3)
Power Estimation using ILLIADS	101	(1)
Incremental Electrothermal Simulation in ILLIADS-T	101	(2)
Tester Chip Design and Calibration	103	(2)
Verification of ILLIADS-T	105	(7)
ILLIADS-T Simulation Examples	112	(4)
Summary	116	(5)
Part II THE APPLICATIONS
Temperature-Dependent Electromigration Reliability	121	(36)
Motivation	121	(1)
Electromigration (EM) Physics	122	(7)
EM Lifetime Dependence on Current Density	123	(1)
EM Lifetime Dependence on Current Waveforms	124	(3)
EM Lifetime Dependence on Interconnect Width and Length	127	(2)
EM Model Used in the Book	129	(1)
EM Simulation: An Overview	129	(4)
iTEM: A Temperature-dependent EM Diagnosis Tool	133	(15)
Interconnect Temperature Estimation	133	(2)
Analytical Model of Interconnect Thermal System	135	(1)
Lumped Model of Interconnect Thermal System	136	(7)
iTEM Simulation Examples	143	(5)
Summary	148	(9)
Temperature-Driven Cell Placement	157	(24)
Introduction	157	(1)
Overview	157	(3)
Substrate Temperature Calculation	160	(1)
Compact Substrate Thermal Modeling	161	(4)
Transfer Thermal Resistance Matrix	161	(2)
Admittance Matrix Reduction	163	(1)
Runtime Efficiency of Compact Thermal Modeling	164	(1)
Thermal Placement Algorithms	165	(4)
Standard Cell Thermal Placement	165	(3)
Macrocell Thermal Placement	168	(1)
Simulation Examples	169	(3)
Summary	172	(9)
Temperature-Driven Power and Timing Analysis	181	(24)
Introduction	181	(1)
Timing Analysis Overview	182	(9)
Dynamic Timing Analysis	182	(1)
Static Timing Analysis	183	(7)
Delay Modeling	190	(1)
Statistical Power Density Estimation	191	(1)
Monte-Carlo Power-Temperature Iteration Scheme	192	(2)
Temperature-dependent Gate and RC Delays	194	(1)
Simulation Examples	194	(5)
Summary	199	(6)
Index	205