Handbook of Thick- and Thin-Film Hybrid Microelectronics

by Gupta, Tapan K.

• ISBN13: 9780471272298
• ISBN10: 0471272299
• Edition: 1st
• Format: Hardcover
• Copyright: 2003-04-17
• Publisher: Wiley-Interscience

Summary

This is the first handbook on the fabrication and design of hybrid microelectronic circuits. Deals with all aspects of the technology, design, layout and processing of materials. Fills the need for a comprehensive survey of a widely-used technology.

Author Biography

TAPAN K. GUPTA, PhD, received an MA in Physics from Indian Institute of Technology, a PhD in Physics from Boston College, and was a Post Doctoral Fellow in the Electrical Engineering and Communication Department at Lehigh University. A former Analog Devices Career Development professor in the Electrical Engineering Department at Tufts University, Dr. Gupta is currently a senior research scientist in the advanced materials group at Radiation Monitoring Devices, MA. He is also responsible for the synthesis and characterization of new materials and their applications in nuclear medicine at the Massachusetts Institute of Technology, Cambridge, MA. Dr. Gupta has authored a book chapter on solar cells and materials for Allied Publications, New Delhi, and more than forty-five peer-reviewed articles in the field of physics, material science, and semiconductor physics.

Table of Contents

Preface	xiii
1 Introduction	1	(39)
1.1 Hybrid Microcircuit Family,	2	(2)
1.1.1 Printed Circuit Board,	3	(1)
1.1.2 Thick Film,	3	(1)
1.1.3 Thin Film,	3	(1)
1.1.4 Integrated Circuit,	3	(1)
1.1.5 Modules,	4	(1)
1.2 Need for Hybrid Microcircuits,	4	(7)
1.2.1 Multilayer Circuits,	6	(1)
1.2.2 Military Applications,	6	(1)
1.2.3 Data Processing,	7	(1)
1.2.4 Telecommunications,	7	(1)
1.2.5 Automotive Industry,	8	(1)
1.2.6 Medical Science,	9	(1)
1.2.7 Aerospace Systems,	10	(1)
1.2.8 High-Frequency Circuits,	10	(1)
1.3 Why Hybrid Microcircuits?	11	(2)
1.4 Applications of Hybrid Microcircuits,	13	(8)
1.4.1 Automotive Industry,	13	(1)
1.4.2 Commercial Products,	14	(1)
1.4.3 Medical Science,	15	(2)
1.4.4 Telecommunications,	17	(2)
1.4.5 Consumer Electronics,	19	(1)
1.4.6 Military Applications,	20	(1)
1.5 Typical Microelectronic Products,	21	(8)
1.5.1 Consumer Electronics,	21	(2)
1.5.2 Industrial Applications,	23	(2)
1.5.3 Military and Aerospace Applications,	25	(1)
1.5.4 Automotive Industry,	26	(1)
1.5.5 Microwave Engineering,	27	(1)
1.5.6 Multichip Modules,	28	(1)
1.6 Summary,	29	(1)
References,	29	(9)
Recommended Reading,	38	(2)
2 Mathematical Foundations, Circuit Design, and Layout Rules for Hybrid Microcircuits	40	(49)
2.1 Mathematical Foundations,	40	(22)
2.1.1 Factors Affecting the Value of a Resistor,	41	(10)
2.1.2 Mathematical Model for Thick-Film Deposition,	51	(1)
2.1.3 Theoretical Model for Screen-Printed Film Thickness,	52	(1)
