High-Speed VLSI Interconnections

by Goel, Ashok K.

• ISBN13: 9780471780465
• ISBN10: 0471780464
• Edition: 2nd
• Format: Hardcover
• Copyright: 2007-09-17
• Publisher: Wiley-IEEE Press

Summary

This Second Edition focuses on emerging topics and advances in the field of VLSI interconnections In the decade since High-Speed VLSI Interconnections was first published, several major developments have taken place in the field. Now, updated to reflect these advancements, this Second Edition includes new information on copper interconnections, nanotechnology circuit interconnects, electromigration in the copper interconnections, parasitic inductances, and RLC models for comprehensive analysis of interconnection delays and crosstalk. Each chapter is designed to exist independently or as a part of one coherent unit, and several appropriate exercises are provided at the end of each chapter, challenging the reader to gain further insight into the contents being discussed. Chapter subjects include: * Preliminary Concepts * Parasitic Resistances, Capacitances, and Inductances * Interconnection Delays * Crosstalk Analysis * Electromigration-Induced Failure Analysis * Future Interconnections High-Speed VLSI Interconnections, Second Edition is an indispensable reference for high-speed VLSI designers, RF circuit designers, and advanced students of electrical engineering.

Author Biography

AShok k. Goel, PhD, is Associate Professor of Electrical Engineering at Michigan Technological University. He is the author of more than thirty journal publications and numerous conference proceedings. His research interests include nanotechnology circuit design, high-speed VLSI interconnections, device physics and modeling, and semiconductor TCAD.

Table of Contents

Preface

Preliminary Concepts and More

Interconnections for VLSI Applications

Metallic Interconnections - Multilevel, Multilayer and Multipath Configurations

Optical Interconnections

Superconducting Interconnections

Copper Interconnections

Advantages of Copper Interconnections

Challenges Posed by Copper Interconnections

Fabrication Processes for Copper Interconnections

Damascene Processing of Copper Interconnections

Method of Images

Method of Moments

Even and Odd Mode Capacitances

Two Coupled Conductors

Three Coupled Conductors

Transmission Line Equations

Miller's Theorem

Inverse Laplace Transformation

A Resistive Interconnection as a Ladder Network

Open Circuit Interconnection

Short Circuited Interconnection

Application of the Ladder Approximation to a Multipath Interconnection

Propagation Modes in a Microstrip Interconnection

Slow-Wave Mode Propagation

Quasi-TEM Analysis

Comparison with Experimental Results

Propagation Delays

Exercises

References

Parasitic Resistances, Capacitances and Inductances

Parasitic Resistances - General Considerations

Parasitic Capacitances - General Considerations

Parallel Plate Capacitance

Fringing Capacitances

Coupling Capacitances

Parasitic Inductances - General Considerations

Self and Mutual Inductances

Partial Inductances

Methods for Inductance Extraction

Effect of Inductances on Interconnection Delays

Approximate Formulas for Capacitances

Single Line on a Ground Plane

Two Lines on a Ground Plane

Three Lines on a Ground Plane

Single Plate with Finite Dimensions on a Ground Plane

The Green's Function Method - Using Method of Images

Green's Function Matrix for Interconnections Printed on the Substrate

Green's Function Matrix for Interconnections Embedded in the Substrate

Application of the Method of Moments

Even and Odd Mode Capacitances

Ground and Coupling Capacitances

The Program IPCSGV

Parametric Dependence of Interconnection Capacitances

The Green's Function Method - Fourier Integral Approach

Green's Function for Multilevel Interconnections

Multiconductor Interconnection Capacitances

Piecewise Linear Charge Distribution Function

Calculation of Interconnection Capacitances

The Network Analogue Method

Representation of Subregions by Network Analogues

Diagonalized System for Single Level Interconnections

Diagonalized System for Multilevel Interconnections

Interconnection Capacitances and Inductances

The Program "ICIMPGV"

Parametric Dependence of Interconnection Capacitances

Parametric Dependence of Interconnection Inductances

Simplified Formulas for Interconnection Capacitances and Inductances on Silicon and GaAs Substrates

Line Capacitances and Inductances

Coupling Capacitances and Inductances

Inductance Extraction Using FastHenry

The Program "FastHenry"

Extraction Results Using FastHenry

Copper Interconnections - Resistance Modeling

Effect of Surface/Interface Scattering on the Interconnection Resistivity

Effect of Diffusion Barrier on the Interconnection Resistivity

Electrode Capacitances in a GaAs MESFET - An

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