Industrial Plasma Engineering: Volume 2 - Applications to Nonthermal Plasma Processing

by Reece Roth; J

• ISBN13: 9780750305457
• ISBN10: 0750305452
• Edition: 1st
• Format: Nonspecific Binding
• Copyright: 2001-08-25
• Publisher: CRC Press

Summary

Volume 2 describes nonthermal plasma-related processes and devices of commercial interest, for senior undergraduate or first-year graduate students from engineering and physical science disciplines. Softcover. Hardcover available.

Table of Contents

Contents, Volume 1: Principles	viii
Preface to Volume 2	ix
Surface Interactions in Plasma Processing	1	(36)
Industrial Plasma Processing	1	(5)
Plasma Active Species	6	(3)
Heterogeneous Interactions with Surfaces	9	(6)
Secondary Electron Emission	15	(2)
Sputtering	17	(14)
Ion Implantation in Solids	31	(6)
References	35	(2)
Atmospheric Pressure Plasma Sources	37	(37)
Characteristics of Industrial Plasma Sources	38	(8)
Atmospheric Pressure Corona Sources	46	(4)
Atmospheric Dielectric Barrier Discharges (DBDs)	50	(5)
The One Atmosphere Uniform Glow Discharge Plasma (OAUGDP)	55	(10)
Arcjet Plasma Sources	65	(4)
Inductively Coupled Plasma Torches	69	(5)
References	72	(2)
Vacuum Plasma Sources	74	(39)
Intermediate-Pressure Plasma Sources	74	(19)
Low-Pressure Plasma Sources	93	(15)
High-Vacuum Plasma Sources	108	(1)
Summary of Plasam Source Parameters	109	(4)
References	110	(3)
Plasma Reactors for Plasma Processing	113	(83)
Plasma Reactors for Surface Treatment	115	(24)
Plasma Reactors for Ion Implantation	139	(7)
Reactors for Ion-Beam-Induced Sputter Deposition	146	(6)
Plasma/Cathode Sputter Deposition Reactors	152	(15)
Reactors for Plasma Chemical Vapor Deposition	167	(12)
Plasma Etching Reactors	179	(17)
References	193	(3)
Specialized Techniques and Devices for Plasma Processing	196	(44)
Vacuum System Operation	196	(4)
Workpiece Current Collection	200	(5)
Remote Exposure Configurations	205	(6)
Motional Averaging to Achieve Uniformity of Effect	211	(8)
Gas Flow Distribution	219	(6)
Electrohydrodynamic (EHD) Flow Control	225	(15)
References	239	(1)
Parametric Plasma Effects On Plasma Processing	240	(44)
The Role of the Plasma	240	(3)
Kinetic Parameters of Plasma Processing	243	(6)
RF Power Coupling	249	(6)
Sheath Thickness Above Workpiece	255	(8)
RF Sheath Phenomenology	263	(8)
Formation of Active Species	271	(6)
The Effect of Electron Magnetization on Active-Species Concentration	277	(7)
References	283	(1)
Diagnostics for Plasma Processing	284	(51)
Experimental Parameters	284	(2)
Gas-Phase Process Monitoring	286	(9)
Plasma Diagnostics	295	(18)
Measurement of Surface Topography	313	(2)
Measurement of Surface Composition	315	(3)
Surface Energy Related Diagnostics	318	(7)
Measurement of Electrical Properties	325	(3)
In Situ Process Monitoring	328	(4)
Endpoint Detection	332	(3)
References	333	(2)
Plasma Treatment of Surfaces	335	(64)
Objectives of Plasma Surface Treatment	335	(6)
Passive Plasma Cleaning	341	(11)
Active Plasma Cleaning	352	(8)
Plasma Sterilization	360	(9)
Treatment of Thin Films	369	(7)
Treatment of Polymeric or Organic Solids	376	(7)
Treatment of Fabrics and Fibers	383	(16)
References	396	(3)
Surface Modification by Implantation and Diffusion	399	(52)
Ion Implantation Technology	399	(4)
Ion Implantation Dose and Depth Profiles	403	(8)
Ion-Beam Implantation	411	(10)
Plasma Ion Implantation	421	(22)
Low-Energy Plasma Thermal Diffusion Treatment	443	(8)
References	448	(3)
Thin-Film Deposition by Evaporative Condensation and Sputtering	451	(51)
Applications of Thin Films	451	(10)
Thin-Film Characteristics	461	(10)
Deposition by Evaporative Condensation	471	(6)
Ion-Beam Sputter Deposition	477	(13)
Plasma-Assisted Ion-Beam Sputter Deposition	490	(5)
Plasma/Cathode Sputter Deposition	495	(4)
Quality Issues in Sputter Deposition	499	(3)
References	500	(2)
Plasma Chemical Vapor Deposition (PCVD)	502	(38)
Thin-Film Deposition by PCVD	502	(8)
Physical and Chemical Processes in PCVD Glow Discharges	510	(7)
Characteristics of Polymeric Thin Films Formed by PCVD	517	(11)
Glow Discharge Polymerization	528	(3)
Glow Discharge Reactors for PCVD	531	(6)
Summary of Deposition Reactor Plasma Parameters	537	(3)
References	538	(2)
Plasma Etching	540	(74)
Survey of Plasma Etching	540	(11)
Pattern Transfer by Plasma-Related Etching	551	(22)
Control Variables for Plasma Etching	573	(5)
The Chemistry of Plasma Etching	578	(19)
Plasma Etching of Microeletronic Materials	597	(8)
Technical Issues in Plasma Etching	605	(9)
References	612	(2)
Appendices	614	(14)
A Nomenclature	614	(9)
B Physical Constants	623	(1)
C Units and Conversion Factors	624	(2)
D Useful Formulae	626	(2)
Index	628