2.1.4 Thick-Film Resistor Design,	52	(1)
2.1.5 Theoretical Model for Thin-Film Thickness,	53	(1)
2.1.6 Dissipation Factor or Dielectric Loss within a Dielectric Material,	54	(3)
2.1.7 Inductors,	57	(4)
2.1.8 Theoretical Model for Transport Properties during Hermetic Sealing,	61	(1)
2.2 Circuit Design and Layout Rules,	62	(20)
2.2.1 Hybrid Circuit Design Elements,	63	(4)
2.2.2 Thick-Film Hybrid Circuit Design,	67	(7)
2.2.3 Basic Rules for Laying Out Hybrid Microcircuits,	74	(8)
References,	82	(6)
Recommended Reading,	88	(1)
3 Computer-Aided Design and Pattern Generation Techniques	89	(37)
3.1 Computer-Aided Design Techniques,	89	(14)
3.1.1 Síze and Complexity of Hybrid Microcircuits,	90	(7)
3.1.2 CALMA Online Design Process,	97	(1)
3.1.3 Computer-Aided Engineering to Design Hybrid Microcircuits,	98	(2)
3.1.4 Circuit Layout Design,	100	(3)
3.2 Pattern Generation Techniques,	103	(16)
3.2.1 Additive Processes,	105	(1)
3.2.2 Subtractive Processes,	106	(3)
3.2.3 Photolithography,	109	(10)
References,	119	(5)
Recommended Reading,	124	(2)
4 Thick-Film Fundamentals	126	(35)
4.1 Thick-Film Substrates,	127	(11)
4.1.1 Substrate Materials,	128	(3)
4.1.2 Physical Properties,	131	(3)
4.1.3 Substrate Fabrication,	134	(1)
4.1.4 Electrical Properties,	135	(1)
4.1.5 Multilayer Technology Using LTCC,	136	(2)
4.2 Thick-Film Conductors,	138	(7)
4.2.1 Conduction in Metals,	138	(1)
4.2.2 Conductor Materials,	139	(5)
4.2.3 Conductor Pastes,	144	(1)
4.3 Thick-Film Resistors,	145	(4)
4.3.1 Physical Properties,	147	(2)
4.3.2 Resistor Characteristics,	149	(1)
4.4 Dielectric Inks and Pastes,	149	(3)
4.4.1 Low-K Dielectric Materials,	151	(1)
4.4.2 High-K Dielectric Materials,	151	(1)
4.5 Thick-Film Inductors,	152	(1)
References,	153	(7)
Recommended Reading,	160	(1)
5 Thick-Film Deposition Techniques	161	(19)
5.1 Thick-Film Processing,	162	(1)
5.2 Screen Printing,	163	(12)
5.2.1 Screen Printer,	166	(4)
5.2.2 Drying and Firing,	170	(5)
References,	175	(3)
Recommended Reading,	178	(2)
6 Thin-Film Fundamentals	180
6.1 Thin-Film Substrates,	182	(1)
6.1.1 Substrate Materials,	182	(1)
6.2 Physical Characteristics,	183	(5)
6.2.1 Characteristics of Substrates,	183	(2)
6.2.2 Characteristics of Metals,	185	(3)
6.3 Thin-Film Conductors,	188	(4)
6.3.1 Conductor Materials and Properties,	188	(4)
6.4 Thin-Film Resistors,	192	(9)
6.4.1 Resistor Properties,	193	(5)
6.4.2 Resistor Materials,	198	(3)
6.5 Thin-Film Capacitors,	201	(4)
6.5.1 Capacitor Properties,	201	(2)
6.5.2 Capacitor Materials,	203	(2)
6.6 Thin-Film Inductors,	205	(2)
6.7 Technologies of the Twenty-First Century,	207	(4)
References,	211	(8)
Recommended Reading,	219
7 Thin-Film Deposition Techniques	22	(222)
7.1 Physical Vapor Deposition,	221	(5)
7.1.1 Turbo Pump,	223	(1)
7.1.2 Cryogenic Pump,	224	(2)
7.2 Flash Evaporation,	226	(1)
