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9781439865972

Introduction to Microsystem Packaging Technology

by ; ;
  • ISBN13:

    9781439865972

  • ISBN10:

    1439865973

  • Format: Nonspecific Binding
  • Copyright: 2017-12-19
  • Publisher: Taylor & Francis

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Summary

The multi-billion-dollar microsystem packaging business continues to play an increasingly important technical role in today's information industry. The packaging process'”including design and manufacturing technologies'”is the technical foundation upon which function chips are updated for use in application systems, and it is an important guarantee of the continued growth of technical content and value of information systems.Introduction to Microsystem Packaging Technology details the latest advances in this vital area, which involves microelectronics, optoelectronics, RF and wireless, MEMS, and related packaging and assembling technologies. It is purposefully written so that each chapter is relatively independent and the book systematically presents the widest possible overview of packaging knowledge.Elucidates the evolving world of packaging technologies for manufacturingThe authors begin by introducing the fundamentals, history, and technical challenges of microsystems. Addressing an array of design techniques for packaging and integration, they cover substrate and interconnection technologies, examples of device- and system-level packaging, and various MEMS packaging techniques. The book also discusses module assembly and optoelectronic packaging, reliability methodologies and analysis, and prospects for the evolution and future applications of microsystems packaging and associated environmental protection.With its research examples and targeted reference questions and answers to reinforce understanding, this text is ideal for researchers, engineers, and students involved in microelectronics and MEMS. It is also useful to those who are not directly engaged in packaging but require a solid understanding of the field and its associated technologies.

Table of Contents

Introduction
What are Microsystems
Related Fundamentals of Microsystems
What is Microsystems Packaging
What is Microelectronics Packaging
History of Microelectronics Packaging
Status and Function of Microsystems Packaging Technology
Technical Challenges in Microsystems Packaging
Design Technique for Microsystems Packaging and Integration
Electrical Design
Thermal Management Design
Mechanical Design
Microfluidic Design
Multi-disciplinary Design
Substrate Technology
Organic Substrate
Ceramic Substrates
Introduction of Typical Ceramic Substrates
LTCC Substrates
Advanced Substrates
Interconnection Technology
Braze-Welding Technology
Wire Bonding Technology
Tape Automated Bonding Technology
Flip-Chip Bonding Technology
Chip Interconnection in System-level Packaging
Advanced interconnection
Device Level Package
Metal Package
Plastic Package
Ceramic Package
Typical Examples of Device-level Package
Development Prospect
MEMS Packaging
Function of MEMS Packaging
Device Level Package for MEMS
Wafer Level Package for MEMS
Sealing Techniques
Thin Film Encapsulation
Vacuum Packaging for MEMS
Case StudyA 3D Wafer Level Hermetical Packaging for MEMS
Module Assembly and Optoelectronic Packaging
Surface Mount Technology
Packaging of Flat Panel Display Modules
Optoelectronic Packaging
System Level Packaging Technology
Overview
System on Chip Technology
System in Package Technology
RF System Package Technology
Reliability
Fundamentals of Reliability Methodology
Wafer and Packaging-related Failure Mode and Mechanisms
Reliability Qualification and Analysis
Summary
Prospects for Microsystems Packaging Technology
Evolvement of Packaging Materials
Evolvement and Application of Packaging Technologies
Evolution of Packaging Technologies and Environmental Protection
Conclusion Remarks
References
Table of Contents provided by Publisher. All Rights Reserved.

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