Global Life Cycle Impact Assessments of Material Shifts

by Andrae, A. S. G.

• ISBN13: 9781848826601
• ISBN10: 1848826605
• Format: Hardcover
• Copyright: 2009-10-01
• Publisher: Springer Verlag

Summary

Planet Earth is under stress from various environmental factors, increasing the importance of being able to estimate the environmental costs associated with dynamic material shifts. Such shifts are occurring in the electronics industry and the most famous recent example is the introduction of lead-free solders. Global Life Cycle Impact Assessments of Material Shifts describes the environmental implications of this shift to lead-free solders and conductive adhesives using the standardized methodology of environmental life-cycle assessment (LCA). As the product systems involved are rather small for interconnection materials it is possible ' using uncertainty analysis and consequential LCA ' to arrive at robust conclusions, even in the difficult holistic field of environmental cost accounting. The lead-free shift has many implications, such as the export of electronics waste, resource consumption, recycling issues, and technology development.LCA is rapidly developing to include more and more impact assessment, and refined weighting methods. In the end, the goal is to be able to quantify the environmental consequences of decisions and this book presents tools, data, and methodologies in detail. It provides an understanding of current technological shifts and the potential environmental consequences, along with several illustrative examples.Global Life Cycle Impact Assessments of Material Shifts will benefit engineers and environmental experts within the electronics and materials industry, enabling them to assess the environmental costs of their own product systems.

Table of Contents

Abbreviations	p. xv
List of Figures	p. xvii
List of Tables	p. xxi
Introduction	p. 1
Background	p. 1
Goal and Scope	p. 7
Outline of the Book	p. 7
References	p. 8
Interconnection Materials - Technical Research Status	p. 11
Solders	p. 11
Pb-based Low-melting-point Solders	p. 12
Pb-based High-melting-point Solders	p. 12
Pb-free Low-melting-point Solders	p. 13
Pb-free High-melting-point Solders	p. 15
Pb-free Solder Paste Based on Nanoparticles	p. 15
Conductive Adhesives	p. 16
Isotropically Conductive Adhesives (ICAs)	p. 17
Anisotropically Conductive Adhesives (ACAs)	p. 17
Non-conductive Adhesives (NCA)	p. 18
Conductive Adhesives Based on Nanoparticles	p. 18
Solder-free Alternatives	p. 18
Plating Materials and Metal Spheres for Ball Grid Arrays	p. 19
Printed Wiring Board Pad Platings	p. 20
Metal Spheres for Ball Grid Arrays	p. 20
Perspectives	p. 20
References	p. 20
Environmental Life Cycle Assessment from a LIME Perspective	p. 23
Definition of LCA and LCI	p. 24
Allocation	p. 27
Application of LCA	p. 29
Environmental Cost	p. 29
The Japanese LIME System for Life Cycle Impact Assessment	p. 31
The Framework for LIME	p. 40
Characterization	p. 42
Damage Assessment	p. 43
Integration	p. 45
Previous Research on LCA of Interconnection Materials	p. 46
LCA-based Approaches	p. 46
Other Types of Environmental Assessment Approaches	p. 50
Case Studies of Interconnection Materials Using Other Methods than LCA	p. 51
The Need for the Present Research	p. 55
References	p. 56
Methodology	p. 59
Software	p. 59
SimaPro	p. 59
EcoLab	p. 60
Chain Management by Life Cycle Assessment	p. 61
Excel Management by LCA	p. 63
Databases	p. 72
Methodology for Consequential Process-sum LCIA Using LIME and Uncertainty Analysis	p. 72
Consequential LCI	p. 75
Identification of Static Long-term Marginal Technologies	p. 84
Identification of Marginal Consumers	p. 84
Sn Market	p. 85
Ag Market	p. 88
Bi Market	p. 90
Input-Output Tables Expanded with Environmental Loadings	p. 93
The Relation Between the EEIOLCI and the Consequential LCI	p. 93
Eco-efficiency	p. 94
Data Analysis in LCI - Dominance, Uncertainty, and Sensitivity	p. 95
Accuracy and Precision of Data in LCA	p. 96
Important Remarks About Software Capability of Calculating Uncertainty	p. 96
References	p. 97
LCA Case Studies of Solders	p. 99
Pb Solder Compared to Pb-free Solder	p. 99
Scope	p. 102
Results and Discussion	p. 117
Conclusions	p. 117
LIME Evaluation of the Shift to Pb-free	p. 119
Scope	p. 119
Results and Discussion	p. 119
Conclusions	p. 121
Toxicity Evaluations	p. 122
Scope	p. 122
Results and Discussion	p. 122
Conclusions	p. 126
Future Solders Assessed	p. 126
Description of Life Cycles	p. 127
Results and Discussion	p. 129
Conclusions	p. 134
References	p. 135
LCAs of Pb Solders vs. Conductive Adhesives	p. 137
Comparative LIME Analysis of Plating Materials	p. 137
Scope	p. 137
Results and Discussion.	p. 139
Conclusions	p. 139
LCA for High-temperature Materials Using Alternate LCI Data	p. 141
Hidden Material Flows	p. 142
Scope	p. 145
Results and Discussion	p. 145
Conclusions	p. 147
Estimation of the LIME-based Environmental Cost of Future Conductive Adhesives	p. 148
Scope	p. 148
Results and Discussion	p. 151
Conclusions	p. 158
References	p. 158
Discussion	p. 161
Solders	p. 162
Arguments About Pb-free Materials and Responses	p. 163
Platings	p. 167
Conductive Adhesives	p. 167
Are Pb-free Interconnection Materials "Ecomaterials"?	p. 168
Leaching of Pb-Laboratory and Landfill	p. 169
References	p. 171
Conclusions	p. 173
Looking Ahead	p. 175
Reference	p. 177
Index	p. 179
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