7.3 Sputteríng,	226	(4)
7.4 Chemical Vapor Deposition,	230	(3)
7.5 Ion-Beam Deposition,	233	(1)
7.5.1 Ion-Beam Sputter Deposition,	233	(1)
7.5.2 Ion-Beam-Assisted Deposition,	234	(1)
7.6 Pulsed-Laser Deposition (Laser Ablation),	234	(1)
7.7 High-Density Plasma-Assisted Deposition,	234	(1)
7.8 Electroplating,	235	(2)
7.8.1 Electrode Electroplating,	235	(1)
7.8.2 Electroless Electroplating,	236	(1)
7.9 Sol-Gel Coating,	237	(1)
7.10 Atomic Layer Deposition,	237	(1)
7.11 Summary,	237	(1)
References,	238	(5)
Recommended Reading,	243	(1)
8 Component Assembly and Interconnections	244	(32)
8.1 Component Assembly,	244	(14)
8.1.1 Sílicon-Gold Eutectic Bonding,	245	(1)
8.1.2 Adhesive and Epoxy Bonding,	246	(3)
8.1.3 Solder Joint Bonding,	249	(6)
8.1.4 Solder Alloys,	255	(2)
8.1.5 Solder Reflow System,	257	(1)
8.1.6 Lead-Free Interconnects,	257	(1)
8.2 Interconnections,	258	(11)
8.2.1 Thermocompression Wire Bonding,	260	(1)
8.2.2 Thermosonic Wire Bonding,	261	(3)
8.2.3 Ultrasonic Wire Bonding,	264	(2)
8.2.4 Automated Single-Point Tape Automated Bonding,	266	(2)
8.2.5 Laser Wire Bonding,	268	(1)
8.2.6 Flip-Chip Bonding,	269	(1)
References,	269	(6)
Recommended Reading,	275	(1)
9 Adjustment of Passive Components	276	(24)
9.l Airbrasive Trimming,	277	(1)
9.2 Laser Trimming,	278	(5)
9.2.1 Carbon Dioxide Laser,	280	(1)
9.2.2 Yttrium-Aluminum-Garnet Laser,	281	(2)
9.3 Laser Trimming Systems,	283	(12)
9.3.1 Trimming Procedure,	288	(1)
9.3.2 Design Criteria for Resistor Trimming,	289	(6)
9.4 Definitions,	295	(1)
References,	296	(3)
Recommended Reading,	299	(1)
10 Packaging and Thermal Considerations	300	(31)
10.1 Packaging Materials,	301	(2)
10.2 Packaging Systems,	303	(10)
10.2.1 TO Packages,	304	(1)
10.2.2 Flat-Case Packages,	305	(2)
10.2.3 Chip Carriers,	307	(3)
10.2.4 Small-Outline Packages,	310	(1)
10.2.5 Systems on a Chip,	311	(1)
10.2.6 Chip-Scale Packages,	312	(1)
10.2.7 Wafer-Level Packaging,	313	(1)
10.2.8 Three-Dimensional Packaging,	313	(1)
10.3 Package Sealing,	313	(2)
10.4 Thermal Effects on Electronic Packaging,	315	(4)
10.4.1 Power Dissipation,	316	(1)
10.4.2 Thermal Design Calculations,	316	(3)
10.5 Non-Steady-State Heat Transfer Model,	319	(3)
10.5.1 Thermal Resistance inside the Substrate,	319	(1)
10.5.2 Natural Convection,	320	(1)
10.5.3 Thermal Radiation,	320	(1)
10.5.4 Thermal Resistance of Nitrogen Gas,	321	(1)
10.5.5 Heat Conduction inside the Kovar Shell,	321	(1)
10.6 Flip-Chip Technology,	322	(1)
10.7 Packaging Material Reliability,	323	(1)
References,	324	(5)
Recommended Reading,	329	(2)
11 Multichip Module and Microwave Hybrid Circuits	331
11.1 Multichip Module Circuits,	331	(13)
11.1.1 Conductor Materials,	333	(8)
11.1.2 Summary,	341	(3)
11.2 Microwave Hybrid Circuits,	344
11.2.1 Major Circuit Requirements,	346	(9)
11.2.2 Waveguides,	355	(6)
