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9780815513407

Handbook of Multilevel Metallization for Integrated Circuits

by ; ;
  • ISBN13:

    9780815513407

  • ISBN10:

    0815513402

  • Format: Hardcover
  • Copyright: 1993-12-31
  • Publisher: Elsevier Science

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Summary

The Handbook of Multilevel Metallization for Integrated Circuits answers and important need by pulling together in one volume a thorough technical summary of each of the key areas that make up a multilevel metal system. Included are associated design, analysis, materials, and manufacturing topics. The book then serves three purposes: It functions as a good learning tool for the engineer newly assigned to work in metallization; It serves as a reference text for any MLM engineer, new or experienced, who wishes to refresh their memory. For someone who wants to further specialize in one topical areas, an extensive listing of references has been provided.

Table of Contents

Introductionp. 1
Silicides and Contacts for ULSIp. 32
Aluminum Based Multilevel Metallizations in VLSI/ULSICsp. 97
Inorganic Dielectricsp. 202
Organic Dielectrics in Multilevel Metallization of Integrated Circuitsp. 274
Planarization Techniquesp. 346
Lithography and Etch Issues for a Multilevel Metallization Systemp. 461
Electro- and Stress-Migration in MLM Interconnect Structuresp. 579
Multilevel Metallization Test Vehiclep. 648
Manufacturing and Analytic Methodsp. 687
Characterization Techniques for VLSI Multilevel Metallizationp. 732
Electronic Packaging and Its Influences On Integrated Circuit Design and Processingp. 794
Future Interconnect Systemsp. 857
Indexp. 879
Table of Contents provided by Blackwell. All Rights Reserved.

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