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9780792384878

Flash Memories

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  • ISBN13:

    9780792384878

  • ISBN10:

    0792384873

  • Format: Hardcover
  • Copyright: 1999-05-01
  • Publisher: Kluwer Academic Pub
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Summary

Most of the current applications of electronics require non-volatile memories, which can keep stored information when the power supply is switched off. Flash memories (in which a single cell can be electrically programmed and a large number of cells are usually electrically erased at the same time) are the most versatile non-volatile memories. They are widely used to store the basic input-output system (BIOS) of personal computers, the software and personal data of cellular phones, identification codes in smart cards and many other applications. Flash memories allow software updates, change of passwords and codes, and reconfiguration of the system in the field. They can be designed and optimized to create large-size memories which can successfully substitute hard disks for specific applications, having lower power consumption and weight, shorter access times, and far better robustness. This book is devoted entirely to flash memories and has been designed to provide comprehensive information on basic memory cell structures, device physics and technology, simulation circuit architecture, system issues, testing and reliability. It also provides data on advanced subjects related to multi-level storage cells, embedded memories and system applications of flash memories.

Table of Contents

Flash Memories: An Overview
1(36)
P. Olivo
E. Zanoni
Role of Non Volatile Memories in Microelectronic Systems and in Semiconductor Market
1(2)
Evolution of Non-volatile Memories
3(1)
The Floating Gate Device
4(3)
Charge Injection Mechanisms
7(1)
Erasable Programmable Read Only Memories
7(2)
The Floating gate Avalanche-injection MOS transistor (FAMOS) Cell
7(1)
The basic Erasable Programmable Read Only Memory (EPROM)
8(1)
Electrically Erasable Programmable Read Only Memories
9(6)
The FLOating gate Thin Oxide (FLOTOX) Memory Cell
9(1)
Textured Polysilicon Cells
10(2)
The EEPROM Architecture
12(1)
Ferroelectric Memories
13(2)
Flash Memories: The Basic ETOX Cell. Programming and Erasing Mechanisms
15(1)
Memory NOR Architecture and Related Issues
16(8)
The NAND Flash Mass Storage Concept
24(2)
Embedded Flash Memories
26(1)
The Future of Flash Memories
27(10)
Evolution of Flash Memory Technology
27(2)
Non Volatile Memories Market Development
29(4)
References
33(4)
The Industry Standard Flash Memory Cell
37(54)
P. Pavan
R. Bez
Introduction
38(4)
Basic Structure
42(4)
Operating Conditions
46(12)
Read
46(1)
Program
47(6)
Erase
53(5)
Technology and Process
58(16)
Isolation
60(1)
Well and Channel Doping
61(3)
Cell Structure Definition
64(4)
Interlevel Dielectrics
68(2)
Interconnections
70(4)
Final Passivation
74(1)
Yield and Reliability
74(7)
Retention
75(1)
Endurance
75(1)
Reading Disturbs
76(1)
Programming Disturbs
77(2)
Erasing Disturbs
79(2)
Scaling Issues
81(10)
References
83(8)
Binary and Multilevel Flash Cells
91(62)
B. Eitan
A. Roy
Introduction to Flash Cell Design
91(2)
Binary Flash Cells
93(44)
Figures of Merit
93(1)
Cell Design Complication Hierarchy from ROM to Flash
94(2)
Basis for Flash Cells/Array Classification
96(2)
Detailed Description of Flash Cells and Architectures
98(33)
Scaling and Conclusions
131(6)
Multilevel Flash Cells
137(16)
Introduction to the Concept of Multilevel Flash
137(1)
Multilevel Programming Mechanisms
138(4)
Architectures for Multilevel Flash Memories
142(4)
Scaling and Trade-Offs for Multilevel
146(1)
References
147(6)