11.2.3 Transmission Lines,	361	(6)
11.2.4 Lumped Circuit Elements,	367	(1)
11.2.5 Directional Couplers,	368	(1)
11.2.6 Impedance Matching,	369	(2)
11.2.7 Microwave Integrated Circuits,	371	(4)
11.2.8 Dielectric Resonators,	375	(1)
References,	376	(9)
Glossary	385	(12)
Index	397	(1)
Index	397
1558608168
Foreword	xvii
Acknowledgements	xix
Introduction	xxi
PART I THE MODEL
1 Foundations	3	(38)
1.1 A Core Concept	4	(4)
1.1.1 Life Is a Document	4	(2)
1.1.2 Scripture	6	(1)
1.1.3 Other Forms of Documents	7	(1)
1.2 Linear Concepts	8	(3)
1.2.1 Sequence	8	(1)
1.2.2 Hierarchy	9	(2)
1.3 Nonlinear Concepts	11	(3)
1.3.1 Bags	11	(1)
1.3.2 Annotations	12	(1)
1.3.3 Cross-References	13	(1)
1.4 Document-Centric vs. Data-Centric Content	14	(1)
1.5 Document Schemata	14	(12)
1.5.1 A First Schema	15	(8)
1.5.2 Choice	23	(1)
1.5.3 Recursion	24	(2)
1.6 Grammars	26	(8)
1.6.1 Formal Grammars	27	(1)
1.6.2 Backus-Naur-Form (BNF)	28	(2)
1.6.3 Regular Sets and Regular Expressions	30	(1)
1.6.4 Trees, Hedges, and Forests	31	(3)
1.7 Regular Types	34	(7)
1.7.1 Types as Regular Expressions	35	(1)
1.7.2 Basic Composition	35	(2)
1.7.3 Basic Type Algebra	37	(1)
1.7.4 Subtypes	38	(1)
1.7.5 Generic Types	39	(1)
1.7.6 Deterministic Types	39	(2)
2 Conceptual Modeling	41	(30)
2.1 Motivation	42	(1)
2.2 Principles of Conceptual Modeling	43	(1)
2.3 Entity Relationship Diagrams	44	(3)
2.4 Reality of Conceptual Modeling	47	(1)
2.5 Introducing Asset Oriented Modeling	48	(23)
2.5.1 AOM Basics	48	(2)
2.5.2 Assets	50	(2)
2.5.3 Arcs and Clusters	52	(1)
2.5.4 Properties	53	(4)
2.5.5 Types	57	(3)
2.5.6 Inheritance	60	(2)
2.5.7 Constraints	62	(1)
2.5.8 Level 2 Structures	62	(4)
2.5.9 Models and Namespaces	66	(2)
2.5.10 Summary	68	(3)
3 Everybody Likes jazz	71	(18)
3.1 Informal Description	72	(1)
3.2 The Conceptual Model, First Draft	73	(1)
3.3 Asset or Property?	73	(3)
3.3.1 The Jazz Model	74	(2)
3.4 Normalization	76	(2)
3.5 Partitioned Normal Form	78	(2)
3.6 Resolving is a Relationships	80	(1)
3.7 Introducing Level 2 Structures	81	(8)
PART II THE IMPLEMENTATION
4 XML Basics	89	(28)
4.1 Namespaces	90	(1)
4.2 The XML Information Model	91	(10)
4.2.1 Overview	91	(2)
4.2.2 Document Node	93	(2)
4.2.3 Elements	95	(1)
4.2.4 Attributes	96	(1)
4.2.5 Processing Instructions	97	(1)
4.2.6 Unexpanded Entity Reference	97	(1)
4.2.7 Character	97	(1)
4.2.8 Comment	98	(1)
4.2.9 Document Type Declaration	98	(1)
4.2.10 Unparsed Entity	98	(1)
4.2.11 Notation	99	(1)
4.2.12 Namespace	99	(1)
4.2.13 An Example	100	(1)
4.3 XML Canonical Form	101	(4)
4.3.1 Canonical Text	101	(1)
4.3.2 Canonical Whitespace	102	(1)
4.3.3 Resolved References	102	(1)
4.3.4 Removal of Redundant Nodes	103	(1)
4.3.5 Canonical Elements	104	(1)
4.3.6 Canonical Attributes	104	(1)
4.3.7 Canonical Processing Instructions	105	(1)
4.3.8 Canonical Comments	105	(1)
4.4 The Document Type Definition (DTD)	105	(12)
4.4.1 Document	106	(1)
4.4.2 Elements	107	(2)
4.4.3 Attributes	109	(2)
4.4.4 Cross-References	111	(1)
4.4.5 Extension Mechanisms	111	(1)
4.4.6 Document Composition	112	(1)
4.4.7 Schema Composition and Reuse Mechanisms	113	(1)
4.4.8 DTD Deficiencies	114	(3)
5 XML Schema	117	(62)
5.1 An Appetizer	118	(2)
5.2 Simple Data Types	120	(19)
5.2.1 Value Space	120	(1)
5.2.2 Lexical Representations and Canonical Representation	120	(1)
5.2.3 Fundamental Facets	120	(1)
5.2.4 Built-in Primitive Data Types	121	(6)
5.2.5 Constructed Types	127	(1)
5.2.6 Extending Data Types by List	127	(1)
5.2.7 Restricted Data Types	128	(3)
5.2.8 Built-in Constructed Data Types	131	(5)
5.2.9 The Hierarchy of Built-in Primitive and Constructed Data Types	136	(1)
5.2.10 Union Types	137	(1)
5.2.11 User-Defined Data Types	138	(1)
5.3 Structure in XML Schema	139	(40)
5.3.1 Hierarchy	139	(2)
5.3.2 Elements and Complex Types	141	(2)
5.3.3 Particles and Model Groups	143	(6)
5.3.4 Cardinality Constraints	149	(1)
5.3.5 Default Values and Fixed Values	150	(1)
5.3.6 Mixed Content	150	(2)
5.3.7 Simple Content	152	(1)
5.3.8 Complex Content	153	(3)
5.3.9 Type Hierarchies	156	(1)
5.3.10 Empty Elements	156	(3)
5.3.11 Attributes	159	(1)
5.3.12 Global and Local Types	160	(1)
5.3.13 Global Elements and Attributes	161	(1)
5.3.14 Recursive Structures	162	(6)
5.3.15 Wildcards	168	(1)
5.3.16 Nullability	169	(1)
5.3.17 Uniqueness, Keys, Reference	170	(6)
5.3.18 Deterministic Types	176	(3)
6 Authoring XML Schema	179	(36)
6.1 Namespaces	180	(4)
6.1.1 Target Namespace	180	(1)
6.1.2 Qualified and Unqualified Names	180	(2)
6.1.3 Wildcards	182	(1)
6.1.4 Schema Default Namespace	183	(1)
6.2 Reuse Mechanisms	184	(6)
6.2.1 Global Elements and Global Types	184	(1)
6.2.2 Groups	185	(1)
6.2.3 Attribute Groups	186	(1)
6.2.4 Instance Type Overriding	186	(2)
6.2.5 Substitution Groups	188	(2)
6.3 Schema Composition	190	(6)
6.3.1 The Schema Clause	190	(1)
6.3.2 Locating Schemata	191	(1)
6.3.3 Include	191	(1)
6.3.4 Redefine	192	(2)
6.3.5 Import	194	(1)
6.3.6 Notation	195	(1)
6.3.7 Annotations	195	(1)
6.4 Usage Patterns	196	(19)
6.4.1 Chameleon Components and Type Libraries	197	(3)
6.4.2 Defining Schema Families	200	(15)
7 Relax NG	215	(34)
7.1 Structure	216	(10)
7.1.1 The Relax NG Data Model	216	(1)
7.1.2 Elements and Attributes	216	(1)
7.1.3 Model Groups and Particles	217	(6)
7.1.4 Empty and not Allowed	223	(1)
7.1.5 Annotations	224	(1)
7.1.6 Default and Fixed Values	225	(1)
7.2 Types, Grammars, Patterns 226
7.2.1 Data Types in Relax NG	226	(2)
7.2.2 Grammars and Named Patterns	228	(5)
7.2.3 External Patterns and Grammars	233	(7)
7.2.4 Keys and Key References	240	(1)
7.3 Namespaces and Name Classes	241	(8)
7.3.1 Namespaces	241	(2)
7.3.2 Name Classes and Wildcards	243	(3)
7.3.3 Comparison with DTDs	246	(1)