Physical Aspects of Cell Operation and Reliability
153(88)
L. Selmi
C. Fiegna
Introduction
153(2)
Electronic Properties of Carriers and MOS Structures
155(6)
Electrons in Crystals
155(1)
Electrons as Classical Particles
156(1)
Silicon
157(1)
Silicon Dioxide
157(2)
Silicon-Silicon Dioxide Interface
159(1)
Oxide and Interface Traps
159(2)
Fundamentals of Tunneling Phenomena
161(4)
Basic Concepts and the WKB Approximation
161(1)
Transmission Coefficient
162(3)
Tunneling Current
165(1)
Tunneling Phenomena in MOSFETs
165(11)
Fowler-Nordheim and Direct Tunneling Through Gate Oxides
166(1)
Modeling the Tunnel Current of MOS Structures
167(3)
Band-to-band and Trap-to-band Tunneling
170(4)
Modeling the Band-to-band and Trap-to-band Tunneling Current
174(2)
Fundamentals of Carrier Transport
176(9)
The Distribution Function
176(2)
The Boltzmann Transport Equation
178(2)
Scattering
180(1)
The Carrier Distribution in Thermal Equilibrium
181(1)
Carrier Distributions in Homogeneous Electric Fields
182(2)
The Effective Temperature Model
184(1)
Hot Carrier Effects in MOSFETs
185(22)
Carrier Heating in MOSFETs and Flash Cells
186(3)
MOSFET Design and Carrier Heating
189(1)
Simplified Models of Carrier Heating
190(1)
Average Energy
190(1)
Carrier Distribution
191(1)
Impact Ionization
192(2)
Substrate Current
194(3)
Hot Carrier Injection into SiO+2
197(1)
Distribution Function
198(1)
Injection Probability
198(1)
Gate Current
199(1)
Channel Hot Electron Injection
199(2)
Drain Avalanche Hot Carrier Injection
201(1)
Secondary Generated Hot Electron Injection
202(1)
Substrate Hot Electron Injection
203(2)
Implications for Device Operation
205(1)
Hot Carrier Effects at Low Voltages
206(1)
Oxide Degradation due to High Field Stress
207(10)
Oxide Wear-out and SILC
207(3)
Stress Induced Leakage Currents (SILC)
210(1)
Oxide Breakdown
211(2)
Lifetime Evaluation Models
213(1)
SILC Lifetime Evaluation Model
214(1)
Breakdown Lifetime Evaluation Model
215(2)
Oxide and Interface Degradation due to Hot Carrier Injection
217(24)
Homogeneous Hot Carrier Degradation
217(1)
n-channel Devices
217(1)
p-channel Devices
218(1)
Non-homogeneous Hot Carrier Degradation
218(3)
Lifetime Evaluation Models
221(2)
References
223(18)
Memory Architecture and Related Issues
241(120)
M. Branchetti
G. Campardo
S. Commodaro
S. Ghezzi
A. Ghilardelli
C. Golla
M. Maccarrone
I. Martines
R. Micheloni
J. Mulatti
M. Zammattio
S. Zanardi
Flash Architecture: General Overview
241(16)
Flash Architecture Scenario
242(1)
NOR Cell Operation and Array Organization
243(7)
Flash Memory User Interface
250(3)
Flash Memory Operations: Overview
253(1)
Read Path Building Blocks Description
253(3)
Program Path Building Blocks Description
256(1)
Erase Path Building Blocks Description
256(1)
Read Path: Decoding
257(13)
Predecoding
259(1)
Row Decoder
259(4)
Column Decoder
263(1)
Hierarchical Decoder
264(2)
Low VCC Problems
266(1)
Boost Concept: Continuous Boost and ``One-shot'' Bost
267(1)
A New Boost Approach: Miniboost
268(2)
Read Path: Input and Output Buffers
270(10)
Input Buffer
270(2)
Output Buffer
272(3)
Noise Issues
275(2)
High Voltage Tolerance
277(3)
Read Path: Sensing Techniques
280(34)
Sensing Techniques: An Overview
281(4)
Differential Sensing Technique
285(4)
Differential Sensing Technique with Offset Current
289(4)
Differential Semi-Parallel Sensing Technique
293(2)
Reading Speed-up Techniques
295(9)
From EPROM to Flash
304(1)
Reading Flash Memories with Depleted Bits
305(3)
Low Voltage Flash Read
308(4)
Reference Problems
312(2)
Program Operation Circuitry
314(13)
Cell Programming Voltages: Optimum Choice
314(1)
Typical Program Path
315(2)
Drain Voltage Regulation: Principles and Basic Circuits
317(3)
Gate Voltage Regulation Fundamentals
320(7)