7.3.4 Comparison with XML Schema	246	(1)
7.3.5 Tool Support for Relax NG	247	(2)
8 From Conceptual Model to Schema	249	(74)
8.1 A Knowledge Base	250	(8)
8.1.1 Jazz Musicians	250	(3)
8.1.2 Styles	253	(1)
8.1.3 Collaborations	253	(1)
8.1.4 Albums	254	(3)
8.1.5 Reviews	257	(1)
8.1.6 Critics	257	(1)
8.2 Implementation in XML Schema	258	(33)
8.2.1 Design Options	258	(1)
8.2.2 Business Objects	258	(2)
8.2.3 Creating a Type Library	260	(2)
8.2.4 Handling Inheritance	262	(3)
8.2.5 The Complete Type Library	265	(6)
8.2.6 Implementing a Business Object	271	(6)
8.2.7 Dealing with Cross-References	277	(3)
8.2.8 Using Substitution Groups	280	(4)
8.2.9 Implementing Clusters	284	(3)
8.2.10 Business Objects critic and style	287	(4)
8.3 Implementation in Relax NG	291	(27)
8.3.1 Creating a Type Library	291	(1)
8.3.2 Handling Inheritance	292	(4)
8.3.3 The Complete Type Library	296	(8)
8.3.4 Implementing a Business Object	304	(4)
8.3.5 Dealing with Cross-References	308	(3)
8.3.6 Resolving Multiple Display Labels	311	(3)
8.3.7 Implementing Clusters	314	(2)
8.3.8 Business Objects critic and style	316	(2)
8.4 Summary	318	(5)
8.4.1 Synopsis of Implementation Steps	318	(2)
8.4.2 Remarks	320	(3)
9 Validation beyond XML Schema	323	(42)
9.1 About Meaning	324	(1)
9.2 Constraints	324	(13)
9.2.1 Constraints in XML Schema	327	(3)
9.2.2 Constraints beyond XML Schema	330	(7)
9.3 Constraints in Conceptual Models	337	(4)
9.4 Validation of General Constraints	341	(19)
9.4.1 Hard-Coded Constraint Checks	341	(3)
9.4.2 XSLT	344	(4)
9.4.3 Schematron	348	(12)
9.5 An XML Processing Model	360	(2)
9.6 A Framework for Schema Languages	362	(3)
PART III THE ENVIRONMENT
10 Reality Check: The World Is Object-Oriented	365	(30)
10.1 Object-Oriented Implementations of the XML Data Model	366	(1)
10.2 Encapsulation and Behavior	367	(2)
10.3 Class, Instance, Type	369	(4)
10.3.1 Class Hierarchies	369	(1)
10.3.2 Type Hierarchies Based on Behavior	369	(1)
10.3.3 Type Hierarchies Based on Syntax	370	(1)
10.3.4 Object-Oriented Types vs. XML Types	370	(3)
10.4 Simple Types	373	(4)
10.4.1 String Data Types	374	(1)
10.4.2 Binary Data Types	374	(1)
10.4.3 The Boolean Data Type	374	(1)
10.4.4 Exact Numeric Types	374	(1)
10.4.5 Approximate Numeric Types	375	(1)
10.4.6 Date and Time	375	(1)
10.4.7 Other Data Types	376	(1)
10.4.8 Type Restrictions	376	(1)
10.4.9 Type Extensions	376	(1)
10.4.10 Null Values	376	(1)
10.4.11 Implementing a Type Hierarchy	377	(1)
10.5 Complex Types	377	(10)
10.5.1 Hierarchy	377	(4)
10.5.2 Sequence	381	(2)
10.5.3 Repetition	383	(1)
10.5.4 Choice	384	(1)
10.5.5 Recursion	385	(1)
10.5.6 Global and Local Elements	386	(1)
10.6 Global Types	387	(1)
10.7 Inheritance	388	(1)
10.8 Polymorphism	389	(1)
10.9 Dynamic Marshaling	389	(1)
10.10 Constraints	390	(3)
10.10.1 Simple Types	390	(1)
10.10.2 Cross-References	391	(1)
10.10.3 When to Check	391	(1)
10.10.4 Conceptual Constraints	391	(1)
10.10.5 Automatic Code Generation	392	(1)
10.11 Identity	393	(1)
10.12 Visibility	394	(1)
11 Reality Check: The World Is Relational	395	(50)
11.1 Motivation	396	(1)
11.2 Databases	396	(1)
11.3 The Relational Data Model	397	(1)
11.4 The Relational Algebra	398	(3)
11.5 Normalization	401	(14)
11.5.1 Defining the Target Format	402	(1)
11.5.2 The Original Schema	403	(2)
11.5.3 Steamrolling the Schema	405	(1)
11.5.4 Introducing Key Relationships	406	(4)
11.5.5 Preserving Sequential Order	410	(4)
11.5.6 Recomposing Original Document Nodes	414	(1)
11.6 Brief Introduction to SQL	415	(6)
11.6.1 Queries	415	(3)
11.6.2 Table Creation	418	(1)
11.6.3 Table Modification	418	(1)
11.6.4 Views	419	(1)
11.6.5 SQL-99	419	(2)
11.7 Simple Data Types	421	(3)
11.7.1 String Data Types	421	(1)
11.7.2 Binary Data Types	422	(1)
11.7.3 The Boolean Data Type	422	(1)
11.7.4 Exact Numeric Types	422	(1)
11.7.5 Approximate Numeric Types	422	(1)
11.7.6 Date and Time	423	(1)
11.7.7 Other Data Types	423	(1)
11.7.8 Type Restrictions	423	(1)
11.7.9 Type Extensions	424	(1)
11.7.10 Null Values	424	(1)
11.8 Complex Types	424	(6)
11.8.1 Hierarchy	424	(2)
11.8.2 Sequence	426	(2)
11.8.3 Choice	428	(2)
11.8.4 Recursion	430	(1)
11.9 Constraints	430	(1)
11.10 From Relational Tables to XML Schema	431	(2)
11.11 Mediation between RDBMS and XML Databases	433	(12)
11.11.1 Tamino X-Node	433	(11)
11.11.2 Experanto	444	(1)
12 Schema Evolution	445	(26)
12.1 Derived Types	446	(8)
12.1.1 Schema-Conservative Evolution	446	(1)
12.1.2 Using Chameleon Components	447	(3)
12.1.3 Creating Derived Schemata	450	(1)
12.1.4 Dialecting with Substitution Groups	451	(2)
12.1.5 Inhibiting Change	453	(1)
12.2 Authoring for Redefinition	454	(11)
12.2.1 Adding an Attribute to a Simple Type Element	455	(2)
12.2.2 Appending Child Nodes to Nested Structures	457	(2)
12.2.3 Inserting Elements at an Arbitrary Position	459	(2)
12.2.4 Allowing Choices	461	(3)
12.2.5 Conservative Schema Modification	464	(1)
12.3 Open Content Model	465	(2)
12.4 Versioning	467	(4)
13 Schemata in Large Environments	471	(20)
13.1 Combining Diverse Schemata	472	(15)
13.1.1 The Problem	472	(1)
13.1.2 Model Fusion	472	(3)
13.1.3 Combining Document Instance Sets	475	(4)
13.1.4 Schema-Driven View Definition	479	(1)
13.1.5 Embedded Queries	480	(6)
13.1.6 Model-Driven Schema Mediation	486	(1)
13.2 Centralized and Decentralized Change Management	487	(4)
13.2.1 Decentralized Change Management of Document Instances	488	(1)
13.2.2 Decentralized Change Management of Document Schemata	488	(3)
14 Outlook	491	(4)
14.1 Integration of Core Technologies	492	(1)
14.2 Grammar-Driven Data Models	492	(3)
14.2.1 XML as a Mainstream Technology	493	(2)
Appendix	495	(4)
Glossary	499	(4)
Bibliography	503	(4)
Index	507	(28)
About the Author	535