Erase Operation Circuitry
327(10)
Double Supply Voltage Approach
329(1)
Source Erase Circuitry
329(1)
Slow Discharge of Critical Nodes
330(1)
Single Supply Voltage Approach
331(1)
Charge Pumping
332(3)
Voltage Regulators
335(1)
Source Switch
336(1)
Control Logic and Embedded Algorithms
337(13)
Logic Architecture
339(4)
Embedded Algorithms
343(1)
Sequencer (Pseudo-Microcontroller)
344(1)
Finite State Machine
344(1)
Program Flow
344(2)
Erase Flow
346(2)
Erase Suspend-Erase Resume
348(1)
Testability Issues
348(2)
Redundancy and Error Correction Codes
350(11)
The Yield
350(2)
Static Redundancy
352(1)
Wafer Yield
353(1)
A Real Case
354(2)
Error Correction Codes
356(5)
Multilevel Flash Memories
361(38)
G. Torelli
M. Lanzoni
A. Manstretta
B. Ricco
Introduction
362(6)
The Multilevel Approach
362(2)
Basic Issues for ML Storage
364(4)
Array Architectures for Multilevel Flash Memories
368(5)
NOR Architecture with CHE Programming
369(2)
NOR Architecture with FN Programming
371(1)
NAND Architecture
371(2)
Multilevel Sensing
373(9)
Signal Production and Recognition
374(2)
Sensing Schemes
376(6)
Multilevel Programming
382(7)
Program-and-Verify Approaches
384(3)
Self-Controlled Approaches
387(2)
Conclusions
389(10)
References
391(8)
Flash Memory Reliability
399(44)
P. Cappelletti
A. Modelli
Introduction
399(2)
Memory Array V+t Distributions and Tunnel Oxide ``Defects''
401(8)
Main Yield and Reliability Issues
409(8)
Over-Erasing
409(2)
Program Disturbs
411(3)
Read Disturb
414(1)
Program/Erase Endurance
415(1)
Data Retention
416(1)
Testing for Reliability
417(1)
Failure Modes Induced by Program/Erase Cycling
418(18)
Memory Cell Intrinsic Endurance
418(4)
The Behavior of Tail Bits
422(1)
Single Bit Failure Mechanisms
422(1)
The Erratic Erase Phenomenon
423(3)
Single Bit Data Loss after Program/Erase Cycling
426(4)
Gain Degradation
430(6)
Multilevel Storage Reliability
436(3)
Conclusion
439(4)
References
439(4)
Flash Memory Testing
443(38)
G. Casagrande
Introduction
443(3)
Impact of Testing on Product Cost
443(1)
Impact on Product Life Cycle
444(1)
Objectives of Production Testing
445(1)
Testing Versus Quality and Reliability
445(1)
Flash Testing Aspects
446(4)
Flash Functional Model
446(1)
Oxide Stress in a Flash
446(1)
Flash Testing Aspects
447(1)
Conceptual Test Flow
448(2)
Flash Testability Tools
450(10)
Focus on Cell and Technology
450(1)
Direct Memory Access
451(1)
Vt Measurement
452(2)
Stress Modes
454(1)
Depletion/Low-Vt Test
455(2)
Focus on Test Productivity
457(1)
Focus on Design
457(1)
Flash Design Testability: an Example
458(2)
Fault Repairing
460(6)
Error Correction
462(1)
Redundancy
462(2)
Diagnosis and Repairing
464(1)
Testability Tools for Redundancy
465(1)
Production Testing
466(4)
DC Tests
467(1)
Functional Testing
468(1)
AC Read/Command Interface
469(1)
Erase/Program Performance; Endurance
470(1)
Reliability
470(1)
Test Productivity
470(4)
Impact on Tester Structure
471(2)
Parallel Testing Final Test
473(1)
Parallel Testing at EWS
473(1)
Product Characterization
474(4)
Conclusions
478(3)
References
479(2)
Flash Memories: Market, Marketing and Economic Challenges
481
B. Beverina
P. Berge
C. Kunkel
G. Moy
A. Damiano
R. Ferrara
A. Re
Introduction
482(1)
Market Segmentations
483(12)
Application Segments and Subsegments
485(3)
Technology, Performances and Applications
488(4)
Segment Dynamics
492(1)
Commodity or Non-Commodity?
493(2)
Customer/Supplier Relationship
495(1)
The Development of the Flash Market
496(3)
Flash Memory and the ``Economy''
499(1)
Applications More in Detail
500(25)
Survey
500(3)
Flash in Mobile Phones and Terminals
503(5)
Flash in the BIOS
508(7)
Flash in Automotive
515(10)
Conclusions
525
References
526

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